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本文(DLA SMD-5962-88737 REV C-2008 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL OCTAL BUS TRANSCEIVERS MONOLITHIC SILICON.pdf)为本站会员(赵齐羽)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-88737 REV C-2008 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL OCTAL BUS TRANSCEIVERS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with Notice of Revision (NOR) 5962-R291-92. 92-09-02 Michael A. Frye B Update drawing to reflect current requirements. New boilerplate. - ljs 00-10-17 Ray Monnin C Update drawing to current requirements. Editorial changes th

2、roughout. - gap 08-05-02 Robert M Heber The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Mo

3、nnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY, TTL, OCTAL BUS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-09-29 TRANSCEIVERS, MO

4、NOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88737 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E034-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88737 DEFENSE SUPPLY CENTER COLUMBU

5、S COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PI

6、N is as shown in the following example: 5962-88737 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS1245 Octal bus transce

7、ivers with 3-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as s

8、pecified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input voltage . All inputs -1.5 V dc at 18 mA to +7.0 V dc I/O ports . -1.5 V dc at 18 mA to +5.5 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 1

9、/ . 220 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) 2.

10、0 V dc Maximum low level input voltage (VIL): TC= +125C 0.7 V TC= -55C . 0.8 V TC= +25C 0.8 V Maximum high level output current (IOH) . -12 mA maximum Maximum low level output current (IOL) . 8 mA maximum Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined a

11、s VCCx ICC, and the device must withstand the added PDdue to short circuit test, e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88737 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISI

12、ON LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are tho

13、se cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case O

14、utlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document O

15、rder Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and

16、 regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qua

17、lified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL

18、-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mar

19、k in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shal

20、l be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms The test circuit and switching waveforms shall be as specifie

21、d on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shal

22、l be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88737 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4

23、3218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN num

24、ber is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C

25、” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK

26、-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of con

27、formance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and

28、the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accor

29、dance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test c

30、ondition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accord

31、ance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by I

32、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88737 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Co

33、nditions 1/ -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max IOH= -0.4 mA 2.5 IOH= -3 mA 2.4 High level output voltage VOHIOH= -12 mA VCC= 4.5 V 2/ VIH= 2.0 V VILat: +125C = 0.7 V -55C = 0.8 V +25C = 0.8 V 1, 2, 3 2.0 V VIL= 0.7 V 2 Low level output voltage VOLVCC= 4.5 V

34、 VIH= 2.0 V IOL= 8 mA 2/ VIL= 0.8 V 1, 3 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 -1.5 V Control inputs 20 High level input current IIH1VCC= 5.5 V, VIN= 2.7 V Unused inputs = 0.0 V A, B ports 3/ 1, 2, 3 20 A Control inputs VIN= 7.0 V 0.1 IIH2VCC= 5.5 V Unused inputs = 0.0 V A, B

35、ports VIN= 5.5 V 3/ 1, 2, 3 0.1 mA Control inputs -0.1 Low level input current IILVCC= 5.5 V, VIN= 0.4 V Unused inputs = 4.5 V A, B ports 3/ 1, 2, 3 -0.1 mA Output current IOVCC= 5.5 V, VOUT= 2.25 V 4/ 1, 2, 3 -20 -112 mA Output high 33 Output low 36 Supply current ICCVCC= 5.5 V Output disabled 1, 2

36、, 3 40 mA Functional tests See 4.3.1c 5/ 7, 8 Propagation delay time tPLHVCC= 4.5 to 5.5 V, 9, 10, 11 2 16 ns from A or B to B or A tPHLCL= 50 pF, 2 15 tPZHR1= 500 , 9, 10, 11 8 29 ns Output enable time from G to A or B tPZLR2= 500 , 8 29 Output disable time tPHZSee figure 3 6/ 9, 10, 11 2 14 ns fro

37、m G to A or B tPLZ 3 23 1/ Unused inputs that do not directly control the pin under test must be 2.5 V dc or 0.4 V. No unused inputs shall exceed 5.5 V or go less than 0.0 V. No inputs shall be floated. 2/ All outputs must be tested. In the case where only one input at VILmaximum or VIHminimum produ

38、ces the proper output state, the test must be performed with each input being selected as the VILmaximum or VIHminimum input. 3/ For I/O ports, the parameters IIHand IILinclude the off-state output current. 4/ The output conditions have been chosen to produce a current that closely approximates one-

39、half of the true short circuit output current, IOS. Not more than one output will be tested at one time and the duration of the test condition shall not exceed one second. 5/ Functional tests shall be conducted at input test conditions of GND VIL VOLand VOH VIH VCC. 6/ Propagation delay limits are b

40、ased on single output switching. Unused inputs = 3.5 V or 0.3 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88737 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FO

41、RM 2234 APR 97 Case outlines R and 2 Terminal number Terminal connection 1 DIR 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 A8 10 GND 11 B8 12 B7 13 B6 14 B5 15 B4 16 B3 17 B2 18 B1 19 G 20 VCCFIGURE 1. Terminal connections. Control inputs GDIR Operation L L B data to A bus L H A data to B bus H X Isolation

42、 L = Low voltage level H = High voltage level X = Irrelevant FIGURE 2. Truth Table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88737 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVE

43、L C SHEET 7 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses have the following characteristics: PRR 10 MHz, duty cycle = 50%, tr= tf= 3 ns 1 ns. 3. The outputs are measured one at a time with one transition per measurement. 4. Waveform 1 is for an output wit

44、h internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. 5. When measuring propagation delay times of three-state outputs, switch S1 is o

45、pen. FIGURE 3. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88737 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR

46、97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005)

47、 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1*, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The foll

48、owing additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer unde

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