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本文(DLA SMD-5962-89538 REV B-2011 MICROCIRCUIT MEMORY DIGITAL CMOS 16K X 8 UV EPROM POWER DOWN MONOLITHIC SILICON.pdf)为本站会员(deputyduring120)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-89538 REV B-2011 MICROCIRCUIT MEMORY DIGITAL CMOS 16K X 8 UV EPROM POWER DOWN MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 03 for vendor CAGE number 65786. Add a reprogrammability test to 4.3.2. Change to margin test method A. Editorial changes throughout. 93-01-12 M. A. Frye B Moved endurance and data retention testing requirements from Section 4 o

2、f drawing to Section 3 of drawing. Updated body of drawing to reflect current requirements. - glg 11-03-15 Charles Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY K

3、enneth Rice DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY Donald Cool MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16K X 8 UV EPROM, POWER DOWN, MONOLITHIC SILICON AN

4、D AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-01-26 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89538 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E276-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

5、DRAWING SIZE A 5962-89538 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Par

6、t or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-89538 01 X A | | | | | | | | | | | | Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function a

7、s follows: Device type Generic number Circuit Access time 01 (see 6.6) 16K x 8 UV EPROM 65 ns 02 (see 6.6) 16K x 8 UV EPROM 55 ns 03 (see 6.6) 16K x 8 UV EPROM 45 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designat

8、or Terminals Package style U CQCC1-N32 32 Rectangular leadless chip carrier 1/ X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 1/ Z GDFP2-F28 28 Flat package 1/ 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range to ground pote

9、ntial (VCC) . -0.5 V dc to +7.0 V dc DC voltage applied to Outputs in the high Z -0.5 V dc to +7.0 V dc DC input voltage . -3.0 V dc to +7.0 V dc Thermal resistance, junction-to-case (JC): Case outlines U, X and Z See MIL-STD-1835 Maximum power dissipation (PD) 2/ 1.0 W Junction temperature (TJ) . +

10、175C Lead temperature (soldering, 10 seconds maximum) . +260C Storage temperature range . -65C to +150C Temperature under bias -55C to +125C Data retention 10 years, minimum Endurance . 25 cycles/byte, minimum 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc

11、Input high voltage range (VIH) +2.0 V dc Input low voltage range (VIL) +0.8 V dc Case operating temperature range (TC) . -55C to +125C 1/ Lid shall be transparent to permit ultraviolet light erasure. 2/ Must withstand the added PD due to short circuit test; e.g. , IOS. Provided by IHSNot for ResaleN

12、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89538 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The follo

13、wing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing,

14、General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircu

15、it Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing

16、 and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements shall be in accordance with

17、 MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may b

18、e processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not af

19、fect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535,

20、appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices. The trut

21、h table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be programmed by the manufacturer prior to test in a checkerboard pattern or equivalent (a minimum of 50 perc

22、ent of the total number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed. 3.2.3.2 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing. 3.3 Electrical performance c

23、haracteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. T

24、he electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where the entire SMD PIN number

25、is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89538 DLA LAND AND MARITIME COLUMBUS, OHIO 4

26、3218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Ma

27、ritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be prov

28、ided with each lot of microcircuits delivered to this drawing. 3.8 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark

29、in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.9 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.10 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent

30、 and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.11 Processing EPROMS. All testing requirements and quality assurance provisions herein sha

31、ll be satisfied by the manufacturer prior to delivery. 3.11.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.4. 3.11.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern usin

32、g the procedures and characteristics specified in 4.5. 3.11.3 Verification of state of EPROMS. When specified, devices shall be verified as either programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all b

33、its are in the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed from the lot. 3.12 Endurance. A reprogrammability test shall be completed as part of the vendors reliability monitors. This reprogrammability test shall be done

34、for initial characterization and after any design or process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase endurance cycles listed in section 1.3 herein over the full military temperatu

35、re range. The vendors procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. 3.13 Data retention. A data retention stress test shall be completed as part of the vendors reliability monitors. This test shal

36、l be done for initial characterization and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendors procedure shall

37、 be kept under document control and shall be made available upon request of the acquiring or preparing activity, along with test data. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89538 DLA LAND AND MARITI

38、ME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C 4.5 V dc VCC 5.5 V dc unless otherwise specified Group A subgroups Device types Limits Unit Min Max Output low voltage VOLVIN= VIHor VIL,

39、IOL= 16 mA, VCC = 4.5 V 1, 2, 3 All 0.5 V Output high voltage VOHVIN= VIHor VIL, IOH= -4.0 mA, VCC = 4.5 V 1, 2, 3 All 2.4 Input high voltage 1/ VIH1, 2, 3 All 2.0 V Input low voltage 1/ VIL1, 2, 3 All 0.8 Input leakage current IIXVIN= GND to 5.5 V 1, 2, 3 All -10 +10 A Output leakage current IOZVCC

40、= 5.5 V, IOUT= 0 mA VOUT= GND and 5.5 V 1, 2, 3 All -40 +40 A Output short circuit current 2/ 3/ IOSVCC= 5.5 V, VOUT=0.0 V 1, 2, 3 All -20 -90 mA Power supply current ICCVCC= 5.5 V, IOUT= 0 mA f = 16.7 MHz Inputs cycling from 0 to 3 V 1, 2, 3 All 120 mA Input capacitance 3/ CINVIN= 0 V, VCC= 5.0 V f

41、 = 1 MHz, TA= +25C See 4.3.1c 4 All 10 pF Output capacitance 3/ COUTVOUT= 0 V, VCC= 5.0 V f = 1 MHz, TA= +25C See 4.3.1c 4 All 10 pF Functional tests See 4.3.1d 7, 8A, 8B All Address to output valid 4/ tAAVCC= 4.5 V See figure 4 9, 10, 11 01 65 ns 02 55 03 45 Chip select active to output valid 4/ 5/

42、 tACS9, 10, 11 01 35 ns 02 30 03 25 Chip select inactive to high-Z 3/ 4/ 5/ 6/ tHZCS9, 10, 11 01 35 ns 02 30 03 25 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89538 DLA LAND

43、 AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. 1/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included. 2/ For test purposes, not more

44、 than one output at a time may be shorted. Short circuit test duration should not exceed one second. 3/ Tested initially and after any design or process change which may affect that parameter, and therefore shall be guaranteed to the limits specified in table I. 4/ AC tests are performed with input

45、rise and fall times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 V to 3.0 V, and the output load in figure 3, circuit A. 5/ Parameter applies to all chip selects. 6/ Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the outpu

46、t from 1.5 V level on the input and the output load in figure 3, circuit B. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89538 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC

47、FORM 2234 APR 97 Device types 01 - 03 Case outlines X , Z U Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 A9A8A7A6A5A4A3A2A1A0O0O1O2GND O3O4O5O6O7CS4CS3CS2CS1A13A12A11A10VCC- - - - A9A8A7A6A5A4A3A2A1A0NC O0O1O2 NC GND O3 NC O4O

48、5 O6O7 NC CS4CS3CS2CS1A13A12A11A10VCCNC = no connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89538 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Mode CS4CS3CS2CS1A13- A0Power Outputs Read VILVIHVILVILX ICCData out Output

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