DLA SMD-5962-90537 REV D-2010 MICROCIRCUIT LINEAR INTERNALLY TRIMMED PRECISION IC MULTIPLIER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added subgroup 4 to Table IIA. Editorial changes throughout. lgt 01-03-16 Raymond Monnin B Added subgroup 9 to Table IIA. Editorial changes throughout. lgt 01-05-24 Raymond Monnin C Added outline I to 1.2.4. Updated figure 1 and 1.3. gt 03-04-03

2、Raymond Monnin D Update drawing to current MIL-PRF-38535 requirements. -rrp 10-01-19 Charles F. Saffle REV SHEET REV SHEET REV STATUS REV D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY L.G. TRAYLOR DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.

3、mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJ PITHADIA APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEAR, INTERNALLY TRIMMED PRECISION IC MULTIPLIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 00-09-13 AMSC

4、 N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-90537 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E455-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90537 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321

5、8-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflec

6、ted in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90537 01 M C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) D

7、evice class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices mee

8、t the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD534T Internally trimmed

9、precision IC multiplier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B mi

10、crocircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C CDIP2-T14 14 Dual-in-line I MA

11、CY1-X10 10 Can 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9

12、0537 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply Voltage 22 V Power Dissipation . 500 mW Output Short-Circuit to Ground . Indefinite Input Voltage X1, X2, Y1, Y2, Z1, Z2 VSStorage Temperature Range -6

13、5C to +150C Lead Temperature (Soldering, 60 sec.) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) Case C . 95C/W Case I . 142C/W 1.4 Recommended operating conditions. Supply Voltage 15 V Operating Temperature Range . -55C to +125C 2. AP

14、PLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPA

15、RTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-H

16、DBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

17、2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses

18、above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A

19、5962-90537 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in th

20、e device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as spe

21、cified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be

22、 in accordance with 1.2.4 herein . 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiatio

23、n parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marki

24、ng. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA p

25、roduct using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device c

26、lasses Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufa

27、cturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to

28、 DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of c

29、onformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notificat

30、ion to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manu

31、facturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-

32、38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90537 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performanc

33、e characteristics. Test Symbol Conditions -55C TA+125C 1/ unless otherwise specified Group A subgroups Device type Limits Unit Min Max Relative accuracy 2/ RAVX= -10 V, -10 V, +10 V, +10 V VY= -10 V, +10 V, -10 V, +10 V 4 ALL 0.5 %FS 1, 2, 3 1 Multiplier accuracy Drift TCMA2, 3 ALL 0.01 %/C Nonlinea

34、rity, X Input NLXVX= 20 V pk-pk, VY= +10 V 4 ALL 0.3 % Nonlinearity, Y Input NLYVY= 20 V pk-pk, VX= +10 V 4 ALL 0.1 % Output offset voltage VOSVX= VY= VZ= 0 V 1 ALL 30 mV 2, 3 45 4 15 Output offset voltage drift VOS/T 2, 3 ALL 300 V/C Offset voltage (X) VOSXVX= VZ= 0 V, VY= 10 V 1 ALL 20 mV 4 10 Off

35、set voltage (Y) VOSYVY= VZ= 0 V, VX= 10 V 1 ALL 20 mV 4 10 Input bias current (X, Y, or Z) IIBVX= VY= VZ= 0 V 1 ALL 2 A Input offset current IOSVX= VY= VZ= 0 V 1 ALL 2 A Positive supply current ICCRL = No Load 1 ALL 6.0 mA Negative supply current IEERL = No Load 1 ALL 6.0 mA Common mode rejection ra

36、tio CMRX-10 V VX +10 V, VY = +10 V 4 ALL 70 dB CMRY-10 V VY +10 V, VX = +10 V 4 70 Output voltage swing VOP1, 2, 3 ALL 11 V 1% amplitude error AEVX= 2 V pk-pk, CL= 1000 pF, VY= +10 V 9 ALL 50 kHz Feedthrough, X input 3/ FRRY Nulled, X = 20 V pk-pk at 50Hz 9 ALL 0.30 %FS Feedthrough, Y input 3/ FRRX

37、Nulled, Y = 20 V pk-pk at 50Hz 9 ALL 0.10 %FS 1/ VS= 15V unless otherwise specified. 2/ Figures given are % of Full Scale, 10V (i. e., 0.01% = 1mV). 3/ Irreducible component due to nonlinearity: excludes effects of offsets. Provided by IHSNot for ResaleNo reproduction or networking permitted without

38、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90537 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C I Terminal Number Terminal Symbol 1 X1 X2 2 X2 SF 3 NC Y1 4 SF Y2 5 NC -VS 6 Y1 Z2 7 Y2 Z1 8 -V

39、S OUT 9 NC +VS 10 Z2 X1 11 Z1 - 12 OUT - 13 NC - 14 +VS - NC = No connect FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90537 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43

40、218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in t

41、he QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be condu

42、cted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn

43、-in test, method 1015 of MIL-STD-883. (1) Test condition B or C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,

44、 and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test d

45、uration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (T

46、RB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim an

47、d final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for

48、 device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appe