DLA SMD-5962-91586 REV B-2006 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL 10-LINE-TO-4-LINE PRIORITY ENCODER MONOLITHIC SILICON《硅单块 10-4线优先编码器 小功率肖特基晶体管晶体管逻辑 数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added case outline 2. Updated Table I VOHconditions. Editorial changes throughout. 99-07-15 Ray L. Monnin B Update to current requirements. Editorial changes throughout. - gap 06-08-02 Ray L. Monnin REV SHET REV SHET REV STATUS REV B B B B B B B

2、B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Larry E. Shaw DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Lee J. Surowiec COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Ray Monnin MICR

3、OCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, 10-LINE-TO-4-LINE PRIORITY AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 98-11-06 ENCODER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-91586 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E505-06 Provided by IHSNot f

4、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class

5、 levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are refle

6、cted in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91586 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator.

7、Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates

8、 a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS147 10-line-to-4-line priority encoder 1.2.3 Device class designator. The device class designator is a single letter identifying the product assura

9、nce level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(

10、s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line Package F GDFP2-F16 or CDFP3-F16 16 Flat Package 2 CQCC1-N20 or CQCC2-N20 20 Square leadless chip carrier Package 1.2.5 Lea

11、d finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENT

12、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) +7.0 V dc Maximum power dissipation (PD) 2/ . 140 mW Input voltage (VI) . +7.0 V dc Storage temperature range -65C to +150C Thermal resistance, junction-to-case

13、(JC) See MIL-STD-1835 Junction temperature (TJ) +175C Case operating temperature range (TC) -55C to +125C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc to 5.5 V dc High-level output current (IOH) . -0.4 mA maximum Low-level output current (IOL) 4 mA maximum Case operati

14、ng temperature (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cite

15、d in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines

16、. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 70

17、0 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations

18、unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ PDis defined as VCCx ICC. Provided by IHSNot for ResaleNo reproduction

19、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q an

20、d V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be

21、 in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535,

22、 appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic di

23、agram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electr

24、ical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for

25、each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of n

26、ot marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compl

27、iance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance s

28、hall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 here

29、in). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-385

30、35, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change fo

31、r device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquirin

32、g activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall b

33、e in microcircuit group number 11 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC F

34、ORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max High-level input voltage VIH1, 2, 3 All 2.0 V Low-level input voltage VIL1, 2, 3 All 0.7 V Input clamp voltage VIKVCC= 4.

35、5 V, II= -18 mA 1, 2, 3 All -1.5 V High-level output voltage VOHVCC= 4.5 V, VIH= 2.0 V, IOH= -0.4 mA, VIL= 0.7 V 1, 2, 3 All 2.5 V Low-level output voltage VOLVCC= 4.5 V, VIH= 2.0 V, VIL= 0.7 V, IOL= 4 mA 1, 2, 3 All 0.4 V Input current at maximum input voltage IIVCC= 5.5 V, VI= 7.0 V 1, 2, 3 All 0.

36、1 mA High-level input current IIHVCC= 5.5 V, VI= 2.7 V 1, 2, 3 All 20 A Low-level input current IILVCC= 5.5 V, VI= 0.4 V 1, 2, 3 All -0.4 mA Short circuit current IOSVCC= 5.5 V 1, 2, 3 All -20 -100 mA Supply current ICCVCC= 5.5 V. All inputs and outputs open, except input 7 at GND 1, 2, 3 All 20 mA

37、Functional test See 4.4.1b 7, 8A, 8B All Propagation delay time, low- to-high level output, from any input to any output tPLHCL= 15 pFRL= 2000 , In-phase output 9 All 18 ns Propagation delay time, high- to-low level output, from any input to any output tPHLVCC= 5.0 V, TC= 25C 2/ 9 All 18 ns Propagat

38、ion delay time, low- to-high level output, from any input to any output tPLHCL= 15 pF RL= 2000 , Out-of-phase output 9 All 33 ns Propagation delay time, high-to-low level output, from any input to any output tPHLVCC= 5.0 V, TC= 25C 2/ 9 All 23 ns 1/ For negative and positive voltage and current valu

39、es, the sign designates the potential difference to GND and the direction of current flow, respectively, and the absolute value of the magnitude, not the sign, is relative to the minimum and maximum limits, as applicable, listed herein. 2/ Load circuits and voltage waveforms are shown in Figure 4. P

40、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E F 2 Terminal number

41、Terminal symbol 1 4 4 NC 2 5 5 4 3 6 6 5 4 7 7 6 5 8 8 7 6 C C NC 7 B B 8 8 GND GND C 9 A A B 10 9 9 GND 11 1 1 NC 12 2 2 A 13 3 3 9 14 D D 1 15 NC NC 2 16 VCCVCCNC 17 - - - - - - 3 18 - - - - - - D 19 - - - - - - NC 20 - - - - - - VCCFIGURE 1. Terminal connections. INPUTS OUTPUTS 1 2 3 4 5 6 7 8 9

42、D C B A H H H H H H H H H H H H H X X X X X X X X L L H H L X X X X X X X L H L H H H X X X X X X L H H H L L L X X X X X L H H H H L L H X X X X L H H H H H L H L X X X L H H H H H H L H H X X L H H H H H H H H L L X L H H H H H H H H H L H L H H H H H H H H H H H L H = high logic level L = low log

43、ic level X irrelevant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 FIGUR

44、E 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. All diodes are 1N916

45、 or 1N3064. 2. CLincludes probe and jig capacitance. FIGURE 4. Test circuit and timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91586 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

46、 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM pl

47、an shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on

48、all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity u