1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change to table I, parameter tPWC. Removed programming requirements. Editorial changes throughout. 89-09-11 Michael A. Frye B Changes in accordance with NOR 5962-R006-91 91-09-24 Michael A. Frye C Changes in accordance with NOR 5962-R229-93 93-09
2、-21 Michael A. Frye D Drawing updated to reflect current requirements. Removed programming logic from truth table. Editorial changes throughout. - gap 01-01-05 Raymond Monnin E 5 year review and update. Changed input and output capacitance from 6 pF to 10 pF and 8 pF to 10 pF respectively. ksr 06-06
3、-06 Raymond Monnin THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY James E. Jamison DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing C
4、OLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-01-13 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X 8 BIT, ONE TIME PROGRAMMABLE (OTP) REGISTERED PROM, MONO
5、LITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-88735 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E482-06 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88735 DEFENSE SUPPLY CENTER COLUMBU
6、S COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PI
7、N is as shown in the following example: 5962-88735 01 L A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 7C245 2K X 8-bi
8、t registered PROM 45 ns 02 7C245 2K X 8-bit registered PROM 35 ns 03 7C245A 2K X 8-bit registered PROM 35 ns 04 7C245A 2K X 8-bit registered PROM 25 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package
9、 style K GDFP2-F24 or CDFP3-F24 24 Flat package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line package 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V dc to +7.
10、0 V dc DC voltage applied to outputs in high Z state -0.5 V dc to +7.0 V dc DC program voltage (VPP): Device types 01 and 02. 14.0 V dc Device types 03 and 04. 13.0 V dc DC input voltage. -3.0 V dc to +7.0 V dc Storage temperature range -65C to +150C Power dissipation (PD) 2/ 1.0 W Lead temperature
11、(soldering, 10 seconds) +300C Junction temperature (TJ) 3/ . +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Case operating temperature range (TC) . -55C to +125C 1/ Unless otherwise specifie
12、d, all voltages are referenced to ground. 2/ Must withstand the added PDdue to short-circuit test; e.g., IOS. 3/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-
13、,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88735 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a par
14、t of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDA
15、RDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available o
16、nline at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited h
17、erein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A
18、 for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product
19、 in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or functio
20、n of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical di
21、mensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing sh
22、all be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be programmed by the manufacturer prior to test in a checkerboard pattern or similar pattern (a minimum of 50 percent of the total number of bits programmed) or to any altered item drawing pat
23、tern which includes at least 25 percent of the total number of bits programmed. 3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance char
24、acteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The
25、electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88735 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2
26、234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number
27、 is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” s
28、hall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the manufacturer or the user to result in a wide variety of PR
29、OM configurations, two processing options are provided for selection in the contract using an altered item drawing. 3.6.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1. It is recommended that users perform subgroups 7 and 9 after p
30、rogramming to verify the specific program configuration. 3.6.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery. 3.7 Ce
31、rtificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the
32、 manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification o
33、f change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.10 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation sha
34、ll be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted o
35、n all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test (method 1015 of MIL-STD-883). (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to
36、 the preparing or procuring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall b
37、e as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D
38、inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINand COUTmeasurements) shall be measured only for the initial test a
39、nd after process or design changes which may affect input or output capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE
40、 A 5962-88735 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups 9, 10, and 11. Either of two techniques is accepta
41、ble: (1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified on all devices during subgroups 9, 10, and 11, group
42、A testing in accordance with the sampling plan specified in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted t
43、o programming (see 4.4). If more than two devices fail to program, the lot shall be rejected. At the manufacturers option, the sample may be increased to 24 total devices with no more than four total device failures allowable. Ten devices from the programmability sample shall be submitted to the req
44、uirements of group A, subgroups 9, 10, and 11. If more than two devices fail, the lot shall be rejected. At the manufacturers option, the sample may be increased to 20 total devices with no more than four total device failures allowable. e. Subgroups 7 and 8 shall include verification of the truth t
45、able. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level con
46、trol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,
47、000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4 Programming procedures. The programming procedures shall be as specified by the device manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE
48、A 5962-88735 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C 4.5 V VCC= 5.5 V GND = 0 V Group A subgroups Device types Limits Unit unless otherwise specified M
49、in Max Input leakage current ILIVIN= 5.5 V and GND 1, 2, 3 All 10 A Output leakage current 1/ ILOVOUT= 5.5 V and GND output disabled 1, 2, 3 All 40 A Operating supply current (active) ICCE / ES= VIL, INIT = VIHaddresses cycling between 0 V and 3 V; f = PWCt211, 2, 3 All 120 mA Input low voltage 2/ VILVCC= 4.5 V and 5.5 V 1, 2, 3 A
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