DLA SMD-5962-88716 REV B-2002 MICROCIRCUIT LINEAR HIGH SPEED DUAL INVERTING DRIVER MONOLITHIC SILICON《硅单片双逆变驱动器高速线性微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R 5962-R109-92. 92-01-14 M. A. FRYE B Drawing updated to reflect current requirements. - ro 02-10-17 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B

2、 B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY GARY ZAHN DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCU

3、IT, LINEAR, HIGH SPEED, DUAL INVERTING DRIVER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-03-21 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88716 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E018-03 DISTRIBUTION STATEMENT A. Approved for public releas

4、e; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. T

5、his drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88716 01 C X Drawing number Device type (see 1.2.1)

6、 Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 SG1626 Dual high speed inverting driver 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and

7、 as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X See figure 1 5 Flange mount 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maxim

8、um ratings. Supply voltage (VCC) . +22 V dc Logic input voltage (VIN) +7.0 V dc Source / Sink output current (each output): Continuous 0.5 A Pulse, 500 ns 3.0 A Power dissipation (PD) at TA= +25C: Case C 1.4 W 1/ Case G 0.6 W 1/ Case P 1.0 W 1/ Case X 2.5 W 1/ Junction temperature (TJ) +150C Storage

9、 temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Case outlines C, G, and P See MIL-STD-1835 Case outline X 6.0C/W _ 1/ Derate linearly above TA= +25C, for case C derate to 11.2 mW/C, case G derate to 4.8 mW/C, case P derate to

10、 8.0 mW/C, and case X derate to 20.0 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.4 Rec

11、ommended operating conditions. Supply voltage range (VCC) . 4.5 V dc to 20 V dc 2/ Frequency range DC to 1.5 MHz Peak pulse current (IOUT) 3.0 A Logic input voltage (VIN) -0.5 V dc to 5.5 V dc Ambient operating temperature (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, stan

12、dards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS)

13、and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Compone

14、nt Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 R

15、obbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unl

16、ess a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufactu

17、rer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This

18、 QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance

19、with MIL-PRF-38535 is required to identify when the QML flow option is used. _ 2/ AC performance has been optimized for VCC= 8.0 V dc to 20 V dc. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE

20、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines s

21、hall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shal

22、l apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535,

23、 appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option

24、 of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with

25、 MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA pri

26、or to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each

27、 lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers faci

28、lity and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER CO

29、LUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Logic 1 input voltage VIH1,2,3 01 2.0 V Logic 0 input

30、voltage VIL1,2,3 01 0.7 V Input high current IIHVIN= 2.4 V 1,2,3 01 500 A VIN= 5.5 V 1.0 mA Input low current IILVIN= 0 V 1,2,3 01 -4.0 mA Input clamp voltage VICIIN= -10 mA 1,2,3 01 -1.5 V Output high voltage VOHIOUT= -200 mA, 10 V VCC 20 V 1,2,3 01 VCC- 3 V Output low voltage VOLIOUT= 200 mA, 10 V

31、 VCC 20 V 1,2,3 01 1.0 V Supply current ICCLVIN= 2.4 V (both inputs) 1,2,3 01 27 mA ICCHVIN= 0 V (both inputs) 12 Propagation delay time, high-to-low level output tPHLVCC= 15 V, 2/ CL= 1000 pF, 9 01 18 ns see figures 3 and 4 10,11 30 VCC= 15 V, CL= 2500 pF, 9 25 see figures 3 and 4 10,11 40 Propagat

32、ion delay time, low-to-high level output tPLHVCC= 15 V, 2/ CL= 1000 pF, 9 01 25 ns see figures 3 and 4 10,11 40 VCC= 15 V, CL= 2500 pF, 9 35 see figures 3 and 4 10,11 50 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

33、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device t

34、ype Limits Unit Min Max Output transition time, low-to-high level output tTLHVCC= 15 V, 2/ CL= 1000 pF, 9 01 30 ns see figures 3 and 4 10,11 35 VCC= 15 V, CL= 2500 pF, 9 40 see figures 3 and 4 10,11 50 Output transition time, high-to-low level output tTHLVCC= 15 V, 2/ CL= 1000 pF, 9 01 20 ns see fig

35、ures 3 and 4 10,11 30 VCC= 15 V, CL= 2500 pF, 9 40 see figures 3 and 4 10,11 50 Dynamic supply current (both outputs) ICCDuty cycle = 50 %, CL= 2500 pF, 4 01 35 mA f = 200 kHz, see figure 3 5,6 40 1/ Unless otherwise specified, all tests are measured at VCC= 4.5 V and 20 V. 2/ If not tested, shall b

36、e guaranteed to the limits specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 A

37、PR 97 Symbol Inches Millimeters Min Max Min Max A .250 .340 6.35 8.64 b .028 .034 0.71 0.86 D - .620 - 15.75 D1 .470 .500 11.94 12.70 E .680 .700 17.27 17.78 E1 .426 .432 10.82 10.97 F .050 .075 1.27 1.91 L .360 - 9.14 - P .142 .152 3.61 3.86 q .958 .962 24.33 24.24 R1 - .145 - 3.68 1. The U.S. gove

38、rnment preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outline. Provided by IH

39、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline C G P X (see note) Terminal number T

40、erminal symbol 1 NC OUTPUT A NC INPUT A 2 NC NC INPUT A OUTPUT A 3 OUTPUT A INPUT A GND VCC4 NC GND INPUT B OUTPUT B 5 INPUT A INPUT B OUTPUT B INPUT B 6 NC NC VCC- 7 GND OUTPUT B OUTPUT A - 8 NC VCCNC - 9 NC - - - 10 INPUT B - - - 11 NC - - - 12 OUTPUT B - - - 13 NC - - - 14 VCC- - - NOTES: Case an

41、d mounting tab are internally connected to substrate ground. NC = No connection FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O

42、HIO 43216-5000 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Output load circuit. FIGURE 4. Switching time waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88716 DEFENSE SUPPLY CENTER COL

43、UMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of M

44、IL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision le

45、vel control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interi

46、m and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 o

47、f MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. En

48、d-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance wi