1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Y. Add vendor CAGE 69210. Editorial changes throughout. 90-06-21 M. A. FRYE B Add case outline Z and make corrections to case outline Y terminal connections under figure 2 in accordance with N.O.R. 5962-R089-93. 93-03-15 M. A. FR
2、YE C Add radiation hardened requirements. Redrawn. - ro 00-03-01 R. MONNIN D Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. Update the descriptive designators under 1.2.3 and delete figure 1 - ro 08-05-16 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHE
3、T REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY GARY ZAHN DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS A
4、PPROVED BY MICHAEL A. FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-06-06 MICROCIRCUIT, LINEAR, ADJUSTABLE POSITIVE, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-89520 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E318-
5、08 Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B
6、 microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962 R 89520 01 Y A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Case outline (see 1.2.3)Lead finish (see 1.2.
7、4) / / Drawing number 1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit
8、function as follows: Device type Generic number Circuit function 01 1830, 1083, 183 7.5 A adjustable positive regulator 1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X MBFM1-P2 2 TO-3 flange
9、mount Y MSFM3-P3 3 TO-258 single row flange mounted with a isolated tab and glass sealed Z MSFM3-P3 3 TO-258 single row flange mounted with a non-isolated tab and glass sealed 1.2.4 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Output curren
10、t (IOUT) 7.5 A Input to output voltage differential . 35 V dc Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +150C Power dissipation (PD) Internally limited Thermal resistance, junction-to-case (JC): Cases X and Z 1.6C/W Case Y
11、2.75C/W Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Input to output voltage differential . 25 V dc Output current (IOUT)
12、 10 mA Full load current (IFL) 5.0 A Ambient operating temperature range (TA) . -55C to +125C 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads(Si) / s) 100 Krads (Si) 1/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specifi
13、cation, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Spec
14、ification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings.
15、 (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text
16、 of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ These parts may be dose rate sensitive in a space environment and may demonst
17、rate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU
18、S, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by
19、 a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance wi
20、th MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certificati
21、on mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outline
22、s shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specifi
23、ed herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup
24、 are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to spa
25、ce limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“
26、 or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The cer
27、tificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PR
28、F-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain
29、the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO
30、 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Reference voltage VREF|VIN VOUT| = 3.0 V, IOUT= 10 mA 1 01 1.238 1.262 V
31、 M,D,P,L,R 1 1.238 1.262 1.5 V |VIN VOUT| 25 V, 10 mA IOUT 5.0 A 1,2,3 1.225 1.270 M,D,P,L,R 1 1.225 1.270 Line regulation 3/ VOUT/ 1.5 V |VIN VOUT| 15 V, 1 01 0.2 % VINIOUT= 10 mA M,D,P,L,R 1 0.2 15 V |VIN VOUT| 35 V, 2,3 0.5 IOUT= 10 mA Load regulation 3/ VOUT/ |VIN VOUT| = 3.0 V, 1 01 0.3 % IOUT1
32、0 mA IOUT 5.0 A 2,3 0.4 M,D,P,L,R 1 0.3 Dropout voltage VDOIOUT= IFULLload, 1,2,3 01 1.5 V IFULLload = 5.0 A, VREF= 1 % M,D,P,L,R 1 1.5 Thermal regulation 30 ms pulse, TA= +25C 1 01 0.01 % / W M,D,P,L,R 1 0.01 Ripple rejection VIN/ VOUT4,5,6 01 60 dB f = 120 Hz, CADJ= 25 F, COUT= 25 F (tantalum), IO
33、UT= IFULLload, IFULLload = 5.0 A, |VIN VOUT| = 3.0 V M,D,P,L,R 4 60 See footnotes at end of table. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electr
34、ical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Adjust pin current IADJ1.5 V |VIN VOUT| 25 V, 1,2,3 01 120 A 10 mA IOUT 5.0 A M,D,P,L,R 1 120 Adjust pin current change IADJ10 mA IOUT
35、 5.0 A, 1.5 V |VIN VOUT| 25 V 1,2,3 01 5.0 A M,D,P,L,R 1 5.0 Minimum load current IMIN|VIN VOUT| = 25 V 1,2,3 01 10 mA M,D,P,L,R 1 10 Current limit ILIM|VIN VOUT| = 5.0 V 1,2,3 01 8.0 A M,D,P,L,R 1 8.0 |VIN VOUT| = 25 V 1,2,3 0.4 M,D,P,L,R 1 0.4 Temperature stability 4/ VOUT/ T -55C TJ +125C 1,2,3 0
36、1 1.5 % Long term stability 4/ VOUT/ t TA= +125C, t = 1000 hrs. 2 01 1.0 % 1/ RHA devices supplied to this drawing have been characterized through all levels M, D, P, L, R of irradiation. However, this device is only tested at the “R” level. Pre and Post irradiation values are identical unless other
37、wise specified in Table I. When performing post irradiation electrical measurements for any RHA level, TA= +25C. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed onl
38、y for the conditions specified in MIL-STD-883, method 1019, condition A. 3/ Line and load regulation are measured at a constant junction temperature using a low duty cycle pulse technique. Although power dissipation is internally limited, regulation is guaranteed up to the maximum power dissipation
39、of 60 W. Power dissipation is determined by the input / output differential voltage and the output current. Guaranteed maximum power dissipation will not be available over the full input / output voltage range. 4/ Guaranteed by design, characterization or correlation to other tested parameters. Prov
40、ided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines X Y Z Terminal number Terminal symbols 1 ADJUSTMENTS ADJUSTMENTS ADJUSTMENTS 2 VINOUTPUT
41、OUTPUT 3 OUTPUTVINVINNOTES: For case outline X, the case is the OUTPUT. For case outline Y, the tab is a no connection. For case outline Z, the tab is the OUTPUT. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHSSTANDARD MIC
42、ROCIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Case outline Y FIGURE 2. Radiation exposure circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHSSTANDARD MICRO
43、CIRCUIT DRAWING SIZE A 5962-89520 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening sh
44、all be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by t
45、he manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-8
46、83. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shal
47、l be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be
48、 omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accorda
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