DLA SMD-5962-88585 REV C-2008 MICROCIRCUIT HYBRID LINEAR MIL-STD-1553 BUS CONTROLLER RTU AND MONITOR UNIT.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 02. Added footnote 9 to table I for IIL3, IIL4, IIH3, and IIH4. Figure 1; Made corrections to case outlines X and Y. Redrew entire document. -sld 01-12-10 Raymond Monnin B Figure 1, case outline X; corrected the dimension L in t

2、he conversion table from .024 (0.61 mm) min and .026 (0.66 mm) max to .240 (6.10 mm) min and .260 (6.60 mm) max. -sld 02-02-25 Raymond Monnin C Update drawing. -gz 08-04-15 Robert M. Heber THE ORIGINAL FIRST SHEET OF THIS DOCUMENT HAS BEEN REPLACED REV SHEET REV C C C C C C C C C C SHEET 15 16 17 18

3、 19 20 21 22 23 24 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Robert M. Heber DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAI

4、LABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, HYBRID, LINEAR, MIL-STD-1553 BUS CONTROLLER, RTU, AND MONITOR UNIT AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-12-20 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88585 SHEET 1 OF 24 DSCC FORM 2

5、233 APR 97 5962-E239-08Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This dr

6、awing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example:

7、5962-88585 01 X X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 BUS-65600, CT2565 MIL-STD-1553, BUS controller, RTU, and monitor

8、 unit 02 CT2565-001 MIL-STD-1553, BUS controller, RTU, and monitor unit 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 78 Dual-in-line Y See figure 1 82 Flat pack 1.2.3 Lead fin

9、ish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc Input voltage range (VIN) . GND -0.3 V dc to VCC+0.3 V dc Supply current (ICC) . 70 mA 2/ Power dissipation (PD). 385 mW 2/ Storage temperature range . -6

10、5C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal rise, junction-to-case (TJ) +5C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc to 5.5 V dc Minimum logic high input voltage (VIH) 2.4 V dc Maximum logic low input voltage (VIL). 0.7 V dc Case operating

11、temperature range (TC) -55C to 125C Operating frequency (FOP). 12.0 MHz 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Applies up to TC= +125C with all outputs open.

12、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specificati

13、on, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534

14、 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1553 - Aircraft Internal Time Division Command/Response Multiplex Data Bus. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTME

15、NT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Ro

16、bbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unle

17、ss a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device ma

18、nufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition,

19、the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). Th

20、e case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Timing diagram(s). The timing diagram(s) shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherw

21、ise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596

22、2-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking

23、of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufa

24、cturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if

25、any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to

26、this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided wit

27、h each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect t

28、he form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TAB

29、LE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups 1/ Device types Limits Unit Min Max Supply current ICCVCC= 5.5 V, FIN= 12 MHz, measured at pin 20 for case outline X and pin 40 for case outline Y with all outputs open 1,

30、2, 3 01,02 70 mA High level output voltage 2/ VOH1IOH= -5.2 mA 1,2,3 01,02 2.7 High level output voltage 3/ VOH2IOH= -40 A 1,2,3 01,02 2.7 High level output voltage 4/ VOH3 VCC= 4.5 V, VIH= 2.5 V, VIL= 0.4 V IOH= -80 A 1,2,3 01,02 2.7 V Low level output voltage 2/ VOL1IOL= 5.2 mA 1,2,3 01,02 0.4 Low

31、 level output voltage 3/ VOL2 OL= 1.6 mA 1,2,3 01,02 0.4 Low level output voltage 4/ VOL3 VCC= 4.5 V, VIH= 2.5 V, VIL= 0.4 V IOL= 2.4 mA 1,2,3 01,02 0.4 V High level input current 5/ IIH1 1,2,3 01,02 -20 +20 High level input current 6/ IIH21,2,3 01,02 -10 +10 High level input current 7/ IIH39/ 1,2,3

32、 01,02 0.0 -250 High level input current 8/ IIH49/ VCC= 5.5 V, VIN= 2.5 V 1,2,3 01,02 0.0 -800 A Low level input current 5/ IIL1 1,2,3 01,02 -20 +20 A Low level input current 6/ IIL21,2,3 01,02 -10 +10 Low level input current 7/ IIL39/ 1,2,3 01,02 0.0 -500 Low level input current 8/ IIL49/ VCC= 5.5

33、V, VIN= 0.4 V 1,2,3 01,02 0.0 1.6 mA Functional tests 10/ VCC= 4.5 V, VIH= 2.5 V, VIL= 0.4 V, fIN= 12 MHz 7,8 01,02 Pass/ fail Maximum clock frequency fMAX50% duty cycle 11/ 9,10,11 01,02 12.0 MHz DELAY TIMING BUSGRNT delay, CMD word td19,10,11 01,02 1.5 s BUSGRNT delay, TX data word td29,10,11 01,0

34、2 15.5 s BUSGRNT delay, RX data td39,10,11 01,02 2.33 s BUSGRNT to BUSACK delay (RTU handshake) td4VCC= 4.5 V, VIH= 2.5 V, VIL= 0.4 V, fIN= 12 MHz, See figure 3 11/ 12/ 9,10,11 01,02 250 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without li

35、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Grou

36、p A subgroups 1/ Device types Limits Unit Min Max DELAY TIMING - CONTINUED BUSACK to OE delay td59,10,11 01,02 25 ns OE to CS delay td69,10,11 01,02 25 ns CS to ADRINC delay td79,10,11 01,02 110 ns BUSACK to WR delay ( BC write) td89,10,11 01,02 300 378 ns WR to CS delay td99,10,11 01,02 25 ns NBGRN

37、T to LMC, WC, T/ R delay td109,10,11 01,02 500 667 ns LMC toILLCMD latch tD119,10,11 01,02 250 ns NBGRNT toINCMD delay tD129,10,11 01,02 0.9 1.1 s BUSACK to SOM delay tD139,10,11 01,02 140 190 ns NBGRNT low to status latch tD149,10,11 01,02 2.5 3.5 s CS to ADRINC delay (RTU read) tD159,10,11 01,02 1

38、10 ns BUSACK to WR delay (RTU write) tD169,10,11 01,02 140 225 ns WR to CS delay (RTU write) tD179,10,11 01,02 25 ns BUSREQ to BUSGRNT delay tD189,10,11 01,02 2.0 s BUSGRNT to BUSACK delay (MT transfer) tD199,10,11 01,02 250 ns BUSACK to WR delay (MT transfer) tD20VCC= 4.5 V, VIH= 2.5 V, VIL= 0.4 V,

39、 fIN= 12 MHz, See figure 3 11/ 12/ 9,10,11 01,02 300 378 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISI

40、ON LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups 1/ Device types Limits Unit Min Max PULSE WIDTH TIMING BUSREQ pulse width (RTU handshake) tPW19,10,11 01,02 667 ns B

41、USACK pulse width (RTU handshake) tPW29,10,11 01,02 475 600 ns CS , ( OE ) pulse width (BC read) tPW39,10,11 01,02 640 690 ns ADRINC pulse width tPW49,10,11 01,02 60 110 ns CS and WR pulse width (BC write) tPW59,10,11 01,02 140 190 ns NBGRNT pulse width tPW69,10,11 01,02 140 190 ns SOM pulse width t

42、PW79,10,11 01,02 140 190 ns CS , OE , and BUSACK pulse width (RTU read) tPW89,10,11 01,02 475 600 ns CS and WR pulse width (RTU write) tPW99,10,11 01,02 140 190 ns BUSREQ pulse width (BC handshake) tPW109,10,11 01,02 752 ns BUSGRNT pulse width (BC handshake) tPW119,10,11 01,02 250 ns BUSACK pulse wi

43、dth (BC handshake) tPW129,10,11 01,02 640 690 ns BUSGRNT pulse width (MT transfer) tPW13VCC= 4.5 V, VIH= 2.5 V, VIL= 0.4 V, fIN= 12 MHz, See figure 3 10/ 12/ 9,10,11 01,02 250 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

44、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgrou

45、ps 1/ Device types Limits Unit Min Max SET-UP TIMING BC read data set-up time tS1 9,10,11 01,02 250 ns BC write data valid set-up time tS29,10,11 01,02 100 CMD valid set-up time tS39,10,11 01,02 100 ns RTU read data set-up time tS49,10,11 01,02 166 RTU write data valid set-up prior to leading edge o

46、f WR tS59,10,11 01,02 100 ns ID word valid set-up time tS6VCC= 4.5 V, VIH= 2.5 V, VIL= 0.4 V, fIN= 12 MHz, See figure 3 10/ 12/ 9,10,11 01,02 100 ns See footnotes on next page. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA

47、WING SIZE A 5962-88585 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43219-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ All Group A subgroup testing may be performed concurrently. 2/ Measured at the following pins: Case X: Pins 1

48、4, 21 - 28, 54, and 60 - 67. Case Y: Pins 28, 29, and 66 - 81. 3/ Measured at the following pins: Case X: Pins 3 - 5, 9, 12, 13, 15 -19, 29, 30, 42 - 44, 46, 49, 51 - 53, 55, 57, 59, 68, 71, 75, and 78. Case Y: Pins 5 - 10, 18, 23 - 27, 30 - 32, 34 - 36, 38, 39, 44, 50, 58, and 63 - 65. 4/ Measured at the following pins: Case X: Pins 31, 37, 69, and 76. Case Y: Pins 48, 49, 61, and 62. 5/ Measured at the following pins: Case X: Pins 1 and 45. Case Y: Pins 2 and 11. 6/ M