DLA SMD-5962-89637 REV B-2004 MICROCIRCUIT LINEAR WIDEBAND RMS-TO-DC CONVERTER MONOLITHIC SILICON《硅单片 宽带有效值芯片 线性微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - lgt 01-06-13 Raymond Monnin B Corrections to table I test conditions and footnote. Editorial changes throughout. -drw 04-06-14 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REP

2、LACED. REV SHET REV SHET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY

3、ALL DEPARTMENTS APPROVED BY Michael Frye MICROCIRCUIT, LINEAR, WIDEBAND RMS-TO-DC CONVERTER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-01-02 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89637 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E311-04 DISTRIB

4、UTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET

5、2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89637

6、01 C A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 AD637 Wideband RMS-to-DC converter 1.2.2 Case outline. The case outline is as des

7、ignated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Positive supply voltage (+VS) +18 V dc Negativ

8、e supply voltage (-VS) -18 V dc Output short circuit duration Indefinite Storage temperature range. -65C to +150C Lead temperature (soldering, 10 seconds). +300C Internal quiescent power dissipation. 108 mW Thermal resistance, junction to case (JC) See MIL-STD-1835 Thermal resistance, junction to am

9、bient (JA). 95C/W Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Positive supply voltage (+VS) +15 V dc Negative supply voltage (-VS) -15 V dc Ambient operating temperature range (TA). -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without

10、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and ha

11、ndbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT

12、 OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documen

13、ts are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the refere

14、nces cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535

15、, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as

16、 QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit

17、, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and

18、 physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Functional block diagram. The functional block diagram shall be as specified on figure 2. 3.2.3 Case outline. The case out

19、line shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. Th

20、e electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 DEFENSE SUPP

21、LY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-H

22、DBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices

23、 built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a

24、manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and

25、 the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance wi

26、th MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION

27、 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additi

28、onal criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit s

29、hall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical para

30、meter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B

31、 SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions +VS= +15 V, -VS= -15 V -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxTotal error ETVIN= 0 V to 10 V 1 01 1/ 1/ 2, 3 1/ Total error versus positive supply

32、STVE+5.0 V +VS +15 V 1, 2, 3 01 150 V/V Total error versus negative supply STV-E-5.0 V -VS -15 V 1 01 300 V/V 2 500 DC reversal error ETRVIN= 2.0 V, TA= +25C 1 01 .25 % of reading 2.0 V fullscale nonlinearity NL110 mV |VIN| 2.0 V 1 01 .04 % of FS 2, 3 .06 7.0 V fullscale nonlinearity NL210 mV |VIN|

33、7.0 V 1 01 .05 % of FS 2, 3 .14 Output offset voltage VOSOVIN= GND 1 01 1.0 mV 2, 3 6.0 Output offset voltage temperature coefficient TVOSOVIN= GND 2, 3 01 .07 mV/C Output voltage swing at RMS OUT VOPRL= 2.0 k 1, 2, 3 01 12 V IREF0 2/ for 0 dB = 1.0 V rms IREF1TA= 25C 1 01 5.0 80 A IREFrange 2/ IREF

34、2TA= 25C 1 01 1.0 100 A Buffer input offset voltage VOS2TA= 25C 1 01 2.0 mV Buffer input current IINTA= 25C 1 01 10 nA Denominator input resistance 2/ RDENTA= 25C 4 01 20 30 k Denominator input offset voltage 2/ VOS3TA= 25C 1 01 0.5 mV Power supply range VSTA= 25C 1 01 3.0 18 V Quiescent current IQV

35、S= 18 V 1, 2, 3 01 3.0 mA Standby current ISBVCS 0.2 V, TA= +25C 1 01 450 A 1/ For subgroup 1, the maximum total error is 1.0 mV 0.5% of reading. For subgroup 2 and 3, the maximum total error is 6.0 mV 0.7% of reading. Total error represents the maximum deviation of the dc component of the output vo

36、ltage from the theoretical output value over a specified range of signal amplitude and frequency. It is shown as the sum of a fixed error and a component proportional to the theoretical output (percentage of reading). The fixed error component includes all offset errors and irreducible nonlinearitie

37、s; the percentage of reading component includes the linear scale-factor error. 2/ If not tested, shall be guaranteed to the limits specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 D

38、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline C Terminal number Terminal symbol 1 BUF IN2 NC 3 COMMON 4 OFFSET NULL 5 CS 6 VREF7 dB 8 CAVG9 RMS OUT 10 -VS11 +VS12 NC 13 VIN14 BUF OUT NC = No connection FIGURE 1. Ter

39、minal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Functional block diag

40、ram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-S

41、TD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3 Group A test requirements (method 5005) 1, 2, 3, 4* Groups C and D end-point electrical parameters (method 5

42、005) 1 * PDA applies to subgroup 1. * Subgroups 4, if not tested shall be guaranteed to the limits specified in table I herein. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The f

43、ollowing additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as spec

44、ified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request

45、. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNo

46、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89637 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packa

47、ging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered b

48、y this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD