DLA SMD-5962-89808 REV B-2002 MICROCIRCUIT LINEAR DIGITAL TO ANALOG CONVERTER 12 BIT HIGH SPEED MONOLITHIC SILICON《硅单片 高速12位数字模拟转变器 线性微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R057-93. 92-12-29 M. A. FRYE B Drawing updated to reflect current requirements. - ro 02-03-07 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B

2、B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY DAN WONNELL DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY SANDRA ROONEY COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICR

3、OCIRCUIT, LINEAR, DIGITAL TO ANALOG CONVERTER, 12 BIT, HIGH SPEED, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-07-15 MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89808 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E193-02 DISTRIBUTION STATEMENT A. Approv

4、ed for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1

5、. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89808 01 L X Drawing number Dev

6、ice type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD568SQ 12-bit high speed D/A converter 02 AD568SE 12-bit high speed D/A converter 1.2.2 Case outlin

7、e(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish i

8、s as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. VCCto reference common range 0 V dc to +18 V dc VEEto reference common range 0 V dc to -18 V dc Reference common to ladder common range . +100 mV to -10 V dc Analog common to ladder common 100 mV Threshold common to ladder co

9、mmon 500 mV 10 V span resistor to ladder common . 12 V Bipolar offset to ladder common . 5 V IOUTto ladder common . -5 V dc to threshold control Digital inputs to threshold common range . -500 mV to +7.0 V dc Voltage across span resistor . 12 V dc Threshold control to threshold common range -0.7 V d

10、c to +1.4 V dc Logic threshold control input current . 5 mA Power dissipation (PD): Cases J and L . 1000 mW Case 3 600 mW Storage temperature range . -65C to +150C Junction temperature (TJ) . 200C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAND

11、ARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. Thermal resistance junction-to-case (JC): Cases J and L . 25C/W Case 3 42C/W Thermal resistance junction-to-ambient (JA): C

12、ases J and L . 75C/W Case 3 125C/W 1.4 Recommended operating conditions. VCCto reference common range +13.5 V dc to +16.5 V dc VEEto reference common range -13.5 V dc to -16.5 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standard

13、s, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and

14、supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component C

15、ase Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbi

16、ns Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless

17、a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIRE

18、MENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer

19、 or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM)

20、 plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QM

21、L flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The

22、terminal connections shall be as specified on figure 1. 3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table

23、I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-

24、PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has

25、the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accor

26、dance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to D

27、SCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

28、 with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufact

29、urers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY

30、 CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VCC= +15 V, VEE= -15 V Group A subgroups Device type Limits 1/ Unit unless otherwise specified Min Max Relative accuracy RA

31、IOUTmode 1 All -0.5 +0.5 LSB 2,3 01 -0.75 +0.75 02 -1 +1 Differential nonlinearity DNL IOUTmode 1,2,3 All -1 +1 LSB Gain error AEAll bits on, IOUTmode 1 All -1 +1 % of FSR Gain drift temperature coefficient TCAEAll bits on, VOUTmode 2,3 01 -50 +50 ppm of FSR/C 02 -60 +60 All bits on, IOUTmode All -1

32、50 +150 Unipolar offset UOSAll bits off, IOUTmode 1 All -0.2 +0.2 % of FSR Unipolar offset temperature coefficient TCUOSAll bits off, VOUTmode 2,3 All -5 +5 ppm of FSR/C Bipolar offset BPOSIOUTmode, all bits off bipolar 1 All -1.0 +1.0 % of FSR Bipolar offset temperature coefficient TCBPOSVOUTmode,

33、2,3 01 -30 +30 ppm of FSR/C all bits off bipolar 02 -40 +40 Bipolar zero BPZEIOUTmode, MSB on, all other bits off bipolar 1 All -0.2 +0.2 % of FSR Bipolar zero temperature coefficient TCBPZEVOUTmode, MSB on, all other bits off bipolar 2,3 All -15 +15 ppm of FSR/C High input voltage VIH1,2,3 All 2.0

34、7.0 V Low input voltage VIL1,2,3 All 0.0 0.8 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SH

35、EET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C VCC= +15 V, VEE= -15 V Group A subgroups Device type Limits 1/ Unit unless otherwise specified Min Max High input current IIHVIH= 7 V 1,2,3 All -10.0 +10.0 A Low input current

36、IILVIL= 0.0 V 1 All -100 -0.5 A 2,3 -200 -0.5 Output current IOUnipolar, all bits on 1 All 10.137 10.343 mA 2,3 9.985 10.50 Bipolar, all bits on 1 5.017 5.223 2,3 4.942 5.300 Output voltage VOUnipolar, all bits on 1 All 1.014 1.034 V 2,3 1.008 1.040 Bipolar, all bits on 1 0.507 0.517 2,3 0.504 0.520

37、 Compliance voltage VC2/ 1,2,3 All -2 +1.2 V Output resistance exclusive of RLROE2/ 1,2,3 All 160 240 Output resistance inclusive of RLROI2/ 1,2,3 All 99 101 Settling time tSLCurrent to 0.025 % 2/ of FSR 9 All 120 ns 10,11 165 Current to 0.1 % 2/ of FSR 9 125 10,11 130 See footnotes at end of table.

38、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics C

39、ontinued. Test Symbol Conditions -55C TA +125C VCC= +15 V, VEE= -15 V Group A subgroups Device type Limits 1/ Unit unless otherwise specified Min Max Rise time tRFrom 10 % to 90 %, 2/ VOUTmode 9,10,11 All 20 ns Fall time tFFrom 90 % to 10 %, 2/ VOUTmode 9,10,11 All 20 ns Power supply current ICCVCC=

40、 16.5 V, VEE= -16.5 V, VOUT= 5 V 1,2,3 All 32 mA IEEVCC= 16.5 V, VEE= -16.5 V, VOUT= 5 V -8 Power supply rejection ratio +PSRR 13.5 V VCC 16.5 V, 1 All 0.05 % of FSR/V VEE= -15 V 2,3 0.06 -PSRR -13.5 V VEE -16.5 V, 1 0.05 VCC= 15 V 2,3 0.06 1/ The algebraic convention whereby the most negative value

41、 is minimum and the most positive a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 2/ If not tested, shall be guaranteed to the limits specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking per

42、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device types 01 02 Case outlines J and L 3 Terminal number Terminal symbol 1 BIT 1 (MSB) NC 2 BIT 2 BIT 1 (MSB)

43、3 BIT 3 BIT 2 4 BIT 4 BIT 3 5 BIT 5 BIT 4 6 BIT 6 BIT 5 7 BIT 7 BIT 6 8 BIT 8 NC 9 BIT 9 BIT 7 10 BIT 10 BIT 8 11 BIT 11 BIT 9 12 BIT 12 (LSB) BIT 10 13 THRESHOLD CONTROL (VTH) BIT 11 14 THRESHOLD COMMON (THCOM) BIT 12 (LSB) 15 10 V SPAN RESISTOR NC 16 10 V SPAN RESISTOR THRESHOLD CONTROL (VTH) 17 L

44、ADDER COMMON (LCOM) THRESHOLD COMMON (THCOM) 18 ANALOG COMMON (ACOM) 10 V SPAN RESISTOR 19 LOAD RESISTOR (RL) 10 V SPAN RESISTOR 20 IOUTLADDER COMMON (LCOM) 21 BIPOLAR OFFSET (IBPO) ANALOG COMMON (ACOM) 22 VEENC 23 REFERENCE COMMON (REFCOM) LOAD RESISTOR (RL) 24 VCCIOUT25 - BIPOLAR OFFSET (IBPO) 26

45、- VEE27 - REFERENCE COMMON (REFCOM) 28 - VCCNC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 RE

46、VISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 2. Functional block diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89808 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B

47、 SHEET 10 DSCC FORM 2234 APR 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all device

48、s prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA= +