DLA SMD-5962-90835 REV D-2003 MICROCIRCUIT HYBRID LINEAR WIDEBAND OPERATIONAL AMPLIFIER《操作增强器 宽带直线式混合微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R033-93. 92-12-04 K. A. Cottongim B Changes in accordance with NOR 5962-R246-97. 97-03-13 K. A. Cottongim C Changes to table I. Delete CAGE code 62839. Add CAGE code 1HBD3. 00-05-24 Raymond Monnin D Updated dra

2、wing to reflect the current requirements of MIL-PRF-38534. -sld 03-06-03 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS

3、 STANDARD MICROCIRCUIT DRAWING CHECKED BY Steve Duncan COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY D. M. Cool MICROCIRCUIT, HYBRID, LINEAR, WIDEBAND, OPERATIONAL AMPLIFIER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE

4、 91-09-10 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-90835 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E421-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

5、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-90835 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines

6、and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 90835 01 H X X Federal RHA Device Device Case

7、 Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked wi

8、th the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function 01 CLC205A, KH205A Wideband, overdrive protected, operational amplifier 1.2.3 Device class desig

9、nator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels ar

10、e as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Re

11、duced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Gro

12、up A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that

13、the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. 1/ The CLC205A is inactive for new design. Provided by IHSNot fo

14、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90835 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD

15、-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 12 Can package 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. Supply voltage (VCC) 20 V dc Differential input voltage . 3 V dc Common-mode inpu

16、t voltage (VCC - 1 V) Output current. 75 mA Storage temperature range. -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) +175C Power dissipation (PD) . 1/ Thermal resistance, case-to-ambient (CA). 65C/W 2/ Thermal resistance, junction-to-case: JC(circuit) 17.5C

17、/W 3/ JC(output) . 200C/W 4/ 1.4 Recommended operating conditions. Supply voltage range 5 V dc to 15 V dc Gain range +7 to +50; -1 to -50 Common-mode input voltage (VCC - 5 V) Output current. 50 mA Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specific

18、ation, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standard

19、s (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS 1/ The power dissipation can be determined based on the application and junction temperature verified to be TJ +175C and using

20、the thermal resistance values given. 2/ Still air, no heat sink. 3/ Thermal resistance of circuit; Pcircuit= 2(VCC) ICC. 4/ Thermal resistance of output transistors; Poutput= VCE(IE) x (% duty cycle). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

21、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-90835 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Microcircuit Case Outlines. HANDBOOKS DEPAR

22、TMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phila

23、delphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been

24、 obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Qu

25、ality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections h

26、erein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Ca

27、se outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics

28、are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). M

29、arking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked in MIL-HDBK-103 and QML-38534. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38

30、534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for t

31、hose which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in orde

32、r to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall

33、be provided with each lot of microcircuits delivered to this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90835 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 5 DS

34、CC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Min Max Unit 4,6 140 Small signal bandwidth (-3 dB bandwidth) SSBW VOUT35 MHz 5 01 0.8 dB Gain flatness rolloff GFR f = 70 MHz

35、4,5,6 01 0.8 dB 4 2 Linear phase deviation 2/ LDP f 5 MHz 8A 01 -153 dBm (1 Hz) 7,8B 55 Integrated noise 2/ INV f = 5 MHz to 150 MHz 8A 01 61 V 1,3 8.0 Input offset voltage VIO2 01 11.0 mV Input offset voltage temperature coefficient 2/ VIO/T 1,2,3 01 25 V/C 1,2 15 + Input bias current +IIB3 01 25 A

36、 + Input bias current temperature coefficient 2/ +IIB/T 1,2,3 01 100 nA/C 1 10 2 25 - Input bias current -IIB3 01 22 A - Input bias current temperature coefficient 2/ IIB/T 1,2,3 01 150 nA/C Power supply rejection ratio PSRR VCC= 0.5 V 1,2,3 01 55 dB Common mode rejection ratio 2/ CMRR VCM= 1 V 4,5,

37、6 01 50 dB 1,3 20 Supply current ICCNo load 2 01 22 mA RFA 4 01 0.2 % Internal feedback resistance 2/ Absolute tolerance Temperature coefficient RFTC 4 01 -60 -140 ppm/C 1/ Unless otherwise specified, RL= 200 ohms, RF= 2,000 ohms, VCC= 15 V, AV= +20. 2/ Parameter shall be tested as part of device in

38、itial characterization and after design and process changes, which will affect this parameter. Parameter shall be guaranteed to the limits specified in table I for all lots not specifically tested. 3/ dBc is a standard reference for a signal referenced to a carrier signal level. Provided by IHSNot f

39、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90835 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Case outline X. Millimeters Inches Notes Symbol Min Max Min Max A 3.76

40、 4.60 .148 .181 b 0.41 0.48 .016 .019 D 15.11 15.44 .595 .608 D113.84 14.10 .545 .555 e 10.16 BSC .400 BSC 5 e1 5.08 BSC .200 BSC 5 e2 2.54 BSC .100 BSC 5 F 0.76 .030 k 0.66 0.91 .026 .036 4 k1 0.66 0.91 .026 .036 4 L 7.87 8.64 .310 .340 45 BSC 45 BSC 5 NOTES: 1. Dimensions are in inches. 2. Metric

41、equivalents are given for general information only. 3. The product may be measured by direct methods or by gauge. 4. Measured from the maximum diameter of the product. 5. Leads having a maximum diameter .019 (0.48 mm) measured in gauging plane .054 (1.37 mm) +.001 (0.03 mm), -.000 (0.00 mm) below th

42、e base plane of the product shall be within .007 (0.18 mm) of their true position relative to a maximum width tab. FIGURE 1. Case outline(s). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90835 DEFENSE SUPP

43、LY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline X Terminal number Terminal symbol 1 +VCC(supply voltage) 2 No connection 3 Ground (case and bias) 4 No connection 5 -VIN 6 +VIN7 Ground (case and bias) 8 Rf(internal feedback) 9 -V

44、CC(supply voltage) 10 -VCC(collector supply) 11 VOUT12 +VCC(collector supply) NOTE: Pin 8 provides access to a 2 k resistor which can be connected to the output or left open if an external feedback resistor is desired. FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or n

45、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90835 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance wi

46、th MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*,2,3,4,7 Group A test requirements 1,2,3,4,5,6,7,8A,8B Group C end-point electrical parameters 1 End-point electrical parameters for radiation hardness assurance (RHA) devices Not applicable * PDA app

47、lies to subgroup 1. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or fu

48、nction as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify t