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本文(DLA SMD-5962-89882 REV C-2006 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片 双重差动线路驱动器 线性微型电路》.pdf)为本站会员(王申宇)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-89882 REV C-2006 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片 双重差动线路驱动器 线性微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - lgt 02-01-11 Raymond Monnin B Add case outline D. Editorial changes throughout. - drw 05-05-24 Raymond Monnin C Propagation delay time test in table I, tPHLand tPLH, deleted reference to RLin the

2、 conditions block. Relabeled test circuits in figure 2. -rrp 06-12-20 Raymond Monnin REV SHET REV SHET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COL

3、UMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, DUAL, DIFFERENTIAL AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-07-14 LINE DRIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C S

4、IZE A CAGE CODE 67268 5962-89882 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E163-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C

5、 SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962

6、-89882 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 78C30 Dual differential line driver 1.2.2 Case outlines. The case outline)

7、are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings

8、. Supply voltage (VCC) . 18 V Voltage at any pin . -0.3 V to +16 V Average current at output 50 mA Power dissipation (PD). 700 mW Lead temperature (soldering, 10 seconds) +260C Junction temperature (TJ) +150C Storage temperature range . -65C to +150C Thermal resistance, junction-to-case (JC) See MIL

9、-STD-1835 Thermal resistance, junction-to-ambient (JA) . 95C/W 1.4 Recommended operating conditions. Supply voltage range (VCC) . +3 V to +15 V Ambient operating temperature range (TA) . -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

10、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of

11、this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS M

12、IL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online

13、 at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein

14、, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for

15、non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in a

16、ccordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of

17、the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensi

18、ons shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise spe

19、cified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subg

20、roup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to

21、 space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a

22、 “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O

23、HIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 1/ Unit Min MaxLogical “1” input voltage VIHVCC= 5 V 2/ 1, 2, 3 01 3.5 V VCC= 10 V 2/ 8

24、Logical “0” input voltage VILVCC= 5 V 2/ 1, 2, 3 01 1.5 V VCC= 10 V 2/ 2 Logical “0” input current IILVCC= 15 V, VIN= 0 V 1, 2, 3 01 -1 A Logical “1” input current IIHVCC= 15 V, VIN= 15 V 1, 2, 3 01 +1 A Power supply current ICCVCC= 15 V 1, 2, 3 01 100 A Logical “1” output current IOHVCC= 4.5 V, VOU

25、T= 2.9 V 1, 3 01 -57 mA 2 -32 VCC= 4.5 V, VOUT= 3.6 V 1, 2, 3 -2 Logical “0” output current IOLVCC= 4.5 V, VOUT= 0.4 V 1, 3 01 11 mA 2 8 VCC= 10 V, VOUT= 0.4 V 1, 3 22 2 16 Output source resistance 2/ RSRCVCC= 4.5 V, VOUT= 2.9 V 1, 3 01 28 2 50 Output sink resistance 2/ RSINKVCC= 4.5 V, VOUT= 0.4 V

26、1, 3 01 36 2 50 VCC= 10 V, VOUT= 0.4 V 1, 3 18 2 25 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

27、 C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 1/ Unit Min MaxPropagation delay time 3/ tPHLVCC= 5 V, CL= 50 pF, 9 01 350 ns 10, 11 4/ 525 VCC= 10 V, CL

28、= 50 pF, 4/ 9 150 10, 11 225 tPLHVCC= 5 V, CL= 50 pF, 9 350 10, 11 4/ 525 VCC= 10 V, CL= 50 pF, 4/ 9 150 10, 11 225 Differential propagation delay time 3/ tPHLVCC= 5 V, CL= 5000 pF, RL= 100 4/ 9 01 400 ns 10, 11 600 VCC= 10 V, CL= 5000 pF, RL= 100 4/ 9 150 10, 11 225 tPLHVCC= 5 V, CL= 5000 pF, RL= 1

29、00 4/ 9 400 10, 11 600 VCC= 10 V, CL= 5000 pF, RL= 100 4/ 9 150 10, 11 225 1/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 2/ Parameter tested go-no-go

30、only. 3/ See figures 2 and 3. 4/ If not tested, shall be guaranteed to the limits specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OH

31、IO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline C and D Terminal number Terminal symbol 1 INPUT 1A 2 INPUT 2A 3 INPUT 3A 4 INPUT 4A 5 A AND OUT 6 A NAND OUT 7 GND 8 B NAND OUT 9 B AND OUT 10 INPUT 4B 11 INPUT 3B 12 INPUT 2B 13 INPUT 1B 14 VCCFIGURE 1. Termina

32、l connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Test circuits. FIGURE 3.

33、Timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A

34、 certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product mee

35、ts the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of

36、change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshor

37、e at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to qual

38、ity conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acq

39、uiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in tabl

40、e II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The follo

41、wing additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in tab

42、le II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test c

43、ircuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo re

44、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89882 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in

45、accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies

46、to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in table I herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to th

47、is drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Co

48、nfiguration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be

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