DLA SMD-5962-88701 REV F-2008 MICROCIRCUIT HYBRID LINEAR HIGH CURRENT OPERATIONAL AMPLIFIER《运算放大器高电流线性混合微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Remove vendor CAGE 13919. Add vendor CAGE 69210. Add case outline Y. Changed to reflect MIL-H-38534 processing. Update document with editorial changes throughout. 93-03-29 K. A. Cottongim B Add vendor CAGE 51651, case outlines U and Z, and device

2、 type 02. Make corrections to table I. 95-02-08 K. A. Cottongim C Figure 1, case outline U, correct dimension A min. from 0.255“ to 0.200“. Figure 1, case outline U, correct dimension D min. from 1.350“ to 1.035“. Figure 1, case outline Y, change dimension C max. from .260“ to .265“. Figure 1, case

3、outline Z, add dimension L, which was omitted. Table I, IOP, subgroups 5 and 6, add note 2. Update drawing boilerplate to most current format. 02-05-21 Raymond Monnin D Add device type 03. Table I, delete note 2 from table I. Table I, Output current peak test, conditions column, add minimum to both

4、VOUTconditions. Table I, Slew rate, subgroups column, correct subgroup 7 to subgroup 4. Table II, delete subgroup 7 (2 places). 4.3.1.b, add subgroup 7. 06-06-02 Raymond Monnin E Table I, Output voltage peak test, subgroups 5 and 6, delete device type 03. Add new test conditions for subgroups 5 and

5、6 for device type 03 with the minimum test limit of 28 V. Table I, Output current peak test, subgroups 5 and 6, delete device type 03. Add new test conditions for subgroups 5 and 6 for device type 03 with the minimum test limit of 3 A. -gz 07-10-25 Robert M. Heber F Table I: Input bias current, devi

6、ce type 03, subgroups 2 and 3, change the min/max limits from 50 nA to 150 nA. Input offset current, device type 03, subgroups 2 and 3, change the min/max limits from 20 nA to 50 nA. -gz 08-03-17 Robert M. Heber THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STAT

7、US REV F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Donald R. Osborne COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPA

8、RTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT, OPERATIONAL AMPLIFIER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-10-16 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-88701 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E293-08Provided by IH

9、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements f

10、or class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 5962-88701 01 X X Drawing number Devi

11、ce type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 01 OMA541SKB, MSK 541B, High power, operational amplifier MSK 145B, MSK 146B, MSK 147B 02 OMA541SK

12、CB High power, operational amplifier 03 MSK 541B, MSK 145B, High power, operational amplifier MSK 146B, MSK 147B 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style U See figure 1 8 Dual-in-li

13、ne (Z-tab power) X See figure 1 8 Flange mount Y See figure 1 8 Dual-in-line (power) Z See figure 1 6 Single-in-line 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 40 V dc Differential input voltage VCCCommon mode inpu

14、t voltage. VCC Maximum power dissipation (PD) 2/ 3/. 125 W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Device types 01and 03. 2.2C/W Device type 02 1.5C/W Junction temperature (TJ) +200C 1.4 Recommended operating c

15、onditions. Supply voltage (VCC) 34 V dc Ambient operating temperature range (TA) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate 2.2C/W above +25C.

16、 3/ TA +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Governmen

17、t specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION

18、MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Dr

19、awings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of p

20、recedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item req

21、uirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the appli

22、cable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or func

23、tion of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1

24、. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperatur

25、e range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIR

26、CUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition,

27、the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A

28、lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activ

29、ity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requir

30、ements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accord

31、ance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shal

32、l apply: a. Pre-seal burn-in test, method 1030 of MIL-STD-883. (optional for class H) (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also,

33、the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1030 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test

34、condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as ap

35、plicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. c. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to b

36、urn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 223

37、4 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TA +125C VCC= 34 V dc unless otherwise specified Group A subgroups Device type Min Max Unit 01,02 -1 +1 Input offset voltage VIO TA= +25C 1 03 -1.5 +1.5 mV 01,02 -30 +30 Input offset voltage drift VIOTTA= -5

38、5C and +125C 2,3 03 -50 +50 V/C 1 All -50 +50 pA 01,02 -50 +50 Input bias current IIB2,3 03 -150 +150 nA 1 All -30 +30 pA 01,02 -20 +20 Input offset current IOS2,3 03 -50 +50 nA 1 -10 +10 +PSRR -VCC= -34V dc, +VCC= +10 V to +40 V dc 2,3 All -20 +20 V/V 1 -10 +10 Power supply rejection ratio -PSRR+VC

39、C= +34V dc, -VCC= -10 V to -40 V dc 2,3 All -20 +20 V/V 1 95 Common mode rejection ratio CMRR VCM= 22 V dc, f = dc 2,3 All 90 dB Supply currents ICCVCM= 0 V, no load condition 1,2,3 All -30 +30 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

40、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions -55C TA +125C VCC= 34 V dc unle

41、ss otherwise specified Group A subgroups Device type Min Max Unit IO= 5 A peak, RL= 5.6, 10 kHz sine wave, TA= +25C 4 All 28.0 RL= 10, 10 kHz sine wave, TA= -55C and +125C 5,6 01,02 30 Output voltage peak VOPIO= 3 A peak, RL= 9.3, TA= -55C and +125C 5,6 03 28 V RL= 5.6, VOUT= 28 V minimum, TA= +25C

42、1/ 4 All 5 RL= 10, VOUT= 30 V minimum, TA= -55C and +125C 1/ 5,6 01,02 3 Output current peak IOPRL= 9.3, VOUT= 28 V minimum, TA= -55C and +125C 1/ 5,6 03 3 A 4 95 Voltage gain AVS RL= 10 k 5,6 All 86 dB Slew rate SR RL= 10.0, TA= +25C 4 All 6 V/s 1/ The internal current limit circuitry is controlled

43、 by a single external resistor, RCL. To calculate the value of the current limit resistor, use RCL= (0.809/ILIM) - 0.057, where ILIMis equal to the desired output current (IOP). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR

44、AWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 Case outline U. Millimeters Inches Symbol Min Max Min Max A 5.08 6.73 .200 .265 A1 3.68 3.94 .145 .155 b 0.71 0.81 .028 .032 D 26.16 26.54 1.035 1.045 D1 19.93 20.19 .785 .

45、795 D2 13.59 13.84 .535 .545 D3 3.05 3.30 .120 .130 E 13.59 13.84 .535 .545 E1 7.24 7.49 .285 .295 E2 3.05 3.30 .120 .130 e 1.41 2.67 .095 .105 e1 7.49 7.75 .295 .305 eA 22.73 22.49 .895 .905 I 3.05 3.30 .120 .130 L 4.57 10.67 .180 .420 NOTES: 1. The U. S. preferred system of measurement is the metr

46、ic SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. FIGURE 1. Case outline(s). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

47、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88701 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 Case outline X. Inches Millimeters Symbol Min Max Min Max A 1.510 1.550 38.35 39.37 B .745 .770 18.92 19.56 C .260 .340 6.60 8.64 D .038 .04

48、2 0.97 1.07 E .080 .105 2.03 2.67 F 40 BSC 40 BSC G .500 BSC 12.7 BSC H 1.186 BSC 30.12 BSC J .593 BSC 15.06 BSC K .400 .500 10.16 12.70 Q .151 .161 3.84 4.09 R .980 1.020 24.89 25.91 NOTES: 1. The U. S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference and may not be ma