1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Made technical changes in table I. Made technical changes in truth table. Editorial changes throughout. - thn 89-11-03 William K. Heckman B Made technical changes in table I. - thn 92-07-10 Monica L. Poelking C Made technical changes in table I.
2、Use new boilerplate. - tdn 97-09-05 Raymond Monnin D Update to current requirements. Editorial changes throughout. - gap 06-06-05 Raymond Monnin REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Tim H. Noh DEFENSE SUPPLY CENTER C
3、OLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim H. Noh COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, OCTAL BUS AND AGENCIES OF THE DEPARTMENT O
4、F DEFENSE DRAWING APPROVAL DATE 88-08-18 TRANSCEIVERS AND REGISTERS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88673 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E338-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAND
5、ARD MICROCIRCUIT DRAWING SIZE A 5962-88673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-
6、38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88673 01 L X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: De
7、vice type Generic number Circuit function 01 54ALS652 Octal bus transceivers and registers, with 3-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat
8、 package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line package 3 CQCC1-N28 28 Leadless square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VCC) . -0.5 V dc minimum to +7.0 V dc maximum Input voltage: Cont
9、rol inputs -1.5 V dc at -18 mA to +5.5 V dc I/O ports +5.5 V dc Maximum power dissipation (PD) 1/ 484 mW Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . 175C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommende
10、d operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . +2.0 V dc Maximum low level input voltage (VIL) +0.7 V dc High level output current (IOH) . -12 mA Low level output current (IOL) +12 mA Case operating temperature ran
11、ge (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short circuit test; e.g., IO.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88673 DEFENSE
12、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless oth
13、erwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-ST
14、D-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodss
15、p.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this
16、document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Produc
17、t built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qu
18、alifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as d
19、escribed herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and he
20、rein. 3.2.1 Case ouline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless o
21、therwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596
22、2-88673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Markin
23、g. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has
24、the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accor
25、dance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to D
26、SCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
27、 with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturer
28、s facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shal
29、l be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufa
30、cturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) T
31、A= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in a
32、ccordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subg
33、roups 7 and 8 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88673 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2
34、234 APR 97 TABLE I. Electrical performance characteristics. Test Limits Symbol Conditions -55C TC+125C unless otherwise specified Group A subgroups Min Max Unit IOH= -0.4 mA 2.5 IOH= -3 mA 2.4 High level output voltage VOHVCC= 4.5 V VIH= 2.0 V VIL= 0.7 V 2/ IOH= -12 mA 1, 2, 3 2.0 V Low level output
35、 voltage VOLVIH= 2.0 V VCC= 4.5 V VIL= 0.7 V IOL= 12 mA 2/ 1, 2, 3 0.4 V Input clamp voltage VICVCC= 4.5 V IIN= -18 mA 1, 2, 3 -1.2 V Control inputs 20 IIH1VCC= 5.5 V VIN= 2.7 V All other inputs = 0.0 V A or B ports 3/ 20 A VCC= 5.5 V VIN= 7.0 V All other inputs = 0.0 V Control inputs 0.1 High level
36、 input current IIH2VCC= 5.5 V VIN= 5.5 V All other inputs = 0.0 V A or B ports 1, 2, 3 0.1 mA Low level input current Control inputs -0.2 IILVCC= 5.5 V VIN= 0.4 V All other inputs = 4.5 V A or B ports 3/ 1, 2, 3 -0.2 mA Output current with power off IOVCC= 5.5 V VOUT= 2.25 V 4/ B ports 1, 2, 3 -20 -
37、112 mA Outputs high 76 Outputs low 88 Supply current ICCVCC= 5.5 V Outputs disabled 1, 2, 3 88 mA Functional tests See 4.3.1c 5/ 7, 8 Maximum clock frequency fMAXVCC= 4.5 V to 5.5 V, CL = 50 pF RL= 500 9, 10, 11 35 MHz Setup time before CAB of CBA going high tsA or B 9, 10, 11 15 ns Hold time data a
38、fter CAB or CBA going high thVCC= 4.5 V dc to 5.5 V dc CL= 50 pF RL= 500 6/ See figure 3 A or B 9, 10, 11 5 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88673 DEFENSE SUPP
39、LY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions -55C TC+125C unless otherwise specified Group A subgroups Min Max Unit CBA, CAB high 14.5 Pulse duration twVCC= 4.5 V
40、 dc to 5.5 V dcCL= 50 pF RL= 500 6/ See figure 3 CBA, CAB low 9, 10, 11 14.5 ns tPLH18 35 Propagation delay time, CBA or CAB to A or B tPHL19, 10, 11 5 20 ns tPLH24 20 Propagation delay time, A or B to B or A tPHL29, 10, 11 3 15 ns tPLH38 40 Propagation delay time, SBA, SAB (stored data high) to A o
41、r B tPHL39, 10, 11 6 23 ns tPLH48 30 Propagation delay time, SBA, SAB (stored data low) to A or B tPHL49, 10, 11 5 24 ns tPZH13 20 Output Enable time, BAG to A tPZL19, 10, 11 5 22 ns tPHZ21 12 Output Enable time, BAG to A tPLZ29, 10, 11 2 20 ns tPZH33 25 Output Enable time, GAB to B tPZL39, 10, 11 5
42、 21 ns tPHZ41 12 Output Disable time, GAB to B tPLZ49, 10, 11 2 21 ns 1/ Unused inputs that do not directly control the pin under test must be put at 2.5 V dc or 0.4 V dc. No unused inputs shall exceed 5.5 V dc or go less than 0.0 V dc. No inputs shall be floated. 2/ All outputs must be tested. In t
43、he case where only one input at VILmaximum or VIHminimum produces the proper output state, the test must be performed with each input being selected as the VILmaximum or VIHminimum input. 3/ For I/O ports, the parameters IIH1and IILinclude the off-state output current. 4/ The output conditions have
44、been chosen to produce a current that closely approximates one half of the true short circuit output current, IOS. Not more than one output will be tested at one time and the duration of the test shall not exceed one second. 5/ Functional tests shall be conducted at input test conditions of GND VIL
45、VOLand VOH VIH VCC. 6/ Propagation delay limits are based on single output switching. Unused inputs = 3.5 V dc or 0.3 V dc. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88673 DEFENSE SUPPLY CENTER COLUMBUS
46、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method
47、5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II he
48、rein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSN
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