DLA SMD-5962-89621 REV E-2011 MICROCIRCUIT LINEAR HIGH SPEED OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline H and 2. Make changes to 1.3, 6.6, and figure 1. Changes in accordance with N.O.R. 5962-R077-92. 91-12-05 M. A. FRYE B Add case outline X which is a 10 lead flat pack. Make changes to 1.2.2, 1.3, and figure 1. Redrawn. - ro 97-12

2、-09 R. MONNIN C Add device class V devices. Make changes to boilerplate, table II and add table IIB. - ro 98-11-13 R. MONNIN D Deleted figure 1. Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. -rrp 03-05-22 R. MONNIN E Update boilerplate paragraphs to current MIL-PRF-38535 require

3、ments. - ro 11-03-10 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDA

4、RD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES REUSING APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-01-19 AMSC N/A REVISION L

5、EVEL E SIZE A CAGE CODE 67268 5962-89621 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E200-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89621 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E

6、 SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Iden

7、tifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 89621 01 H A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.

8、2)Case outline (see 1.2.4)Lead finish (see 1.2.5) / /Drawing number For device class V: 5962 - 89621 01 V P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RH

9、A designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash

10、 (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM6161 High speed operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the pro

11、duct assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-ce

12、rtification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA

13、RD MICROCIRCUIT DRAWING SIZE A 5962-89621 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style H GDFP1-

14、F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X GDFP1-G10 10 Flat pack with gull wing leads 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M

15、. 1.3 Absolute maximum ratings. 1/ Supply voltage (V+ to V-) 36 V Differential input voltage 2/ 8 V Common-mode voltage (V+ -0.7 V) to (V- -7 V) Output short circuit to GND 3/ Continuous Operating supply voltage range 4.75 V to 32 V Power dissipation (PD) (all cases) 400 mW Storage temperature range

16、 . -65C to +150C Lead temperature (soldering, 10 seconds) . +260C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC): Cases H, P, and X . 21C/W Case 2 . 20C/W Thermal resistance, junction-to-ambient (JA): Cases H and X 228C/W still air 140C/W at 500 linear feet per minute Ca

17、se P 113C/W still air 51C/W at 500 linear feet per minute Case 2 . 90C/W still air 61C/W at 500 linear feet per minute 1.4 Recommended operating conditions. Positive supply voltage (V+) . +15 V Negative supply voltage (V-) . -15 V Ambient operating temperature range (TA) -55C to +125C _ 1/ Stresses

18、above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ In order to achieve optimum ac performance, the input stage was designed without protective clamps. Exceeding the maximum differenti

19、al input voltage results in reverse breakdown of the base-emitter junction of one of the input transistors and probable degradation of the input parameters (especially, VIOand IIO). 3/ Continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junc

20、tion temperature of +150C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89621 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Gove

21、rnment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICA

22、TION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard

23、Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In

24、 the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. Th

25、e individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The in

26、dividual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 a

27、nd herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance charact

28、eristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The elect

29、rical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the enti

30、re SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for

31、 device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appe

32、ndix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89621 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Te

33、st Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIO1 01 -7 7 mV 2,3 -10 10 Input bias current IIB1 01 -3 3 A 2,3 -6 6 Input offset current IIO1 01 -350 350 nA 2,3 -800 800 Large signal voltage gain AVSVOUT= 10 V, 1/

34、 1 01 550 mV/V RL= 2 k 2,3 300 Positive common-mode voltage range +VCMVS= 15 V 1 01 13.9 V 2,3 13.8 VS= 5 V 1 3.9 2,3 3.8 Negative common-mode voltage range -VCMVS= 15 V 1 01 -12.9 V 2,3 -12.7 VS= 5 V 1 -2.0 2,3 -2.2 Common-mode rejection ratio CMRR -12.9 V VCM 13.9 V 1 01 80 dB -12.7 V VCM 13.8 V 2

35、,3 74 Power supply rejection ratio PSRR 10 V VS 16 V 1 01 80 dB 2,3 74 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89621 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVI

36、SION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Positive voltage swing +VOPVS= 15 V, RL= 2 k 1 01 13.5 V 2,3 13.3 VS= 5 V, RL= 2 k

37、 1 3.5 2,3 3.3 Negative voltage swing -VOPVS= 15 V, RL= 2 k 1 01 -13.0 V 2,3 -12.7 VS= 5 V, RL= 2 k 1 -1.7 2,3 -2.0 Output short circuit current IOSSource 1 01 -30 mA 2,3 -20 Sink 1 30 2,3 20 Supply current ICC1 01 6.5 mA 2,3 6.8 Gain bandwidth product GBW f = 20 MHz 4 01 40 MHz 5,6 30 Positive slew

38、 rate +SR Output step = -4 V to +4 V, 4 01 200 V/s AV= +1, VIN= 8 V step 5,6 180 Negative slew rate -SR Output step = +4 V to -4 V, 4 01 200 V/s AV= +1, VIN= 8 V step 5,6 180 Settling time tS10 V step to 0.1 %, 9 01 300 ns RL= 2 k, AV= -1 10,11 325 1/ Voltage gain is the total output swing (20 V) di

39、vided by the input signal required to produce that swing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89621 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 D

40、evice type 01 Case outlines H and X P 2 Terminal number Terminal symbol 1 NC VIOADJ NC 2 VIOADJ INV INPUT VIOADJ 3 INV INPUT NONINV INPUT NC 4 NONINV INPUT V- NC5 V- NC INV INPUT 6 NC VOUTNC 7 VOUTV+ NONINV INPUT 8 V+VIOADJ NC 9 VIOADJ - NC 10 NC - V- 11 - - NC 12 - - NC 13 - - NC 14 - - NC 15 - - V

41、OUT16 - - NC 17 - - V+ 18 - - NC 19 - - NC 20 - - VIOADJ NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89621 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-399

42、0 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate

43、of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the ma

44、nufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or

45、 for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to

46、 this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required docu

47、mentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Samplin

48、g and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Scr