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本文(DLA SMD-5962-88752 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL HEX INVERTER MONOLITHIC SILICON.pdf)为本站会员(吴艺期)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-88752 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL HEX INVERTER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes in Table I. Editorial changes throughout. 92-03-09 Michael A. Frye B Update drawing to reflect current requirements. New boilerplate. ljs 00-06-19 Raymond Monnin C Update to reflect latest changes in format and requirements. Edi

2、torial changes throughout. Correct hysteresis limit. - les 03-06-11 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. - gap 09-08-04 Charles F. Saffle The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D O

3、F SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Monica L. Poelking DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Donald Cool

4、 APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-01-18 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88752 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E176-09 Provided by IHSNot for ResaleNo reproductio

5、n or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non

6、-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88752 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The

7、 device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F14 Hex inverter Schmitt trigger 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDI

8、P1-T14 or CDIP2-T14 14 Dual-in-line package D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range 1/ -0.5 V dc to +7.0 V dc DC input voltage range

9、 -0.5 V dc to +7.0 V dc DC input current range -30 mA to +5.0 mA Voltage applied to output in high output state . -0.5 V to +VCCCurrent applied to output in low output state . 40 mA Storage temperature range -65C to +150C Maximum power dissipation (PD) 2/ . 225 mW Lead temperature (soldering, 10 sec

10、onds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc to 5.5 V dc Maximum input clamp current (IIK) . -18 mA Maximum high level output current (IOH) -1.0 mA Maximum low leve

11、l output current (IOL) . 20 mA Case operating temperature range (TC) -55C to +125C _ 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ Must withstand the added PDdue to short circuit output current test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking pe

12、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, st

13、andards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification

14、for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies o

15、f these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cit

16、ed herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, append

17、ix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML pro

18、duct in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or fun

19、ction of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physica

20、l dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specifie

21、d on figure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply

22、 over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3

23、.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in

24、 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator

25、“C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certifica

26、te of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the req

27、uirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to

28、DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the o

29、ption of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality confor

30、mance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring act

31、ivity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herei

32、n, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following addit

33、ional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction

34、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C Group A su

35、bgroups Limits Unit unless otherwise specified Min Max Positive going threshold voltage VT+VCC= 5.0 V 1/ 1, 2, 3 1.4 2.0 V Negative going threshold voltage VT-VCC= 5.0 V 1/ 1, 2, 3 0.7 1.1 V Hysteresis (VT+- VT-) VTVCC = 5.0 V 2/ 1, 2, 3 0.3 V High level output voltage VOHVCC= 4.5 V, IOH= -1.0 mA, V

36、IN= 0.7 V 1, 2, 3 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 20 mA, VIN= 2.0 V 1, 2, 3 0.5 V Input clamp voltage VIK VCC= 4.5 V, IIK= -18 mA 1 -1.2 V High level input current IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 20 A Input current at maximum input voltage IIH2VCC= 5.5 V, VIN= 7.0 V 1, 2, 3 100

37、 A Low level input current IILVCC= 5.5 V, VIN= 0.5 V 1, 2, 3 -0.6 mA Short circuit output current IOS VCC= 5.5 V, 3/ 1, 2, 3 -60 -150 mA Supply current ICCHVCC= 5.5 V, VIN= GND 1, 2, 3 25 mA ICCLVCC= 5.5 V, VIN= 4.5 V 1, 2, 3 32 mA Functional tests See 4.3.1c VCC= 4.5 V, 5.5 V 7, 8 Propagation delay

38、 time, A to Y tPLHRL= 500 CL= 50 pF VCC= 5.0 V 9 2.5 11 ns See figure 3 VCC= 5.0 V and 5.5 V 10, 11 2.0 13 ns tPHLVCC= 5.0 V 9 3.5 8 ns VCC= 5.0 V and 5.5 V 10, 11 3.0 10 ns 1/ Test not required if used as a forcing function for VOLor VOH. 2/ If not tested, the limits shall be guaranteed to the limi

39、ts specified in Table I. 3/ Not more than one input should be shorted at one time, and the duration of the short circuit condition shall not exceed one second. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-

40、88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D 2 Terminal number Terminal symbol Terminal symbol 1 A1 NC 2 Y 1 A1 3 A2 Y 1 4 Y 2 A2 5 A3 NC 6 Y 3 Y 2 7 GND NC 8 Y 4 A3 9 A4 Y 3 10 Y 5 GND 11 A5 NC 12

41、Y 6 Y 4 13 A6 A4 14 VCCY 5 15 NC 16 A5 17 NC 18 Y 6 19 A6 20 VCCNC = No connection. FIGURE 1. Terminal connections. Input A Output Y L H H L H = High level. L = Low level. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR

42、D MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 NOTES: 1. VX= Unlocked pins must be held at 0.8 V, 2.7 V, or open. RT= Termination resistance ; should be equal to ZOUTof the pulse generator. 2. All input

43、 pulses have the following characteristics: PRR = 1.0 MHz, pulse width = 500 ns, duty cycle = 50 %, tr= tf 2.5 ns. 3. CLincludes probe and jig capacitance. FIGURE 3. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

44、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim ele

45、ctrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections.

46、 a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available

47、 to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted b

48、y method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Go

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