DLA SMD-5962-91554 REV A-1992 MICROCIRCUITS DIGITAL BIPOLAR CMOS OCTAL REGISTERED TRANSCEIVER MONOLITHIC SILICON《硅单块 八进制记名收发器 双极互补金属氧化物半导体 数字微型电路》.pdf

1、SMD-59b2-91554 REV A 59 999999b 0025209 T7 W DATE (mrU0) Form Approved OMB NO. 0704-0188 NOTICE OF REVISION (NOR) (See MIL-STO-480 for instructions) 92-08-28 This revision described below has been authorized for the document listed. Public reporting burden for this collection is estimated to average

2、 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comnts regarding this burden estimate or any other aspect of this collection of informatio

3、n, including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Information and Regulatory Affairs, Office of Management and Budget, Wa

4、shington, DC 20503. 1. ORIGINATOR ME AND AWRESS 2. CAGE COOE 3. NOR NO. Defense Electronics Supply Center Dayton, Ohio 45444-5277 67268 5962-R287-92 4. CAECOOE 5. WCiMENT NO. 67268 5962-91554 6. TITLEOF WcuInNT 7. REVISIOW Lrn MICROCIRCUITS, DIGITAL, BIPOLAR CMOS, OCTAL REGISTERED TRANSCEIVER, MONOL

5、ITHIC SI LI CON (Current) (New) A 8. ECP NO. No registered users 9. MWFIWRATIOW ITEM (OR SYm) TO WICH ECP APPLIES 10. DESCRIPTION OF REVISION Sheet 1: Revisions ltr column: add “A“. Revisions description column; add “Changes in accordance with NOR 5962-R287-92“. Revisions date column; add “92-08-28“

6、. Revision level block: add “A“. Rev status of sheets 3, 8, and 10; add “A“. Sheet 3: Paragraph 1.4, Minimm pulse duration (t,); change from: “7.0 ns“ to: “8.0 ns“. Paragraph 1.4, Minimm setup time (ts); change from: “5.0 ns“ to “5.5 ns“. Sheet 8: Figure 1, Case outlines L and K: change terminal nud

7、er 1 from: “LEBA“ to: “LEBA“. Sheet 10: Figure 3, 0-type registers; remove inverting bubble from outputs. Sheets 3, 8, and 10, Revision level block: add “A“. - 11. a. CHECK ONE XIEXISTING DOCUMENT SUPPLEMENTED THIS SECTION FOR 6oyER19acT USE ONLY REVISED DOCUMENT MUST BE CUSTODIAN OF MASTER DOCUMENT

8、 BY THIS NOR MAY BE USED IN RECEIVED BEFORE MANUFACTURER SHALL MAKE ABOVE REVISION AND MANUFACTURE. MAY INCORPORATE THIS CHANGE. FURNISH REVISED DOCUMENT TO: b. ACTIVITY AUTHORIZED TO APPROVE SIGNATU E ANO TFE/b Form 1695, JUL 88 Previous editions are obsolete. 92-08-28 /- CHANGE FOR GOVERNMENT DESC

9、-ECC -ustom Microelectron cs DESC-ECC dd dw. 92-08-28 REVI ION COMPLETED (Signature) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-8 DESCRIPTION REV SHEET REV SHEET REV STATUS REV OF SHEETS I I 8 9 JO 11 12 13 14 15 16 17 SHEET 1 12 3 4 5 6 7 L PMI

10、C NIA STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE 3R USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA PREPAREDBY CYECXED BY 91 -01 -30 REVISION LEVEL DEFENSE UECTRONICS SUPPLY CENTER I DAYTON, OHIO 45444 I MICROCIRCUITS, DIGITAL, BIPOLAR, CMOS, OCTAL REGISTERED T

11、RANSCEIVER, MONOLITHIC SILICON SIZE CAGE CODE A 67268 596-1554 1 1 SHEET 1 OF 17 DESC FORM 193 SEP 87 U 5. C.OMRNMINT PRINTING OfFKt. I987 - 748- 129II 1 5962-El09 DISTRIBUTION STATEMENT A. Approved lor public release; distrlbulion Is unlimited. Provided by IHSNot for ResaleNo reproduction or networ

12、king permitted without license from IHS-,-,-SMD-59b2-31554 REV A 59 = 9999996 0025211 b35 1.1 SCO e. This drawing forms a part of a one part - one part number documentation system (see 6.6 herenif) Two product assurance classes consisting of military high reliability (device classes , Q, and MI and

13、space application (device classes S and Y), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifyiny Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use o

14、f MIL-STD-883 in conjunction with compliant non-JAN devices“. When dvailable, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN. 1.2 - PIN. The PIN shall be as shown in the following example: - 5962 91554 o1 M K X I I I -I- T -r l I I I l l - l I l I I I Federal RHA Devi

15、ce Device Case Lead stock class designator type cl ass out1 ine finish designator (See 1.2.1) (See 1.2.2) designator (See 1.2.4) (See 1.2.5) (See 1.2.3) Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes M, B, and S RHA marked devices shall meet the MIL-M-3SlO speciti

16、ed RHA 1 evels and shall be inarked with the appropriate RHA designator. levels and shall be marked with the appropriate RHA designator. device. Device classes Q and Y RHA marked devices shall meet the MIL-1-38535 specified RHA A dash (-1 indicates a non-RHA 1.2.2 Device type(s). The device types) s

17、hall identify the circuit function as follows: Device type Generic number Circuit function o1 54BCT544 I Octal registered transceivers with three-state outputs 1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as follows: I De

18、vice class Device requirements documentation I M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S 9 or Y Cert i fi cati on and qual i fica t ion to MI L-M-38510 Certification and qualification to MIL-1-38535 1.2.4 Case out

19、lines). For device classes M, 6, and S, case outline(s1 shall meet the requirements in appendix C of MIL-M-38510 and as listed below. outline(s) shall meet the requirements of MIL-1-38535, appendix C of MIL-M-38510, and as listed bel ow. For device classes Q and V, case Gutline letter Case outline K

20、 L 3 F-6 (24-lead, .640“ x .420“ x .090“), flat package 0-9 (24-lead, 1.280“ x .310“ x .200“), dual-in-line package C-4 (28-terminal, .460“ x .460“ x .loo“), square chip carrier package I STANDARDIZED SIZE I I 5962-91554 I MILITARY DRAWING I I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1 R

21、EVISION LEVEL 2 1 SHEET SEP 87 t U C GOVtRNMENT PHINTING OFFICE 1980-750 527R Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-91554 REV A 59 999999b 0025212 571 . 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for cl

22、asses M, B, and S The “X“ designation is for use in specifications when lead finishes A, B, and C are or MIL-1-38535 f or classes Q and V. its packaging. considered acceptable and interchangeable without preference. Finish letter “X“ shall not be marked on the microcircuit or 1.3 Absolute maximum ra

23、tings. L/ Supply voltage range Vcc - - - - - - - - - - - - DC input voltage (I/O ports) 21 - - - - - - - - DC input voltage (excluding I70 ports) g/ - - - Vol tage applied to a disabled three-state output Voltage applied to any output in the high state Input clamp current - - - - - - - - - - - - - -

24、 Current into any output in the low state - - - - Storage temperature range - - - - - - - - - - - Lead temperature (soldering, 10 seconds) - - - - Thermal resistance, junction-to-case (eJC) - - - Junction temperature (TJ) - - - - - - - - - - - Maximum power dissipation (PD) - - - - - - - - - -0.5 V

25、dc to +7.0 V dc -0.5 V dc to +5.5 V dc -0.5 V dc to +5.5 V dc -0.5 V dC to +7.0 V dc -0.5 V dC to VCC -30 BA 96 BA -65C to +150C +300 C See MIL-M-38510, appendix C +175OC 585 mW ?/ 1.4 Recommended operating conditions. Supply voltage range (V c) - Minimum high level input voitge ;VI 1 - - - - - - -

26、Maximum low level input voltage (V 7 - - - - - - - Maximum high level output current /OH) - - - - - - Maximum low level output current (10) - - - - - - - Case operating temperature range (TC) - - - - - - - Minimum pulse duration(t 1, latch enable low - - - - Minimum setup time(t 1, lata before latch

27、 enable - - Minimum hold time(thf, data after latch enable - - - +4.5 V dc to +5.5 Y dc 2.0 V dc 0.8 V dc -12 mA +48 BA -55C to +125C 7.0 ns 5.0 ns 1.0 ns 1.5 Digital logic testing for device classes Q and V. Faul t coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) -

28、- - - - - - XX percent !/ - I/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. - 2/ The input negative voltage ratings may be exceeded if the input clamp rating is observed.

29、- 31 Must be able to withstand the additional PD due to short circuit test, e.g., 10s. The PD number is based upon dc values. - 4/ Values will be added when they become available. STANDARDIZED SIZE A 5962-91554 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER SHEET D“. OHIO 45444 3 ESC FORM 193A S

30、EP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-2. APPLICABLE DOCUMENTS 2.1 Government s ecifications, stanoards, bulletin, and handbook. Unless otherwise specified, the followiny speciPfications, standards, bulletin, and handbook of the issue

31、listed in that issue of the Departinent of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPEC IF ICATI UNS MI L I TARY MI L-M-38510 - Microcircuits, General Specification for, MIL-1-38535 - Integrated Circuits

32、, Manufacturing, General Specification for. STANDARDS MILITARY MIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL- STD-883 - Test Methods and Procedures for Microelectronics. BULLET1 N MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMDs). HANDBOOK Pi

33、1 L I TAHY MI L-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bu1 letin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) refer

34、ences cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class M shall be in In the event of a conflict between the text of this drawing and the accordance with 1.2.1 of MIL-STD-883

35、, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. The individual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. For device classes B and S, a full electrical characterization

36、 table for each device type shall be included in this SMD. The individual item requirements for device classes Q and Y shall be in accordance with MIL-1-38535, the device manufacturers Quality Management (QM) plan, and as specified herein. 3.2 Desiyn, construction, and physical dimensions. The desig

37、n, construction, and physical dimensions shall be as specified in MIL-M-38510 f or device classes M, 6, and S and MIL-1-38535 for device classes Q and V and herein. I 3.2.1 Case outline(s1. The case outline(s1 shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connect

38、ions shall be as specified on figure 1. SIZE 5962-91554 STANDARDIZED MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 4 8 DESC FORM 193A SEP a7 f US GOVERNMENT PRINTING OFFICE 9M 750527 Provided by IHSNot for ResaleNo reproduction or networking permitted w

39、ithout license from IHS-,-,-3.2.3 Truth table. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter 1 imits. Unless The truth table shall be as specified on figure 2. otherwise specified herein, the electri

40、cal performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. specified in table IIA. The electrical tests for each subgroup are defined in table 1. 3.4 Electrical test requirements. The electrical tes

41、t requirements shall be the subgroups 3.5 Markin . The part shall be marked with the PIN listed in 1.2 herein. Marking for device PIN may also be marked as listed in MIL-BUL-103. Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking for device classes Q and V shall be i

42、n accordance with 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as class M + sha be in accordance with MIL-STD-883 (see 3.1 herein). In addition, the manufacturers MIL- 1-38535. required in MIL-IU-WJ ( see 3.1 nerein). be a “J“ or “JAN“ as required in MIL

43、-M-38510. shall be a “VML“ as required in MIL-1-38535. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). For device classes Q and Y, a certifica

44、te of compliance shall be required from a O#-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of compliance submitted to DESC-ECS prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers

45、product meets, for device class M the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. MIL - ST D- see erein or evice classes B and S in MIL-M-38510 or for device classes Q and V in MIL-I? B-to-A flow control fs

46、 the same except uses CEBA, IFEX, and m. 2. Data present before low-to-high transition of m. FIGURE 2. Truth table. SIZE A 5962-91554 STANDARDIZED MILTTARY DRAWING DEFENSE u“ICS SUPPLY CEMER REVISION LEVEL SHEEi MYION. OHIO 45444 9 I U S GOVEANMENT PRINTING OFFICE lm 750527R DESC FORM 193A SEP a7 Pr

47、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-91554 REV A 59 999999b 0025219 92b D STANDARDIZED SIZE MILITARY DRAWING A 5962-91554 . SHEET DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH0 45444 RMSION LEVU - TO 7 OTHER CHANNELS FIGURE 3. Logic

48、diagram. SEP 87 i US GOVERNMENT PRINTING OFFICE 1990.750527R Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-t SUD-57b2-71554 REV A 57 777777b 0025220 b48 m IMING NPUT IATA NPUT 7.0 V FROM OUTPUT UNDER TEST ;VTEST POINT - = 50 pF, includes probe and

49、jig capacitance. RL = Ri = Rp = 500n. I Test I S1 I I tpLH I Open I I tpHL I pen I I tpZH I pen I i tpz I Closed i I tpHZ I pen I I tpz I Closed I I x1.5 V 3.0 V 0.0 v 3.0 V 0.0 v 3.0 r HIGH LEVEL PULSE 0.0 c LOW LEVEL PULSE 0.0 i - FIGURE 4. Test circuit and switching waveforms. SIZE 5962-91 554 STANDARDIZED MILITARV DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER RMSION LEVEL SHEET