DLA SMD-5962-90704-1990 MICROCIRCUIT DIGITAL CMOS 16-BIT DIGITAL SIGNAL PROCESSOR MONOLITHIC SILICON《硅单块 16比特数字单一处理器 互补金属氧化物半导体数字微型电路》.pdf

1、 - DESC-DWG-9070q 57 7779795 0023277 7 W DATE (YR-MOSDA) LTR APPROVED REVISIONS DESCflIPTiON I. SHEET REV STATUS OF SHEETS SHEET 1 I I1 29 30 31 52 3: PMIC NIA STANDARDIZED DRAWING THIS DRAiViNQ IS AVAILABLE OR USE BY ALL DEPARTMENTS AND AGENCIES OF THE 15 MAY 1990 DEPARTMENT OF DEFENSE AMSC NIA DEF

2、ENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 - MICROCIRCUIT, DIGITAL, Cf.1OS. 16-BIT DIGITAL SIGNAL PROCESSOR, MNOLITHIC s It I CON SIZE CAE CODE A I 67268 * SHEET I OF 35 5SC FORI4 193 SEP 87 U.J. GOYIRNMtHt PAIHtlMG MfKI: 19#7- 748.119160911 5962-El643 DISTlOUTl(aNCTATEh1ENT A. Approved lor p

3、ublic release; distribulion Is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-70704 57 W 7977775 O021300 Z W STAN DARDIZEB MILITARY DRAWING . DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1. SCOPE 1.1 Scope. This drawing f

4、orms a part of a one part - one part number documentation system (see i.6). mroduct assurance classes, military high reliability (device classes B, Q, or M) and ;pace application (device classes S or V) and a choice of case outlines and leadfinishes are ivailable and are reflected in the complete pa

5、rt number. When available, a choice of radiation hardness assurance (RHA) levels are reflected in the complete part number. SIZE A 5962-90704 REVISION LEVEL SHEET 2 1.2 Part or Identifying Number (PIN). The PIN shall be as shown i.n the following example: o1 Q X X 7- I I finish 7- 7- I 1. I I 1- Dev

6、ice *Device Case Lead 7o_ioowI I I I bederal RHA stock class designator type cl ass out1 i ne designator (1.2.1) (1.2.2) desi gnator (1.2.4) (1.2.5) (1.2.3) w Drawingnumber 1.2.1 Radiation hardness assurance (RHA) designator. levices shal I meet the MIL-M-38510 specitied RHA 1 evels and shall be mar

7、ked with the appropriate RHA iesignator. :haracteristics specified in table I herein after exposure to the specified irradiation level s ipecified in the absolute maximum ratings herein and the RHA markd device shall be marked in Device classes .M, B, or S RHA marked Device classes Q or V devices sh

8、all meet or exceed the electrical performance 1.2.2 Device type. The device type shall identify the circu Device type Generic number o1 WE DSP-16 Di gi tal ticordance with MIL-1-38535. A dash (-j indicates a non-RHA device. t function as follows: Circuit function signal processor, 16 b t 1.2.3 Devic

9、e class designator. The device class designator shall be a single letter identifying the product assurance level (se.e 6.7 herein) as follows: M B or S Q or V Device class Device requirements documentation Vendor self-certification to Certification and quali.fication to MIL-M-38510 1.2.1 Of MIL -STD

10、 -883 Certification and qualification to MIL-1-38535 1.2.4 Case outl.ne. .For device classes M, B, or S case outlines shall met the requirements in sppendix C of MIL-M-38510 and as listed below. the requirements of MIL-1-38535, appendix C of MIL-M-38510, and as 1i.sted below. For device classes. Q o

11、r V case outline shall meet Outline letter .x P-AE (i33-pin, 1.38“ x 1.38“ x ,345“) Case outline pin grid array - i/ - l! Th e stand-off dimension (Q in appendix C of MIL-14-38510) sha 1 be 0.045“(max) and 0.035“(min). . Provided by IHSNot for ResaleNo reproduction or networking permitted without li

12、cense from IHS-,-,- - DESC-DWG-90704 54 4449945 QQZ1301 3 a 1.2.5 Lead finish. The lead finish shall be as specified in Mit-M-38510 for classes M, 8, or S , or MIL-I-m38535 for classes i) or Y, Finish letter “X“ shall not be marked on the microcircuit or its packaging, The X“ designation is for use

13、in specifications when lead finishes A, 8, or C are considered acceptable and interchangeable without preference I SIZE A STANDARDIZED 1.3 Absolute maximuni ratings. z/ Positive supply voltage - - - - - - - - - - - - - - - Negative supply voltage - - - - - - - - - - - - - - - wer dissipation (PD) -

14、- - - - - - - - - - - - - - Etorage temperature range - - - - - - - - - - - - - - Lead temperature (soldering, 10 seconds) - - - - - - - Thermal resistance, junction-to-case (eJc) - - - - - - Electrostatic discharye sensitivity (ESDS) - - - - - - G-force - - - - - - I e - - - - - - - - - - Inputvolt

15、age - 1.4 keeommended operating conditions. 5962-90704 t6.0 Y dc 350 m4 -65OC to t15O.C +3OO0C See MIL-M-38510, append Class 1 (1500 Y) 20000 g -0.5 V dc -0.5 V dC to 6.0 V dC xc Case operating temperature range (TC) - - - - - - - - -55C to +125*C Supply voltages (VDD) - - - - - - - - - - - - - - -

16、- Operating frequency range - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc 1.0 MHr to 13.3 MHz 1.5 Logic testing for device classes Q or V, Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - 80 percent 2. APPLICABLE BOCUiElENTS 2.1 Government specificat

17、ions, standards, bulletin, and handbook. Unless otheiwise specified, the folPowiny specirnions, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the ext

18、ent specified herein. SP EC IF1 CAT IONS fel1 L I TARY MI L-M- 38510 MIL-1-38535 - Microcircuits, General Specification for. - Integrated Ci rcuits, Manufacturing, General Specification for. STANDARDS MILITARY Pi1 L-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. HIL-STB

19、-883 - Test Methods and Procedures for Microelectronics. BULLETIN PI1 LITARY bII L-BULI103 - List of Standardized Military Drawings (SMDs). Q 21 Stresses above the absolute maximum rating-may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and a

20、ffect re1 iabil ity. I I I I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I REVISION LEVEL I SHEET 3 I I I *V. 5. GPVEAHMEHT P“TIM OFFNE: 1Dw-!M9*#w ESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-70704 57 m 9777

21、775 0021302 5 m STANDARDIZED . MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 HANDBOOK MILITARY SIZE A 5962-90704 REVISION LEVEL SHEET 4 MI L-HDBK-780 - Military Drawings. (Copies of the specific.ations, standards, bulletin, and handbook required by manufacturers in connection

22、 with specific acquisition functions should be obtained from the contracting activity or 3s directed by the contracting activity. 1 references cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the 3.

23、 REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class M shall be in I accordance with. 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883-in conjunction with compliant non-JAN devices“ and as specified herein. -The individual item requirements for device cl

24、asses B or S shall be in accordance with MIL-M-38510 and as specified herein. B or S, a full electrical characterization table for each device type shall be included in this SMD. nie individual item requirements for device classes Q or V shall be in accordance with MIL-1-38535 and as specified herei

25、n. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as Specified in MIL-M-38510 f or device classes M, B, or S and MIL-1-38535 for device classes Q and V and herein. For device classes 13.2.1 Case outline., The case outline shall be in acc

26、ordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block or logic diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise spe

27、cified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in tabte I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA

28、 . 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). In addition, the manufacturers part number may also be marked as listed in MIL-BUL-103. Marking for device classes B or S shall be in accor

29、dance with MIL-FI-38510. The electrical tests for each subgroup are defined in table I. Marking for device classes Q or V shall be in accordance with MI L- 1-38535. 3.5.1 Certification/compliance mark. required in MIL-STD-883 ( see 3.1 herein). a “J“ or “JAN“ as required in MIL-M-38510. be a “QEL“ a

30、s required in MIL-1-38535. The compliance mark for device.class M shall be a “C“ as The certification mark for device classes Q or V shall The certification mark for device classes B or S shall be 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a

31、 manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7 herein). listed manufacturer in order to supply to the requirements of this drawing (see 6.7 herein). The certificate of compliance submitted to DESC-ECC prior to listing as an approved source of supply for t

32、his drawing shall affirm that the manufacturers producte meets, for device class M the requirements of MIL-STD-883 (see 3.1 herein) or, for device classes Q or V, the requirements of MIL-1-38535 and the requi rements herei n. For device classes Q or Y, a certificate of compliance shall be required f

33、rom a QML-38535 .DESC FORM 193A . SEP 87 . it U. 5. QOVERNMENT PRINTING OFFICE: 1988-549-904 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_ DESC-DWG-3070q 59 U 9S 0021303 7 U ML-STD-fU3 (see 3TlTmevice classes B or S in MIL-M-38520 or for device c

34、lasses Q or Y in YIL-1-58535 shall be provided with each lot of microcircuits delivered to this drawing. change r-hG$6%) involving devices acquired to this drawing is required for any :hange as defined in NIL-STD-480, 3.9 Verification and review for device class M, For device class M, DESC, DESCs ag

35、ent and the acquirig activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. devices 211 be in microcircuit group number 105 (see MIL-M-38510, appendix E) . accordance

36、 with MIL-M-3%10 3.7 Certificate of conformance. A certificate of conformance as required for device class M in 3.8 Notification of ehange for device class M. For device class M, notification to DESC-ECC of 3.10 Microcircuit group assigtiment for device classes M, B, or S, Device classes M, B, or S

37、3.11 Serialization for device class S. All device class S devices shall be serialized in 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection, For device class M, sampling and inspection procedures shall be in accordance with cectionIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 h

38、erein) For device classes B or S, sampling and inspection procedures shall be in accordance with MIL-M-3851( and method 5005 of MIL-STO-883, except as modified herein. For device classes Q or Y, sampling and inspection procedures shall be in accordance with MIL-1-38535. 4.2 Screening. For device cla

39、ss M, screening shall be in accordance with method 5004 of !lIL-STD-d shall be conducted on all devices prior to quality conformance inspection. For device classes B or S, screening shall be in accordance with method 5004 of MIL-STD-883, and shall bc conducted on all devices prior to qualification a

40、nd quality conformance inspection. For device :lassec Q or Y, screening shall be in accordance with MIL-1-38535, and shall be conducted on all devices prior to qualification and technology Conformance inspection, The following additional criteria shall apply, SIZE A STANDARDIZED a. Durn-in test, met

41、hod 1015 of f-1IL-STD-883. 5962-90704 (1) Test condition A, B, C, or D, For device class M, the test ci rcuit shall be submi tted to DESC-ECC for review with the certificate of compliance. For device classes B or S, the test circuit shall be submitted to the qualifying activity. For device classes Q

42、 01 Y, the test circuit shall be submitted to DESC-ECC with the certificate of compliance and under the control of the device manufacturers technical review board (TRB) in accordance with MIL-1-38535. DEFENCE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 (2) TA e +125*C, minimum. Interim and final el

43、ectrical test parameters shall be as specified in table IIA herein. b. 4.2.1 Additional screening for device class V. Additional screening -for device class Y beyond thr requireme-shall be as specified in appendix 6 of MIL-1-38535 and as detailed in table IIB herein, These additional screens may be

44、used to satisfy space system requirements and shall be reflected in the complete PIN (see 6.7). 4.3 Qualification inspeetion. REVISION LEVEL SHEET 5 4.3.1 Qualification inspection for device classes B or S. Qualification inspection for device :lasses D-wordance with MIL-bl-38510. InsDections to be p

45、erformed shall be those speeifiad in method 5005 of MIL-STD-883 and herein for groupi A, B, C, D, and E inspections (see 9.4.1 through 4.4,5) a IESC FORC.1 195A SEP 87 t U. 8. GOVERHMENT PRINTIttO OFFICE: 19M-!M9.90( Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

46、e from IHS-,-,-I I I VOUT = 0.0 v I 1,2,3 I -75 I 75 I I I I I IZOL I 1 I I I VDD = 5.5 V I 1,2,3 I I I I I I I I See 4.4.lb 141 I 15 I I I I I I I See 4.4.lb 141 I 30 I I I I I. I I I I I I I I 64 ;upply current 1 Icc .nput capacitance I lutput capacitance 1 COUT unc ti onal tes ti ng I I See 4.4.1

47、 I I ;lock in period STAN DARDI Z ED MILITARY DRAWING I. I I .I SIZE A 5962-907 04 I I 1- I I I 1- I 9,10,11 I 37.5 I 1000 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I 9,10,11 I 15 I I I I lock in low time I CKILCKIH I I I I 1- I 9,10,11 I 15 I I I lock in high time 1 CKILCKIH I I I I I I

48、1- xternal memory setup I tRBvCKOL I I 9,10,11 I 20 I I I. I I I ;ee footnotes at end of table. REVISION LEVEL SHEET 6 I I 1 I I 1 I I 1 I I 1 I I 1 I I 1 I I 1 I I 7 I j PA mA PF PF ns ns ns ns . - _. . t U. S. QOVERNMENT PRINTINQ OFFICE: 1988-549-904 SEP 87 Provided by IHSNot for ResaleNo reproduc

49、tion or networking permitted without license from IHS-,-,-DESC-DWG-90704 53 9999995 002L305 O U STANDARlZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 TABLE I, Electrical performance characteristics - Continued. - I I I I Conditions IGroup A I Limits I Unit I -55C = 50 pF I I I I I 35 I ns I, I 35 I ns i 35 I ns ICKDC I I I I I ILDDC I I I OLD DC I ICKHILRH I