1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with N.O.R. 5962-R003-93. 92-11-25 M. A. FRYE B Drawing updated to reflect current requirements. Redrawn. - ro 06-12-11 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B
2、 B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MIC
3、HAEL A. FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 91-08-16 MICROCIRCUIT, LINEAR, HIGH SPEED, PRECISION, JFET, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89976 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E097-07 Provided by
4、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements
5、 for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89976 01 G X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see
6、1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LT1055A High speed precision JFET operational amplifier 02 LT1056A High speed precision JFET operational amplifier 03 LT1055 High speed precision JFET operational a
7、mplifier 04 LT1056 High speed precision JFET operational amplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF
8、-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VS) 20 V dc Differential input voltage (VID) 40 V dc Input voltage (VIN) 20 V dc Output short circuit duration Indefinite Power dissipation (PD) 500 mW Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds)
9、 . +300C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 150C/W 1.4 Recommended operating conditions. Supply voltage (VS) 15 V dc Common mode voltage (VCM) 0 V Operating ambient temperature range (TA) -55C to
10、 +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government spec
11、ification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PR
12、F-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircui
13、t Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order
14、of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item
15、 requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufact
16、urer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
17、 modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option
18、is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connect
19、ions shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The elect
20、rical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer
21、s PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices
22、 built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
23、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VS= 15 V, VCM= 0 V Group A subgroups Device type
24、 Limits Unit unless otherwise specified Min Max Input voltage range VIN1 01 -11.0 11.0 V 2,3 -10.5 10.5 Input offset voltage VIO1/ 4 01 -150 150 V 2,3 -500 500 4 02 -180 180 2,3 -550 550 4 03 -400 400 2,3 -1200 1200 4 04 -450 450 2,3 -1250 1250 VIO/ 2/ 3/ 2,3 01,02 -4.0 4.0 V/C Average temperature c
25、oefficient of input offset voltage T 03,04 -8.0 8.0 Input offset current IIO1/ 1 01 -10 10 pA 2 -1.2 1.2 nA 1 02 -10 10 pA 2 -1.5 1.5 nA 1 03 -20 20 pA 2 -1.8 1.8 nA 1 04 -20 20 pA 2 -2.4 2.4 nA Input bias current IIB1/ 1 01 -50 50 pA 2 -2.5 2.5 nA 1 02 -50 50 pA 2 -3.0 3.0 nA See footnotes at end o
26、f table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance character
27、istics Continued. Test Symbol Conditions -55C TA +125C VS= 15 V, VCM= 0 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Input bias current IIB1/ 1 03 -50 50 pA 2 -4.0 4.0 nA 1 04 -50 50 pA 2 -5.0 5.0 nA VCM= +10 V 1 01,02 100 pA 03,04 150 CMRR VCM= 11 V 1 01,02 86 dB C
28、ommon mode rejection ratio VCM= 10.5 V 2,3 85 VCM= 11 V 1 03,04 83 VCM= 10.5 V 2,3 82 PSRR VS= 10 V to 18 V 1 01,02 90 dB Power supply rejection ratio VS= 10 V to 17 V 2,3 88 VS= 10 V to 18 V 1 03,04 88 VS= 10 V to 17 V 2,3 86 Supply current IS1 01 4.0 mA 2,3 14.0 1 02 6.5 2,3 14.0 1 03 4.0 2,3 14.0
29、 1 04 7.0 2,3 14.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97
30、TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C VS= 15 V, VCM= 0 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max AVOLRL= 2 k, VO= 10 V 4 01 150 V/mV Large signal voltage 4/ gain RL= 1 k, VO= 10 V 130 RL= 2 k, VO= 10 V 5,6
31、 40 RL= 2 k, VO= 10 V 4 02 150 RL= 1 k, VO= 10 V 130 RL= 2 k, VO= 10 V 5,6 40 RL= 2 k, VO= 10 V 4 03 120 RL= 1 k, VO= 10 V 100 RL= 2 k, VO= 10 V 5,6 35 RL= 2 k, VO= 10 V 4 04 120 RL= 1 k, VO= 10 V 100 RL= 2 k, VO= 10 V 5,6 35 Output voltage swing VOUTRL= 2 k 4,5,6 All -12 12 V INfO= 10 Hz 7 All 4.0
32、fA / Input noise 2/ 4/ 5/ current density fO= 1 kHz 4.0 Hz ENfO= 10 Hz 7 01,02 65 nV / Input noise voltage 2/ 6/ density fO= 1 kHz 20 Hz fO= 10 Hz 03,04 60 fO= 1 kHz 22 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST
33、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C VS= 15 V, VCM= 0 V Group A subgroups Device type Limit
34、s Unit unless otherwise specified Min Max Slew rate 2/ SR RL= 2 k minimum, 7,8b 01 10.0 V/s CL= 100 pF, AV= +5, 8a 5.0 VIN= 2 V, measured at 7,8b 02 12.0 -7 V and +7 V 8a 6.0 7,8b 03 7.5 8a 3.5 7,8b 04 9.0 8a 4.0 1/ Offset voltage is measured under two different conditions. The first, approximately
35、0.5 seconds after application of power. The second, at TA= +25C only, with the chip heated to approximately 38C for devices 01 and 03, and 45C for devices 02 and 04, to account for chip temperature rise when the device is fully warmed up. IIOand IIBare measured fully warmed up also. 2/ If not tested
36、, shall be guaranteed to the limits specified in table I herein. 3/ Offset voltage drift with temperature is practically unchanged when the offset voltage is trimmed to zero with a 100 k potentiometer between the balance terminals and the wiper tied to VS+. 4/ fOsymbolizes output frequency and VOsym
37、bolizes output voltage. 5/ Current noise is calculated using the formula: IN= ( 2 x q x IIB) x 1/2 where q = 1.6 x 10-19coulomb. The noise of source resistors up to 1 G swamps the contribution of current noise. 6/ Input noise voltage density at fO= 10 Hz is sample tested on every lot to a sample siz
38、e series number of 15. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of
39、 supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to thi
40、s drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation
41、. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION
42、LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device types 01, 02, 03, and 04 Case outline G Terminal number Terminal symbol 1 BALANCE 2 INPUT- 3 INPUT+4 VS-5 BALANCE 6 OUT 7 VS+8 NC NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted witho
43、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89976 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, a
44、ppendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C. The test circui
45、t shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified i
46、n method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality c
47、onformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 9, 10, and 11 in table I, method 5005 of
48、MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, a
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