DLA SMD-5962-88641 REV C-2009 MICROCIRCUIT LINEAR UNIVERSAL DUAL FILTER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Make changes to 1.2.1, table I, figure 1, figure 2, figure 3, and figure 4. 94-01-07 M. A. FRYE B Drawing updated to reflect current requirements. - ro 02-09-24 R. MONNIN C Drawing updated as part of 5 year review. -rrp 09-12-

2、14 C. SAFFLE REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY CHARLES E. BESORE DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVA

3、ILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, UNIVERSAL DUAL FILTER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-08-15 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88641 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-

4、E574-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes

5、 device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88641 01 R X Drawing number Device type (see 1.2.1) Case outline (see 1.

6、2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1060A Universal dual filter building block 02 1060 Universal dual filter building block 1.2.2 Case outline(s). The case outline(s) are as des

7、ignated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) . 18 V dc Power dissipa

8、tion (PD) 500 mW Storage temperature range . -65C to +150C Junction temperature (TJ) +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) . 100C/W 1.4 Recommended operating conditions. Supply volt

9、age (VS) . 5 V dc Ambient operating temperature range (TA) . -55C to +125C 1/ All voltages referenced to GND Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

10、 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these

11、 documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electroni

12、c Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk,

13、 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulatio

14、ns unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Man

15、ufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535

16、. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accor

17、dance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in acco

18、rdance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance charac

19、teristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Mark

20、ing shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the opt

21、ion of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance w

22、ith MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FOR

23、M 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VS= 5.0 V dc, fO= 5 kHz Group A subgroups Device type Limits Unit unless otherwise specified Min Max Clock to center frequency ratio fCLK/ fOSee figure 3, 50:1, fCLK= 250 kHz, Q = 10 1,2,3 01 49.85 50

24、.15 02 49.6 50.4 See figure 3, 100:1, fCLK= 250 kHz, Q = 10 01 99.70 100.3 02 99.2 100.8 Q accuracy QACCSee figure 3, fO= 5 kHz, Q = 10 1,2,3 01 3.0 % 02 5.0 DC offset voltage, see figure 4 VOS150:1 1,2,3 All 15 mV VOS2fCLK= 250 kHz, 50:1, SA/BHIGH 30 VOS2fCLK= 500 kHz, 100:1, SA/BHIGH 60 VOS2fCLK=

25、250 kHz, 50:1, SA/BLOW 20 VOS2fCLK= 500 kHz, 100:1, SA/BLOW 40 VOS3fCLK= 250 kHz, 50:1, SA/BLOW 20 VOS3fCLK= 500 kHz, 100:1, SA/BLOW 40 DC low pass gain accuracy LPGA R1= R2= 50 k, see figure 3, TA= +25C 1 All 2.0 % See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or netwo

26、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C VS= 5.0

27、 V dc, fO= 5 kHz Group A subgroups Device type Limits Unit unless otherwise specified Min Max Power supply current ICC1 All 3.0 8.0 mA 2,3 12.0 VS= 2.37 V, TA= +25C 1 4.0 Supply voltage range VSTA= +25C 1/ 1 All 2.37 8.0 V Voltage swing VSWRL= 5 k, 1/ LOW PASS A, BAND 1 01 4.0 V PASS A, BAND PASS B,

28、 LOW PASS B pins 02 3.8 2,3 All 3.6 RL= 3.5 k, 1/ HIGH PASS A, HIGH PASS B pins 1,2,3 All 3.6 1/ Applicable to internal operational amplifier only. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply i

29、n MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certific

30、ate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs a

31、gent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr

32、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device type 01 and 02 Case outline R Terminal number Terminal symbol 1 LOW PASS A ( LPA) 2 BAND PASS A ( BPA) 3 HIGH PASS A ( N / AP / HP

33、A) 4 INVA5 INPUT SIGNAL VOLTAGE ( S1A) 6 INPUT VOLTAGE SIGNAL ( SA / B) 7 ANALOG POWER SUPPLY ( +VA) 8 DIGITAL POWER SUPPLY ( +VD) 9 LEVEL SHIFT ( LSh ) 10 INPUT CLOCK A ( CLKA) 11 INPUT CLOCK B ( CLKB) 12 50 / 100 / HOLD 13 DIGITAL POWER SUPPLY ( -VD) 14 ANALOG POWER SUPPLY ( -VA) 15 ANALOG GROUND

34、( AGND ) 16 INPUT VOLTAGE SIGNAL ( S1B) 17 INVB18 HIGH PASS B ( N / AP / HPB) 19 BAND PASS B ( BPB) 20 LOW PASS B ( LPB) FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 D

35、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLU

36、MBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. Clock / center frequency ratio and Q accuracy are measured at the BP output. 2. DC gain accuracy is measured at the LP output. 3. fO= fCLK/ (50 or 100). 4. Q = R3 / R1 FIGURE 3. Second order filter providing notc

37、h, bandpass, and lowpass (mode 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 FIGURE 4. Equiv

38、alent input offsets of filter building block. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 4.

39、VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The foll

40、owing additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The te

41、st circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electric

42、al parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply

43、. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-s

44、tate life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the

45、inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking

46、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88641 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-

47、883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*, 2, 3 Group A test requirements (method 5005) 1, 2, 3 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packagin

48、g requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prep