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本文(DLA SMD-5962-88645 REV E-2013 MICROCIRCUIT DIGITAL CMOS REMOTE TERMINAL MULTI-PROTOCOL MONOLITHIC SILICON.pdf)为本站会员(inwarn120)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-88645 REV E-2013 MICROCIRCUIT DIGITAL CMOS REMOTE TERMINAL MULTI-PROTOCOL MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Paragraph 1.2.1, add footnote 1/. Table I, correct test symbols: t5, t6, t7, t8, t9, t12, t14, t15, t24, t26, t27, t28, t30and t31. Editorial changes throughout. 91-06-12 William Heckman B Updated boilerplate and made editorial changes throughout

2、. - LTG 00-07-25 Monica L. Poelking C Update boilerplate to MIL-PRF-38535 requirements. - LTG 01-06-21 Thomas M. Hess D Update boilerplate to current MIL-PRF-38535 requirements. - CFS 07-06-11 Thomas M. Hess E Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-09-24 Th

3、omas M. Hess REV SHEET REV E E E SHEET 15 16 17 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Christopher A. Rauch DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS D

4、RAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Tim H. Noh APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, CMOS, REMOTE TERMINAL MULTI-PROTOCOL, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-07-13 REVISION LEVEL E SIZE A CAGE CODE 6726

5、8 5962-88645 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E580-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88645 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR

6、97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88645 01 X A Drawing number

7、 Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1553RTMP Remote terminal multi-protocol 1/ 1.2.2 Case outline(s). The case outline(s) are as des

8、ignated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CMGA15-P84 84 Pin grid array Y CQCC1-F84 84 Unformed-lead chip carrier Z CQCC1-N84 84 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.

9、1.3 Absolute maximum ratings. 2/ Supply voltage range (VDD) -0.3 V dc to +7.0 V dc DC input voltage range (VIN) -0.3 V dc to (VDD+0.3 V dc) DC output voltage range (VOUT) . -0.3 V dc to (VDD+0.3 V dc) Maximum power dissipation (PD) . 300 mW 3/ Storage temperature range -65C to +150C Junction tempera

10、ture (TJ) . 175C 4/ Thermal resistance, junction to case (JC) See MIL-STD-1835 Latchup immunity (ILU) 150 mA 1.4 Recommended operating conditions. Supply voltage range (VDD) 4.5 V dc to 5.5 V dc DC input voltage range (VIN) 0.0 V dc to VDD Operating frequency (FO) . 12 0.01% MHz Case operating tempe

11、rature range (TC) . -55C to +125C _ 1/ Mode selectable with either MIL-STD-1553A or MIL-STD-1553B bus protocol. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ Must wit

12、hstand the added PDdue to short circuit test; e.g., IOS. 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without

13、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88645 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks fo

14、rm a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENS

15、E STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are ava

16、ilable online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing ta

17、kes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices

18、 and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufactur

19、ers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modificatio

20、ns shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

21、MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure

22、2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the fu

23、ll case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

24、from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88645 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addit

25、ion, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked o

26、n all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shal

27、l be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requir

28、ements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA

29、 Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore docum

30、entation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88645 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM

31、 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 4.5 V VDD 5.5 V -55C TC +125C unless otherwise specified Group A subgroup Device type Limits Unit Min Max Input high voltage VIH1, 2, 3 All 2.0 V Low input voltage VIL1, 2, 3 All 0.8 V High level output voltage

32、, TTL outputs VOHFor all inputs affecting output under test VIN= VIH= 2.0 V or VIL= 0.8 V For all other inputs VIN= VCCor GND IOH= -400 A 1, 2, 3 All 2.4 V Low level output voltage, TTL outputs VOLFor all inputs affecting output under test VIN= VIH= 2.0 V or VIL= 0.8 V For all other inputs VIN= VCCo

33、r GND IOL= +3.2 mA 1, 2, 3 All 0.4 V Input leakage current, TTL inputs IINVIN= VDDor VSS1, 2, 3 All -1 +1 A Inputs with pull-down resistors VIN= VDD100 1000 Inputs with pull-down resistors VIN= 2.4 V 1/ 400 Inputs with pull-up resistors VIN= VSS-1000 -100 Quiescent current QIDD1, 2, 3 All 1 mA Short

34、 circuit output current IOS1/ 2/ VDD= 5.5 V, VOUT= VDDVDD= 5.5 V, VOUT= 0.0 V 1, 2, 3 All -100 +100 mA Operating supply current IDD1/ FO= 12 MHz, CL= 50 pF 1, 2, 3 All 50 3/ mA Three-state output leakage current, TTL outputs IOZL, IOZHVOUT= VDDor VSS1, 2, 3 All -10 +10 A Input capacitance CINSee 4.3

35、.1c 4/ 4 All 10 pF Output capacitance COUT4 All 15 pF Bidirectional I/O capacitance CI/O4 All 20 pF Functional tests See 4.3.1d 7, 8 All DMAR (L) to DMAG (L) t11/ See figure 3 5/ 9, 10, 11 All 0.0 7.3 s DMAG (L) to address bus valid t29, 10, 11 All 0.0 134.0 ns Address bus valid to AV (L) t31/ 9, 10

36、, 11 All 40.0 176.0 ns AV (L) to RRD (L) t41/ 9, 10, 11 All 80.0 90.0 ns RRD pulse width t51/ 9, 10, 11 All 95.0 140.0 ns Data setup time to RRD (H) t61/ 9, 10, 11 All 50.0 ns Data hold time from RRD (H) t71/ 9, 10, 11 All 0.0 ns RRD (H) to AV (H) t81/ 9, 10, 11 All 32.0 70.0 ns AV (H) to address hi

37、gh impedance and DMAR (H) t91/ 9, 10, 11 All 0.0 62.0 ns AV (H) to DMAG (H) t101/ 9, 10, 11 All 0.0 ns AV (L) to RWR (L) t111/ 9, 10, 11 All 80.0 90.0 ns RWR pulse width t121/ 9, 10, 11 All 95.0 140.0 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permit

38、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88645 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Test conditions 4.5 V VDD 5.5 V -55C TC +125C unles

39、s otherwise specified Group A subgroups Device type Limits Unit Min Max Data bus valid to RWR (L) t131/ See figure 3 5/ 9, 10, 11 All 145.0 311.0 ns RWR (H) to data bus high impedance t141/ 9, 10, 11 All 20.0 90.0 ns RWR (H) to AV (H) t151/ 9, 10, 11 All 32.0 70.0 ns Address bus valid to (CS RD) (L)

40、 t161/ 9, 10, 11 All 20.0 ns (CS RD) (L) to data bus valid t179, 10, 11 All 0.0 93.0 ns (CS RD) (H) to data bus high impedance t181/ 9, 10, 11 All 10.0 100.0 ns (CS RD) (H) to address bus high impedance t191/ 9, 10, 11 All 20.0 ns Address bus valid to (CS WR) (L) t201/ 9, 10, 11 All 80.0 ns WR pulse

41、 width t211/ 9, 10, 11 All 50.0 ns WR (H) to data bus high Impedance (hold time) t221/ 9, 10, 11 All 70.0 ns (CS WR) (H) to address bus high impedance t231/ 9, 10, 11 All 50.0 ns Data valid to (CS WR) (H) (setup time) t241/ 9, 10, 11 All 20.0 ns Mid-bit of command word parity to COMSTR (L) t251/ 9,

42、10, 11 All 3.7 s COMSTR pulse width t261/ 9, 10, 11 All 240.0 ns CHA/B valid to COMSTR (H) t271/ 9, 10, 11 All 230.0 ns MCSA0-4 valid to COMSTR (H) t28See figure 3 1/ 5/ 9, 10, 11 All 240.0 ns COMSTR (H) to ILLCOM (H) (active) t299, 10, 11 All 100.0 ns MIL-STD-1553A mode status word response time t3

43、09, 10, 11 All 4.25 5.75 s MIL-STD-1553B mode status word response time t319, 10, 11 All 9.25 10.0 s 1/ Tested initially and at process and design changes. Thereafter, guaranteed, if not tested, to the limits specified in table I. 2/ Not more than one output may be shorted at a time for a maximum du

44、ration of one second. 3/ This limit includes current through input pull-up resistors. Instantaneous surge currents on the order of 1 A can occur during simultaneous output switching. 4/ The capacitance measurements shall be made between the indicated terminal and ground at a frequency of 1 MHz at TC

45、of +25C. The dc bias of the measuring instrument shall be 0 0.1 V. The ac signal amplitude shall be less than 50 mV rms. 5/ Switching tests are performed with VIH= VDDand VIL= 0.0 V as input test conditions and output transition times are measured at 1.4 V. Provided by IHSNot for ResaleNo reproducti

46、on or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88645 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Device type All Case outline X Terminal number Terminal symbol Terminal number Terminal symbol Termin

47、al number Terminal symbol A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 C1 C2 C5 C6 C7 C10 C11 RTA3 TAPEN RTPTY A1 VDDA2 VSSA9 A11 A12 A15 RTA0 RTA2 RTA4 A0 A3 A6 A7 A10 A13 A14 RWR D15 RTA1 A4 A5 A8 AV RRD D1 D2 D10 D11 E1 E2 E3 E9 E10 E11 F1 F2 F3 F9 F10 F11 G1 G2 G3 G9 G10

48、 G11 H1 H2 H10 H11 J1 J2 J5 D13 D14 DMAEN DMAG D10 D11 VDDCS WR RD D9 D12 VSSVDDVSSDMAR D8 D7 D6 MERR SVC SME D5 D4 EOMC COMSTR D3 D1 RC/SA J6 J7 J10 J11 K1 K2 K3 K4 K5 K6 K7 K8 K9 K10 K11 L1 L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 ILLCOM TA0 RBZ CORT D2 PRA/B ENBC MCSA1 MCSA4 MCSA3 RAZ CHA/B TBZ RBO CLK D0 TEST MCSA0 MCSA2 VSSRAO VDDTAZ TIMERON TBO RESET FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88645 DLA LAND AND MARITIME

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