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本文(DLA SMD-5962-88658 REV D-2009 MICROCIRCUIT HYBRID LINEAR 12-BIT ANALOG TO DIGITAL CONVERTER.pdf)为本站会员(fuellot230)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-88658 REV D-2009 MICROCIRCUIT HYBRID LINEAR 12-BIT ANALOG TO DIGITAL CONVERTER.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changed to reflect MIL-H-38534 processing. Editorial changes throughout. 91-11-20 G. A. Lude B Changes in accordance with NOR 5962-R241-97. 97-03-21 Kendall A. Cottongim C Table I, Gain error, and Bipolar offset error, delete End-point electrical

2、 limits. Table I, 10 V reference error, add subgroups 2 and 3 to the limits for subgroup 1 and delete existing limits for subgroups 2 and 3. Table I, Digital output high and low drives, delete subgroup 1 from both tests and add new subgroup 1 with new IOHand IOLconditions. Table I, delete note 2 in

3、its entirety and renumber note sequence. Figure 2, add note. Correct vendor CAGE. Update drawing boilerplate. 02-10-29 Raymond Monnin D Update drawing. -gz 09-06-16 Joseph D. RodenbeckTHE ORIGINAL FIRST SHEET OF THE DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D

4、D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Gregory A. Lude

5、MICROCIRCUIT, HYBRID, LINEAR, 12-BIT, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-07-31 ANALOG TO DIGITAL CONVERTER AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88658 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E353-09Provided by IHSNot for ResaleNo reproduction or netwo

6、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be p

7、rocessed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 5962-88658 01 X X Drawing number Device type Case outline Lead finish (see 1

8、.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD578SD A/D converter, 12-bit, high speed 02 AD578TD A/D converter, 12-bit, high speed 03 AD578ZSD A/D converter, 12-bit, high speed 04 AD57

9、8ZTD A/D converter, 12-bit, high speed 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 32 Dual-in-line 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.

10、1.3 Absolute maximum ratings. Supply voltages (VCC) 18 V dc Logic supply voltage (+VDD). +7 V dc Analog inputs (pins 27 and 28) 25 V dc Digital inputs +5.5 V dc Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +175C Thermal resistance, juncti

11、on-to-case (JC). 8C/W Thermal resistance, junction-to-ambient (JA) . 25C/W 1.4 Recommended operating conditions. Supply voltage range (VCC): Device types 01 and 02 13.5 V dc to 16.5 V dc Device types 03 and 04 11.4 V dc to 12.6 V dc Logic supply voltage range (+VDD). +4.75 V dc to +5.25 V dc Ambient

12、 operating temperature range (TA) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2.

13、 APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. D

14、EPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103

15、 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Orde

16、r of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 It

17、em requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the

18、 applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, o

19、r function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein and figure 1

20、. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.4 Timing diagram. The timing diagram shall be as specified on figure 4. 3.2.5 Digital output data. The digital output data shall be

21、as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performan

22、ce characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in ta

23、ble II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Dat

24、a. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data s

25、hould include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A cer

26、tificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conforman

27、ce. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacture

28、rs Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test c

29、ondition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as app

30、licable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to bu

31、rn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234

32、 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Min Max Unit Gain error VGE10 V unipolar, 20 V bipolar 1 All -0.25 +0.25 %/FSR 01,03 -50 +50 Gain drift VGD10 V unipolar, 20 V bipolar 2, 3

33、02,04 -30 +30 ppm/C Unipolar offset error VOSE10 V unipolar 1 All -0.25 +0.25 %/FSR 01,03 -15 +15 Unipolar offset drift VOSD10 V unipolar 2, 3 02,04 -10 +10 ppm/C Bipolar offset error VOSE20 V bipolar 1 All -0.25 +0.25 %/FSR 01,03 -25 +25 Bipolar offset drift VOSD20 V bipolar 2, 3 02,04 -20 +20 ppm/

34、C 10 V unipolar, 20 V bipolar 1 All -0.50 +0.50 Linearity error RA 10 V unipolar, 20 V bipolar 2, 3 All -0.75 +0.75 LSB Differential linearity error DNL 10 V unipolar, 20 V bipolar 1 All -1.0 +1.0 LSB 10 V reference error VRE1, 2, 3 All -100 +100 mV +VDDpower supply sensitivity PSRR 1, 2, 3 All -0.0

35、05 +0.005 %/%+VDD VCCpower supply sensitivity PSRR 1, 2, 3 01,02 -0.005 +0.005 %/%VCC VCCpower supply sensitivity PSRR 1, 2, 3 03,04 -0.007 +0.007 %/%VCC See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIR

36、CUIT DRAWING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type M

37、in Max Unit at -40 A IOH1 2.4 Digital output high drive VOHat -80 A IOH2, 3 All 2.4 V dc at 0.8 mA IOL1 0.4 Digital output low drive VOLat 3.2 mA IOL2, 3 All 0.4 V dc +VDDsupply drain +IDDAll bits on. 1, 2, 3 All 150 mA +VCCsupply drain +ICCAll bits on. 1, 2, 3 All 8 mA -VCCsupply drain -ICCAll bits

38、 on. 1, 2, 3 All 35 mA Power dissipation PDTA= +25C 1 All 715 mW 01,03 6 Conversion speed tc2/ 9, 10, 11 02,04 4.5 s 1/ +VDD= +4.75 V to +5.25 V; VCC= 13.5 V to 16.5 V for device types 01 and 02; VCC= 11.4 V to 12.6 V for device types 03 and 04. 2/ Subgroups 10 and 11 shall be tested as part of devi

39、ce initial characterization and after design and process changes. Parameter shall be guaranteed to the limits specified in table I for all lots not specifically tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZ

40、E A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Case outline X. Inches Millimeters Symbol Min Max Min Max Notes A .280 7.11 b .016 .020 0.41 0.51 b1.035 .045 0.89 1.14 2 c .009 .012 0.23 0.30 D 1.584 1.640 40.23 41.66 E .580 .605

41、 14.73 15.37 E1.590 .610 14.99 15.49 6 e .100 BSC 2.54 BSC 4, 7 L .125 .200 3.18 5.08 L1.180 4.57 Q .015 .060 0.38 1.52 3 S .098 2.49 5 S1.005 0.13 5 NOTES: 1. Index area; a notch or a lead one identification mark is located adjacent to lead one. 2. The minimum limit for dimension b1 may be .023 (0.

42、58 mm) for all four corner leads only. 3. Dimensions Q shall be measured from the seating plane to the base plane. 4. The basic pin spacing is .100 (2.54 mm) between centerlines. 5. Applies to all four corners. 6. E1shall be measured at the center line of all the leads. 7. Thirty spaces. 8. Dimensio

43、ns are in inches. 9. Metric equivalents are given for general information only. 10. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-ound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the

44、inch-pound units shall take precedence. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FOR

45、M 2234 APR 97 Device types 01, 02, 03, and 04 Case outline X Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 1 SHORT CYCLE DIGITAL GND +5 V CLOCK ADJ

46、CLOCK OUT CLOCK IN EOC CONVERT START NC NC REF OUT GAIN (REF IN) BIPOLAR OFFSET 10 V SPAN INPUT 20 V SPAN INPUT ZERO ADJ ANALO GND +15 V -15 V NOTE: NC is no connection. FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

47、STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA

48、WING SIZE A 5962-88658 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 10 DSCC FORM 2234 APR 97 Clock: Internal: Connect clock out (18) to clock in (19). External: Connect external clock to clock in (19), clock should be at least 30 percent duty cycle with minimum period, tMINof 100 ns. NOTE: The rising edge of convert start pulse resets the MSB to zero, and the LSB to one. The trailing edge initiates conversion. FIGURE 4. Timing

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