DLA SMD-5962-88767 REV C-2004 MICROCIRCUIT LINEAR MULTIPLYING 12-BIT DIGITAL-TO-ANALOG CONVERTER MONOLITHIC SILICON《硅单片12位数位类比转换器成倍增加线性微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make change to zero-code offset error test as specified in table I. Changes in accordance with N.O.R 5962-R125-96. 96-05-22 M. A. FRYE B Make change to footnote 1 and add footnote 4 as specified in table I. Redrawn. ro 98-02-24 R. MONNIN C Update

2、d drawing to reflect current requirements. rrp 04-05-03 R. MONNIN REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY DAN WONNELL DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY SANDRA ROONEY COLUMBUS, OHIO 43216 http

3、/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, MULTIPLYING, 12-BIT, DIGITAL-TO-ANALOG CONVERTER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-12-20 AMSC N/A REVISION LEVEL C SIZE A CAG

4、E CODE 67268 5962-88767 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E255-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 3

5、 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88767 0

6、1 L X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Relative Accuracy (INL) 01 MAX502A 12-bit multiplying D/A converter 0.5 LSB 02

7、MAX502B 12-bit multiplying D/A converter 0.75 LSB 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in

8、MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. VDDto DGND. -0.3 V dc, +17 V dc VSSto DGND . +0.3 V dc, -17 V dc VREFto AGND 25 V dc RFB to AGND 25 V dc RA to AGND 25 V dc RB to AGND 25 V dc RC to AGND 25 V dc VOUTto AGND . VDD+0.3 V dc, VSS-0.3 V dc 1/ VDDto AGND . -0.3 V dc, +17 V dc AGND

9、 to DGND. -0.3 V dc, VDDDigital input voltage to DGND . -0.3 V dc, VDDPower dissipation (PD), TA= +75C 650 mW 2/ Lead temperature (soldering, 10 seconds) . +300C Storage temperature range . -65C to +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1/ VOUTmay be shorted to AGND, VDD, o

10、r VSSif the power dissipation of the package is not exceeded. 2/ Derate above TA= +75C, 10 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000

11、REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Positive supply voltage (VDD) +11.4 V dc to +15.75 V dc Negative supply voltage (VSS) -11.4 V dc to -15.75 V dc Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specifica

12、tion, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-385

13、35 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Dra

14、wings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preceden

15、ce. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requiremen

16、ts. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who ha

17、s been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modificati

18、ons to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.

19、2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall

20、be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating tem

21、perature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

22、 MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limi

23、ts Unit Min Max Resolution N 1,2,3 All 12 Bits Relative accuracy INL 1 01 0.5 LSB 02 0.75 2,3 01 0.75 02 1.0 Differential Nonlinearity DNL 1,2,3 All 1.0 LSB Zero-code offset error VOE1 All 2 mV 2,3 3 Gain error AERFB, VOUTconnected 1,2,3 All 3.0 LSB RC or RB connected to VOUT, VREF= 5 V 4.5 RA, VOUT

24、connected, VREF= 2.5 V 6.0 Reference input resistance RIN1,2,3 All 8 16 k Application resistor ratio matching RMATCHRA to RB to RC match 1,2,3 All 0.5 % Input current IINVIN= 0 V and VDD1 All 1 A 2,3 10 Input voltage low VIL1,2,3 All 0.8 V Input voltage high VIH1,2,3 All 2.4 V Supply current IDDVOUT

25、unloaded 1,2,3 All 10 mA ISSVOUTunloaded 4 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET

26、6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Power supply rejection PSR VREF= -10 V, -8.9 V, VDD= +15 V 5 %, VDD= +12 V 5 % 1,2,3 All 0.0

27、2 %/% VREF= +10 V, +8.9 V, VSS= -15 V 5 %, VSS= -12 V 5 % 0.02 Output-voltage setting time tSTo 0.01% of full scale 4/ 9,10,11 All 5 s Open-loop gain AVOVOUT= 10 V, RL= 2 k 4/ RFB not connected 4,5,6 All 90 dB Chip select to write-setup time tCSSee figure 3 9,10,11 All 0 ns Write pulse width tWRSee

28、figure 3 9 All 40 ns 10,11 60 Data-setup time tDSSee figure 3 9,10,11 All 60 ns Data-hold time tDHSee figure 3 9,10,11 All 10 ns Functional test FT See 4.3.1b 7,8 All 1/ VREF= +10 V dc, AGND = DGND = 0 V dc, RL= 2 k, and CL= 100 pF. Dual supply: VDD= +11.4 V to +15.75 V, VSS= -11.4 to -15.75 V 2/ VO

29、UTmust be less than VDD- 2.5 V and greater than VSS+2.5 V to ensure correct operation. 3/ Unused feedback resistors should be shorted to analog ground. 4/ Parameter is guaranteed to the limts specified but is not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without li

30、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device type All Case outline L Terminal number Terminal symbol 1 VOUT2 D11 3 D10 4 D95 D8 6 D77 D68 D59 D4 10 D311 D212 DGND 13 D

31、1 14 D015 WR 16 CS 17 VREF18 AGND19 VSS20 VDD21 RA22 RB23 RC 24 RFB FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-50

32、00 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 WR CS Operation H X No operation X H No operation L L Input register is transparent L R Input register is latched R L Input register is latched H = high state, L = low state, R = rising edge, X = dont care FIGURE 2. Truth table. FIGURE 4. Timing diag

33、ram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance w

34、ith MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962

35、 on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identif

36、y when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an appro

37、ved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits del

38、ivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required

39、documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004

40、 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revisi

41、on level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interi

42、m and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 o

43、f MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7 and 8 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or n

44、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88767 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance wit

45、h MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*,2,3,4,5,6,7,8,9,10,11 Group A test requirements (method 5005) 1,2,3,4,5,6,7,8,9,10,11 Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to s

46、ubgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revisi

47、on level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test

48、duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.