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本文(DLA SMD-5962-88582 REV B-2006 MICROCIRCUIT LINEAR BIPOLAR HEX NTDS RECEIVER MONOLITHIC SILICON《硅单片双极十六进制NTDS接收器线性微电路》.pdf)为本站会员(towelfact221)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-88582 REV B-2006 MICROCIRCUIT LINEAR BIPOLAR HEX NTDS RECEIVER MONOLITHIC SILICON《硅单片双极十六进制NTDS接收器线性微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R113-92. 92-02-26 Michael A. Frye B Incorporate revision A N.O.R. Update drawing to current requirements. - drw 06-12-11 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV S

2、HET REV STATUS REV B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY M

3、ichael A. Frye MICROCIRCUIT, LINEAR, BIPOLAR HEX NTDS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-03-23 RECEIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88582 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E137-07 Provided by IHSNot for ResaleNo repr

4、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 complia

5、nt, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88582 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type.

6、 The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 MOH0272C Hex NTDS receiver 1/ 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or

7、CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . V+ = +7 V dc; V- = -16 V dc Input voltage range -17 V dc (

8、V- = -16 V dc) Storage temperature range -65C to +150C Power dissipation (PD) . 500 mW 2/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +175C Output current +5 mA 1.4 Recommended operating conditions. Supply volta

9、ge (V+). +4.5 V dc to +5.5 V dc (V-) -16.0 V dc to -13.5 V dc (slow) (V-) -5.5 V dc to -4.5 V dc (fast) Ambient operating temperature range (TA) -55C to +125C Minimum high level input voltage (VIH): (Slow). -4.5 V dc (Fast) -1.1 V dc Maximum low level input voltage (VIL): (Slow). -15.0 V dc (Fast) -

10、5.0 V dc _ 1/ This circuit was designed to be compatible with Naval Tactical Data Systems (NTDS) of MIL-STD-1397 “Standard Digital Navy Systems, Input-Output Interfaces”, interfacing between TTL logic levels and those employed in Navy computers. The applicable specifications are designed in this dra

11、wing. 2/ Derate above TA= +90C, 8.33 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPL

12、ICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPART

13、MENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDB

14、K-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phil

15、adelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has bee

16、n obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and

17、qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Q

18、uality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required t

19、o identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Term

20、inal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 E

21、lectrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2

22、 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C”

23、shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction o

24、r networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C V+ = 4.5 V

25、 to 5.5 V Group A subgroups Device type Limits Unit V- = -16.0 V to -13.5 V (slow) V- = -5.5 V to -4.5 V (fast) Min Max Power supply current ICC+ No load, input ground 1, 2, 3 01 3.0 mA Power supply current ICC- No load, input ground 1, 2, 3 01 -5.0 mA Low level output voltage VOLVIN= -7.5 V (NTDS s

26、low), VIN= -1.9 V (NTDS fast), IOL= 4.2 mA 1, 2, 3 01 0.8 V High level output voltage VOHVIN= -4.5 V (NTDS slow), VIN= -1.1 V (NTDS fast), IOH= -2.0 mA 1, 2, 3 01 2.4 V High level input current IIHVIH= -4.5 V (NTDS slow), VIH= -1.1 V (NTDS fast) 1, 2, 3 01 0.5 mA Low level input current IILVIL= -7.5

27、 V (NTDS slow), VIL= -1.9 V (NTDS fast) 1, 2, 3 01 -0.05 mA Propagation delay time, low to high tPLHSee figures 2 and 3 9, 10, 11 1/ 01 500 ns Propagation delay time, high to low tPHLSee figures 2 and 3 9, 10, 11 1/ 01 250 ns 1/ Guaranteed to the limits specified, if not tested. Provided by IHSNot f

28、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F 2 Terminal number Terminal symbol

29、 1 NC NC 2 IN 1 NC 3 OUT 1 IN 1 4 IN 2 OUT 1 5 OUT 2 IN 2 6 IN 3 NC 7 OUT 3 OUT 2 8 GND IN 3 9 V- OUT 3 10 OUT 4 GND 11 IN 4 NC 12 OUT 5 V- 13 IN 5 OUT 4 14 OUT 6 IN 4 15 IN 6 OUT 5 16 V+ NC 17 - - - IN 5 18 - - - OUT 6 19 - - - IN 6 20 - - - V+ FIGURE 1. Terminal connections. Provided by IHSNot for

30、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 FIGURE 2. Test circuit. NOTES: 1. For NTDS slow, VT= -6.0 V, VIL= -15 V

31、For NTDS fast, VT= -1.5 V, VIL= -5 V 2. Input is 100 KHz square wave FIGURE 3. AC waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI

32、SION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as a

33、n approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircu

34、its delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable re

35、quired documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with meth

36、od 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C. The test circuit shall be maintained by the manufacturer under document revision le

37、vel control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and

38、 final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883,

39、method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroup

40、s 10 and 11, if not tested, shall be guaranteed to the limits specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88582 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVE

41、L B SHEET 8 DSCC FORM 2234 APR 97 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as speci

42、fied in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test c

43、ondition C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance

44、with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES

45、6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a cont

46、ractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. M

47、ilitary and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of draw

48、ings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-

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