DLA SMD-5962-88748 REV F-2006 MICROCIRCUIT LINEAR 15 VOLT NEGATIVE REGULATOR FIXED MONOLITHIC SILICON《硅单片15 V阴性固定调节器线性微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R072-95. 95-02-17 M. A. FRYE B Add case outlines M and N. Delete vendor CAGE number 48726. Replace CAGE number U4637 with U3158. Make changes to 1.2.2, 1.3, table I, figure 1, and figure 2. Redrawn. - ro 99-

2、11-30 R. MONNIN C Add radiation hardness requirements. Add CAGE 21845. rrp 00-02-24 R. MONNIN D Add case outlines 4 and 5. Make corrections to case outline “N” pin assignments. - ro 02-03-05 R. MONNIN E Add a footnote to case outline U, TO-257 package as specified under 1.2.3 and figure 1. -rrp 05-0

3、2-04 R. MONNIN F For case outline T only, add footnote 1/ under 1.2.3 and make change to note 2 under figure 1. -rrp 06-01-23 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV F F F SHEET 15 16 17 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6

4、 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY JOSEPH A. KERBY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, 15 VOL

5、T NEGATIVE REGULATOR FIXED, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-08-24 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-88748 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E155-06 Provided by IHSNot for ResaleNo reproduction or networking permitted wi

6、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcirc

7、uits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962 F 88748 01 X X Federal RHA Device Case Lead stock class designator type outline finish designator (see 1.2.1) (see 1.2.2) (see 1.2.3) (see 1.2.4) / / D

8、rawing number 1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function

9、 as follows: Device type Generic number Circuit function 01 7915A 1.0 A negative regulator, fixed 15-volt 1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style M See figure 1 3 Power surface mount N

10、CBCC2-N3 3 Bottom terminal chip carrier T 1/ See figure 1 3 TO-257 Single row flange mount with glass seal U 1/ See figure 1 3 TO-257 Single row flange mount and isolated tab with glass seal X See figure 1 3 TO-39 Can Y See figure 1 2 TO-3 Flange mount Z MBFM4-P2 2 TO-66 Flange mount 2 CQCC1-N20 20

11、Square leadless chip carrier 4 See figure 1 3 Flange mount, glass sealed with gull wing leads 5 CBCC1-N3 3 Bottom terminal chip carrier 1.2.4 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ce

12、ramic seal.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. Input vol

13、tage: Operating or output shorted to ground -35 V dc Transient . -50 V dc 2/ Power dissipation (PD): TC= +25C: Cases M, N, T, U, Z, 4, and 5 15 W Cases X and 2 . 2 W Case Y . 20 W Power dissipation (PD): TA= +25C: Cases M, N, T, U, and Z 3.0 W Cases X and 2 . 1.0 W Cases Y . 3.6 W Case 4 . 1.7 W Cas

14、e 5 . 1.3 W Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +150C 3/ Thermal resistance, junction-to-case (JC): Case M 5.5C/W Cases N and T 3.5C/W Case U 4.2C/W Case X 15C/W Case Y 3C/W Case Z 6C/W Case 2 . See MIL-STD-1835 Case

15、4 . 5.1C/W Case 5 . 3.6C/W Thermal resistance, junction-to-ambient (JA): Cases M, N, T, U, and Z . 42C/W Cases X and 2 . 120C/W Case Y 35C/W Case 4 . 60C/W Case 5 . 80C/W 1.4 Recommended operating conditions. Ambient operating temperature (TA) . -55C to +125C Input voltage range . -17.5 V dc to 30 V

16、 dc 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads(Si) / s) . 300 Krads 4/ 2/ The -50 volt input rating refers to the ability of the regulator to withstand high line or transient conditions without damage. Since the regulators maximum current capability is reduced, the

17、 output may fall out of regulation at high input voltages under nominal loading. 3/ The device is protected by a thermal shutdown circuit which is designed to turn off the output transistor whenever the device junction temperature is in excess of +150C. 4/ These parts may be dose rate sensitive in a

18、 space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license f

19、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks fo

20、rm a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENS

21、E STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are ava

22、ilable online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references

23、 cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, ap

24、pendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML

25、 product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or

26、 function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and phy

27、sical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.3 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The

28、radiation exposure circuit shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. Provided by IHSNot fo

29、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions

30、 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output voltage VOUTTA= +25C 1 01 -14.85 -15.15 V M,D,P,L,R,F 1 -14.85 -15.15 VIN= -17.5 V to -30 V 4/ 1,2,3 -14.55 -15.45 M,D,P,L,R,F 1 -14.55 -15.45 Line regulation 5/ 6/ VRLINEVIN= -17.5 V to -30 V

31、, 1 01 20 mV -55C TA +125C 2,3 50 M,D,P,L,R,F 1 20 VIN= -20 V to -26 V, 1 15 -55C TA +125C 2,3 25 M,D,P,L,R,F 1 15 Load regulation 5/ VRLOADIO= 5.0 mA to 1.5 A, 7/ 1 01 35 mV -55C TA +125C 2,3 75 M,D,P,L,R,F 1 35 IO= 250 mA to 750 mA, 7/ 1 21 -55C TA +125C 2,3 45 M,D,P,L,R,F 1 21 IO= 5.0 mA to 500 m

32、A, 8/ 1 50 -55C TA +125C 2,3 75 Standby current drain ISCD1 01 6.0 mA 2,3 6.5 M,D,P,L,R,F 1 6.0 Standby current drain change with line ISCDline VIN= -17.5 V to -30 V 1,2,3 01 0.8 mA M,D,P,L,R,F 1 0.8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted

33、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwi

34、se specified Group A subgroups Device type Limits Unit Min Max Standby current drain change with load ISCDload IO= 5.0 mA to 1000 mA 1,2,3 01 0.5 mA M,D,P,L,R,F 1 0.5 Dropout voltage VDOVOUT= 100 mV, 7/ IO= 1.0 A 1,2,3 01 2.5 V M,D,P,L,R,F 1 2.5 VOUT= 100 mV, 8/ IO= 500 mA 1,2,3 2.5 Peak output curr

35、ent IO(PK)TA= +25C 7/ 1 01 1.5 3.3 A M,D,P,L,R,F 1 1.5 3.3 TA= +25C 8/ 1 0.5 1.7 Short circuit current 9/ IOSVIN= -35 V 7/ 1 01 1.2 A 2,3 2.8 M,D,P,L,R,F 1 1.2 VIN= -35 V 8/ 1 0.7 2,3 2.0 Ripple rejection 5/ VIN/ VIN= 10 V, f = 120 Hz 4 01 53 dB VOUT5,6 10/ 50 M,D,P,L,R,F 4 53 Output noise voltage 1

36、0/ NOf = 10 Hz to 100 kHz, TA= +25C 7 01 40 V/V rms M,D,P,L,R,F 7 40 Long term stability 10/ VOUT/ t TA= +25C, t = 1000 hours 7 01 150 mV M,D,P,L,R,F 7 150 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC

37、IRCUIT DRAWING SIZE A 5962-88748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. 1/ Devices supplied to this drawing will meet all levels M, D, P, L, R, F of irradiation. However, this

38、device is only tested at the F level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA= +25C. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanc

39、ed low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. 3/ Unless otherwise specified, VIN= -23 V and IO= 500 mA for cases M, N, T, U, Y, Z, 4, and 5, VIN= -23 V and IO= 100 mA for cases

40、X and 2. Maximum test current for cases X and 2 is 500 mA. 4/ For cases X and 2, IO= 5 mA to 500 mA, P 2 W. For case Y: IO= 5 mA to 1.0 A, P 20 W. For cases M, N, T, U, Z, 4, and 5: IO= 5 mA to 1.0 A, P 15 W. 5/ All measurements except output noise voltage and ripple rejection are made at constant j

41、unction temperature and with low duty cycle. 6/ Minimum load current for full line regulation is 5.0 mA. 7/ For cases M, N, T, U, Y, Z, 4, and 5 only. 8/ For cases X and 2 only. 9/ Short circuit protection is only assured up to VIN= -35 V. 10/ Guaranteed, if not tested, to the limits specified in ta

42、ble I herein. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with th

43、e PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA de

44、signator shall still be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38

45、535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listi

46、ng as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of mic

47、rocircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applic

48、able required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88748 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F S