DLA SMD-5962-89521 REV G-2009 MICROCIRCUIT LINEAR ADJUSTABLE POSITIVE LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Y. Add vendor CAGE 69210. Editorial changes throughout. 90-08-07 M. A. FRYE B Make changes to the line regulation and thermal regulation tests in accordance with NOR 5962-R150-92. 92-03-25 M. A. FRYE C Add case outline Z and make

2、 corrections to case outline Y terminal connections under figure 2 in accordance with NOR 5962-R091-93. 93-03-15 M. A. FRYE D Add vendor CAGE 0EU86, case outline 2, and terminal connections under figure 2 in accordance with NOR 5962-R001-95. 94-10-21 M. A. FRYE E Add radiation hardness requirements.

3、 Redrawn. - rrp 00-03-24 R. MONNIN F Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. Update the descriptive designators under 1.2.3 and delete figure 1. - ro 08-05-16 R. HEBER G Add case outline U, MSFM1-P3. Make changes to 1.2.3, 1.3, 3.5, and figure 1. - ro 09-04-28 J. RODENBECK

4、THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY GARY ZAHN CHECKED BY RAY MONNIN DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY MICHA

5、EL A. FRYE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-06-13 MICROCIRCUIT, LINEAR, ADJUSTABLE, POSITIVE, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE

6、CODE 67268 5962-89521 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E262-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 D

7、SCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962 R 89521 0

8、1 Y A Federal RHA Device Case Lead stock class designator type outline finish designator (see 1.2.1) (see 1.2.2) (see 1.2.3) (see 1.2.4) / / Drawing number 1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA levels and shall be marked with

9、 the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1084 5.0 A adjustable positive regulator 1.2.3 Case outline(s). The case outline(s) are as designa

10、ted in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style U MSFM1-P3 3 TO-257 single row flange mounted with isolated tab and glass seal X MBFM1-P2 2 TO-3 flange mount Y MSFM3-P3 3 TO-258 single row flange mounted with isolated tab and glass seal Z MSFM3-P3 3

11、TO-258 single row flange mounted with non-isolated tab and glass seal 2 CQCC1-N20 20 Square leadless chip carrier 1.2.4 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR

12、D MICROCIRCUIT DRAWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. Input to output voltage differential . 35 V Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds

13、) . +300C Power dissipation (PD) Internally limited Output current (IOUT) 5.0 A Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC): Case U 4.0C/W Cases X and Y 3.0C/W Case Z 2.3C/W Case 2 . 20C/W 1.4 Recommended operating conditions. Input to output voltage differential . 25

14、 V dc Output current (IOUT) 10 mA Full load current (IFL) 3.0 A Ambient operating temperature range (TA) . -55C to +125C 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads(Si) / s) 100 Krads (Si) 1/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handb

15、ooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits,

16、Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Stan

17、dard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text o

18、f this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ These parts may be dose rate sensitive in a space environment and may demonstra

19、te enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR

20、AWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as speci

21、fied herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved

22、program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not

23、affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535

24、, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2. 3.3 El

25、ectrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups

26、 specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where m

27、arking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall b

28、e marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compl

29、iance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements o

30、f MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA sha

31、ll be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of th

32、e reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charac

33、teristics. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Reference voltage VREF(VIN- VOUT) = 3.0 V, 1 01 1.238 1.262 V IOUT= 10 mA M,D,P,L,R 1 1.238 1.262 1.5 V (VIN VOUT) 25 V, 10 mA IOUT 3.0 A 1,2,3 1.225 1.270 M,D,P,L,R 1 1

34、.225 1.270 Line regulation 3/ 1.5 V (VIN VOUT) 15 V, 1,2,3 01 0.2 % VOUT/ VINIOUT= 10 mA M,D,P,L,R 1 0.2 15 V (VIN VOUT) 35 V, 1,2,3 0.5 IOUT= 10 mA M,D,P,L,R 1 0.5 Load regulation 3/ VOUT/ VIN(VIN VOUT) = 3.0 V, 10 mA IOUT 3.0 A 1 01 0.3 % M,D,P,L,R 1 0.3 (VIN VOUT) = 3.0 V, 10 mA IOUT 3.0 A 2,3 0.

35、4 Dropout voltage VDOIOUT= 3.0 A, VREF= 1% 1,2,3 01 1.5 V M,D,P,L,R 1 1.5 Thermal regulation - 30 ms pulse, TA= +25C 1 01 0.015 % / W M,D,P,L,R 1 0.015 Ripple rejection VIN/ VOUT4,5,6 01 60 dB f = 120 Hz, CADJ= 25 F, COUT= 25 F (tantalum), IOUT= 3.0 A, (VIN VOUT) = 3.0 V M,D,P,L,R 4 60 Adjust pin cu

36、rrent IADJ1.5 V (VIN VOUT) 25 V, IOUT= 10 mA, 1,2,3 01 120 A IOUT= 3.0 A M,D,P,L,R 1 120 Adjust pin current change IADJ10 mA IOUT 3.0 A, 1.5 V (VIN VOUT) 25 V 1,2,3 01 5.0 A M,D,P,L,R 1 5.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without li

37、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specifie

38、d Group A subgroups Device type Limits Unit Min Max Minimum load current IMIN(VIN VOUT) = 25 V 1,2,3 01 10 mA M,D,P,L,R 1 10 Current limit ILIM(VIN VOUT) 5.0 V 1,2,3 01 5.5 A M,D,P,L,R 1 5.5 (VIN VOUT) = 25 V 1,2,3 0.3 M,D,P,L,R 1 0.3 Temperature 4/ stability VOUT/ T -55C TJ +125C 1,2,3 01 1.5 % M,D

39、,P,L,R 1 1.5 Long term stability 4/ VOUT/ T TA= +125C, t = 1000 hours 2 01 1.0 % 1/ RHA devices supplied to this drawing have been characterized through all levels M, D, P, L, R of irradiation. However, this device is only tested at the “R” level. Pre and Post irradiation values are identical unless

40、 otherwise specified in Table I. When performing post irradiation electrical measurements for any RHA level, TA= +25C. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guarante

41、ed only for the conditions specified in MIL-STD-883, method 1019, condition A. 3/ Line and load regulation are measured at a constant junction temperature using a low duty cycle pulse technique. Although power dissipation is internally limited, regulation is guaranteed up to the maximum power dissip

42、ation of 45 W. Power dissipation is determined by the input/output differential voltage and the output current. Guaranteed maximum power dissipation will not be available over the full input/output voltage range. 4/ Guaranteed, if not tested, to the limits specified. Provided by IHSNot for ResaleNo

43、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines U X Y Z 2 Terminal number Terminal symbol 1 ADJUSTMEN

44、T ADJUSTMENT ADJUSTMENT ADJUSTMENT NC 2 OUTPUT VINOUTPUT OUTPUT OUTPUT 3 VINOUTPUT (CASE) VINVINNC 4 - - NC OUTPUT ADJUSTMENT 5 - - - - NC 6 - - - - NC 7 - - - - NC 8 - - - - NC 9 - - - - NC 10 - - - - NC 11 - - - - VIN12 - - - - OUTPUT13 - - - - NC 14 - - - - NC 15 - - - - VIN16 - - - - NC 17 - - -

45、 - NC 18 - - - - NC 19 - - - - NC 20 - - - - OUTPUT NOTE: NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

46、 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Case Y FIGURE 2. Radiation exposure circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89521 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321

47、8-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circui