DLA SMD-5962-90666 REV A-1994 MICROCIRCUIT LINEAR 12-BIT ANALOG-TO-DIGITAL CONVERTER HYBRID《12位数字模拟转变器 线性数字混合微型电路》.pdf

1、DESCRIfTiCN LTR A h-mve +Vcc and -VLE froni drawing. Make changes to table 1. Rewrite entire docunent. !+ElTl I I APPmQ WE (YR-MO- DA 1 K.A. Cottongim 94- O1 - 12 iiVlIC N/A APPROVED BY Alan Barone DRAWING APPROVAL DATE 92-09-14 STANMIDIZED MILITARY lxuYwlNG MICROCIRCUIT, LINEAR, 12-BIT, ANALOG-TO-D

2、IGITAL CONVERTER, HYBRID I I THIS DRAUING IS AVAILABLE FOR USE BY ALL DEPARTMENTS ANO AGENCIES OF THE DEPARTMENT OF DEFENSE REVISION LEVEL A AMSC NIA 5962-90666 SIZE CAEOCDE A 67268 PREPARED BY Gary Zahn I DEFBSEELICSSLY D4m, CHIO 45444 CHECKED BY I 1 OF 13 I SHEr DESC FORM 193 JUL 91 DISTRIBUTION S

3、TATEMENT A. Approved for public release; distribution is unlimited. 5962-E105-94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-90666 REV A = 9999996 0052393 BO3 STANDARDISED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 4

4、5444 1. SCOPE 1.1 Scope. This drauing forms a part of a one part - one part nunber docunentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance uith MIL-H-38534. product assurance classes, military high reliability (device c

5、lass H) and space application (device class K) and a choice of case outlines and leed finishes are available and are reflected in the Part or Identifying Nhr (PIN). Uhen available, a choice of radiation hardness assurance levels are reflected in the PIN. Tuo 1.2 PI#. The PIN shall be as shoun in the

6、 following exqle: 5r , 90664 Ji, i i Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) cies i gnat or (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing nuber 1.2.1 Radiation hardness assurance (RHA) designator. Device classes H and

7、K RHA marked devices shall meet the A dash (-1 indicates a MIL-H-38534 specified RHA levels and shall be marked uith the appropriate RHA designator. non-RHA device. 1.2.2 Device type(s1. The device typeCs) shall identify the circuit function as follous: SIPE 5962-90666 A FINISICNLML 9ET A 2 Devi ce

8、type o1 Generic nunber AD9005B Circuit fmtion 12-bit A/D converter 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level as follous: Device class H or K Device reauireinents docunentation Certification and qualification to MIL-H-

9、38534 1.2.4 Case outline(s1. The case outline(s) shall be as designated in MIL-STD-1835 and as follous: Outline letter Descriptive desiqnator Terminals X See figure 1 46 Package style Dual - in- 1 ine 1.2.5 Lead finish. The lead finish shall be as specified in iIL-H-38534 for classes H and K. Finish

10、 Letter I1Xo8 shall not be marked on the microcircuit or its packaging. finishes A, B, and C are considered acceptable and interchangeable without preference. lhe 11X81 designation is for use in specifications uhen leed Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

11、ense from IHS-,-,-SMD-5962-90666 REV A 9999996 0052392 748 1.3 Absolute maximm ratings. I/ Positive supply voltage (+VS) Negative supply voltage (-VS) Analog input voltage (Pin 45) Digital input voltage Digital output current . Storage tenperature range Junction tenperature (TJ) Lead tenperature (so

12、ldering, 10 seconds) 1.4 Recomnended operatinq conditions. +vs.-. -vs. Analog input voltage Logic voltage Logic voltage Case operating tenperature range (TC) +6V -6 V 13.0 v dc -0.5 V to +Vs 4nn -65C to +150C +3OO0C +17!ioc y +4.75 V to +5.25 V -5.45 v to -4.95 v -1.024 V to +1.024 V +2.0 v to +vs 0

13、.0 to +0.8 V -55C to +125C 2. APPLICABLE DOCWENTS 2.1 Goverrment srncification. standards, and handbook. Unless otherwise specified, the following specification, standards, and handbook of the issue listed in that issue of the Department of Defense index of Specifications and Standards specified in

14、the solicitation, form a part of this drawing to the extent specified herein. SPEC1 FICA1 ION MILITARY MIL-H-38534 - Hybrid Microcircuits, General Specification for. STANDARDS MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configuration Management. MIL-STD-183

15、5 - Microcircuit Case Outlines. HANDBOOK MI LITARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specification, standards, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the c

16、ontracting activity.) 2.2 Order of precedence. In the event of a conflict betueen the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 1/ Stresses above the absolute maximm rating may cause permanent damage to the device. maximm levels may degrade

17、 performance and affect reliability. - 2/ Maximm junction tenperature should not be allowed to exceed +lEDC. Extended operation at the Hybrid thermal model: tJUNCTION = tAMBIENT + PDISSIPATION X (%A) + (1s - Tc) MXiM. STANDARD1 2ED MILITARY DRAWIN DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444

18、 5962-90666 p+G+- EFcxM193A II ai Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-90bbh REV A 999999b 0052393 684 = STANDARD1 ZED SILE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 RNISICNLML A 3. REPUIREMENTS 5962-

19、90666 S-EET 4 3.1 herein. Item reauirements. The individual item requirements shall be in accordance with HIL-H-38534 and as specified 3.2 Design. construction. and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-H-38534 and herein. 3.2.1 3.2.2 Ter

20、minal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical Derformance Characteristics. Unless otheruise specified herein, the electrical performance Case wtline(s1. lhe case outline(s) shall be in accordance with 1.2.4 herein and figure 1. characteristics are as s

21、pecified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test reauirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in

22、accordance with MIL-H-38534. lhe part shall be marked uith the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in WL-38534. 3.6 Manufacturer eligibility. In addition to the general requirements of MIL-H-38534, the manufacturer of the part described herein sh

23、all maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, produced on the certified line, for each device type listed herein. also include a sunnary of all parameters manually tested, and for those which, if any, are guaranteed. shal

24、l be maintained under docunent revisim level control by the nienufacturer and be made available to the preparing activity (DESC-EC) upon request. supply to this drauing. product meets the requirements of MIL-H-38534 and the requirements herein. The data should This data 3.7 Certificate of cmliance.

25、A certificate of conpliance shall be required from a manufacturer in order to lhe certificate of conpliance submitted to DESC-EC shall affirm that the manufacturers 3.8 Certificate of conformance. A certificate of conformance as required in MIL-H-38534 shall be provided with each lot of microcircuit

26、s delivered to this drawing. 4. WALITY ASSURANCE PROVISIONS 4.1 Sampling and insmction. 4.2 Screening. Screening shall be in accordance uith MIL-H-38534. The follouing additional criteria shall apply: Sanpling and inspection procedures shall be in accordance with MIL-H-38534. a. Burn-in test, method

27、 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer der docunent Also, the test circuit shall specifiy the inputs, outputs, biases, and power dissipation, as revision level control and shall be made available to either DESC-EC or the acqui

28、ring activity upon request. applicable, in accordance with the intent specified in test method 1015. TA as specified in accordance with table I of method 1015 of MIL-STD-883. (2) b. interim and final electrical test parameters shall be as specified in table II herein, except interim electrical param

29、eter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-90hhb REV A 9999996 0052394 510 W Conditions I/ Grocp A Device Limits Unit Encode input logic O current Test Symb

30、ol Positive analog supply current -55C 5 TC 5 +125OC unless otherwise specified I +ISA subgroups type I I Bits Positive digital supply current Digital output Logic 1 voltage Digital output logic O voltage Positive supply voltage See footnotes at end of table. VIH VIL +Vs o1 o1 o1 900 1 1100 n UA UA

31、STANDARD1 ZED 5962-90666 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 EfXFcR/l93A II ai Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-9bbb REV A 9999996 0052395 457 = TABLE I. Electrical wrformance characteristics

32、- Continued. SyBbol Conditions 1/ -55C 5 TC 5 +125c unless otherwise specified VS ISA I/ ISD I/ Limits Unit Max V 1,2,3 I O1 I -5.45 -4.95 320 /u PD 4.0 1 U 4 I o1 I -1.0 +1.0 LSB +I .5 DNL I I I -1.0 -I- +2.25 4 o1 -1.25 5,6 -2.25 INL l 4,5,6 I O1 I GUARANTEED I O1 4 -1 .o +I .o XFS -2.0 +2.0 -15 +

33、I5 I -40 +4Q 10 nsps CR I Encode rate = 10 MHz STANDARD1 ZED 5962-90666 MILITARY DRAWIWO DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DEscFoFNI1934 II a1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE I. Electrical performance characte

34、ristics - Continued. Conditions 1/ -55C 5 TC 5 +125C unless otherwise specified Test Grap A Device subgrwps type Harmonic distortion Limits Min I Max Signal to noise ratio Unit Power supply rejection ratio -68 -66 -66 -63 63 60 62 60 SNR PSRR dBC dBc 0.02 %/% STANDARD1 2ED SI BE MILITARY DRAWIN A DE

35、FENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 FINISICNLML 5962-90666 SEET I I A +VS = +5 V dc, -Vs = -5.2 V dc. Test temperatures are TA = +25“C, TC = -55“C, and TC = +125“C. ENCODE signal rise and fall times should be less that 5 ns for normal operation. initiates conversion. All output bits a

36、re tied to a 10 kilohm load at maximm supply voltage Level(s). Parameter shall be tested 100% at TA= +25“C and guaranteed at T, = -55OC and +12SoC. Worst case spurious in-band signal relative to input level. Input at 1 d below full scale. RMS signal to RMS noise, including harmonics. PSRR is tested

37、over the following voltage ranges: Transition from laOaf to “1“ +Vs = +4.75 V dc to +5.25 V dc -Vs = -4.95 V a notch or a lead one identification nerk is located adjacent to lead one. 2. 3. Forty-four spaces. 4. Applies to all four corners. El shall be measured at the centerline of the leads. 0.098

38、0.102 2.49 2.59 3 0.210 5.33 0.080 0.100 2.03 2.54 4 0.130 0.150 3.30 3.81 4 FIGURE 1. Case outline(s1 - Continued. SIZE A STANDARD1 2ED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 5962-90666 pslcNLML SEET I 9 I I I 8cFCFM1934 u 91 Provided by IHSNot for ResaleNo reproducti

39、on or networking permitted without license from IHS-,-,-I STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYMN, OHIO 45444 I I SIZE A FWISIoI LML A 1 Terminal nuriber Terminai s 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38

40、 39 40 41 42 43 44 45 46 GND No connection +Vs(anaiog) T/H enp output A/D input -V,(analog) DNC DNC D11 (MSB) D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 DO (LSB) +VS(di g i ta 1 ) GND GND Encode GND GND DNC DNC DNC +VS(analog) -VS(digital) GNO No connection GUD GND DNC GND GND DNC DNC No connection -Vs(analog)

41、No connection No connection Analog input GND NOTES: 1. GND is circuit ground. All grounds should be connected together near device. 2. The DNC (do not connect) terminais are internai test points. FIGURE 2. Terminal connections. 5962-90666 SEET 10 Provided by IHSNot for ResaleNo reproduction or netwo

42、rking permitted without license from IHS-,-,-MIL-STD-883 test requirements Interim electrical parameters Finel electrical test parameters Group A test requirements Subgroups (in accordance uith method 5008, group A test table) 1 1*,2,3,4,5,6 Group C end-point electrical parameters Group E end-point

43、electrical parameters for RHA devices 4.3 Quality conformance insmction. Quality conformance inspection shall be in accordance uith MIL-H-38534 and as spec i f i ed here i n . 4.3.1 a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 shall be omitted. Grow A inswction

44、. Group A inspection shall be in accordance uith MIL-H-38534 and as follows: 4.3.2 Group B inspection. Group B inspection shall be in accordance uith MIL-H-38534. 1 Subgroups * (in accordance uith method 5005, group A test table) STANDARD1 ZED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTE

45、R DAYTOW, OHIO 45444 FWISICNLML 5962-90666 S-EET 11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4.3.3 Grow C inspection. Group C inspection shall be in accordance with MIL-H-38534 and as follows: a. b. End-point electrical parameters shall be as

46、specified in table II herein. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the inenufacturer under docunent Also, the test circuit shall specifiy the inputs, outputs, biases, and power dissipation, as revision level con

47、trol and shall be made avaiiable to either DESC-EC or the acquiring activity upon request. applicable, in accordance with the intent specified in test method 1005. (2) TC as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by met

48、hod 1005 of MIL-CTD-883. 4.3.4 Group D inspection. Group D inspection shall be in accordance with MIL-H-38534. 4.3.5 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). conformance inspection sample tests shall be pe

49、rformed at the RHA level specified in the acquisition docunent. RHA levels for device classes H and K shall be U, D, R, and H. RHA quality a. RHA tests for device classes H and K for levels U, D, R, and H shall be performed through each level to These RHA tests shall be performed for determine at what levels the devices meet the RHA requirements. initial qualification and aft