1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to current requirements. Editorial changes throughout. - gap 06-08-10 Ray Monnin The original first page of this drawing has been replaced. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11
2、12 13 PMIC N/A PREPARED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim Noh COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ECL, QUAD 2-INPUT MUL
3、TIPLEXER/LATCH, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-05-04 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-91654 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E520-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
4、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
5、 and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following
6、example: 5962 - 91654 01 M X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-3853
7、5 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) ide
8、ntify the circuit function as follows: Device type Generic number Circuit function 01 100355 Quad 2-input multiplexer/latch 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation
9、 M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as fol
10、lows: Outline letter Descriptive designator Terminals Package style X GDIP5-T24 or CDIP6-T24 24 dual-in-line Y See figure 1 24 quad flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IH
11、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Negative supply voltage range (
12、VEE) . -7.0 V dc to +0.5 V dc DC input voltage range (VIN) VEEto +0.5 V Maximum dc output current (IOUT) -50 mA Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +175C Maximum power dissipation (PD) . 701 mW Thermal resistance, junct
13、ion-to-case (JC): Case X . See MIL-STD-1835 Case Y . 28 C/W 1.4 Recommended operating conditions. Negative supply voltage range (VEE) . -5.7 V dc minimum to -4.2 V dc maximum High level input voltage range (VIH) . -1.165 V minimum to -0.870 V maximum Low level input voltage range (VIL) -1.830 V mini
14、mum to -1.475 V maximum Case operating temperature range (TC) -55C to +125C Minimum setup time, data to enable (ts) . 0.9 ns Minimum hold time, data to enable (th) 0.4 ns Minimum setup time, select to enable (ts) . 2.4 ns Minimum hold time, select to enable (th) 0.0 ns Minimum setup time, master res
15、et to enable (ts) 1.5 ns Minimum pulse width, enable (tpw) 2.0 ns Minimum pulse width, master reset (tpw) 2.0 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified h
16、erein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Micr
17、ocircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksea
18、rch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence.
19、 Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliabil
20、ity. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The in
21、dividual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The indivi
22、dual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and h
23、erein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. Th
24、e truth table shall be as specified on figure 3. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
25、performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each
26、subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not ma
27、rking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance
28、 mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall
29、be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein).
30、The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, a
31、ppendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for dev
32、ice class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring act
33、ivity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
34、microcircuit group number 33 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM
35、2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/ -55C TC +125C -5.7 V VEE -4.2 V unless otherwise specified Group A Subgroups Min Max Unit 1, 2 -1.025 -0.870 High level output voltage VOH3 -1.085 -0.870 1, 2 -1.830 -1.620 Low level output voltage VOLVEE=
36、-4.2 V, VIL= -1.830 V, VIH= -0.870 V 3 -1.830 -1.555 1, 2 -1.035 High level threshold output voltage VOHC3 -1.085 1, 2 -1.610 Low level threshold output voltage VOLCVEE= -4.2 V, VIL= -1.475 V, VIH= -1.165 V 3 -1.555 V 1, 2 220 High level input current, select inputs IIH13 320 1, 2 350 High level inp
37、ut current, enable inputs IIH23 500 1, 2 340 High level input current, data inputs IIH33 490 1, 2 430 High level input current, master reset input IIH4VEE= -5.7 V, VIN= -0.870 V 3 630 Low level input current IILVEE= -4.2 V, VIN= -1.830 V 1, 2, 3 0.5 A Power supply drain current IEEVEE= -5.7 V, -4.2
38、V Inputs open 1, 2, 3 -95 -32 mA Functional tests VIL= -1.652 V, VIH= -1.018 V VEE= -5.7 V, -4.2 V, See 4.4.1b 7, 8 See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE
39、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions 1/ -55C TC +125C -5.7 V VEE -4.2 V unless otherwise specified Group A subgroups Min Max Unit 9 0.5 2.2 10 0.5 2.6
40、 Propagation delay time, data to output tPLH1, tPHL111 0.4 2.3 9 0.8 2.7 10 0.8 3.2 Propagation delay time, select to output tPLH2, tPHL211 0.6 3.0 9 0.6 2.3 10 0.7 2.7 Propagation delay time, enable to output tPLH3, tPHL311 0.5 2.6 9 0.7 2.6 10 0.7 2.9 Propagation delay time, master reset to output
41、 tPLH4, tPHL411 0.6 2.8 9 0.4 1.9 10 0.4 1.9 Transition time, 2/ output tTLH, tTHLSee figure 4 11 0.4 1.9 ns 1/ Each input/output, as applicable, shall be tested at the specified temperature for the specified limits. Output terminals shall be terminated through 50 to -2.0 V. Input terminals not desi
42、gnated shall be high logic level, low logic level, or open. 2/ This parameter is provided as design information only (not tested but guaranteed). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE
43、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Inches 1/ Millimeters 1/ Symbol Min Max Min Max A .085 2.16 b .016 .018 0.41 0.46 c .004 .006 0.10 0.15 D/E .370 .400 2/ 9.40 10.16 2/ e .045 .055 1.14 1.40 L .250 .360 6.35 9.14 Q .035 .050 0.89 1.27 S .
44、075 1.91 N 24 24 NOTE: 1. The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence.
45、 2. This dimension allows for meniscus and glass overrun. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL
46、A SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outlines X Y Terminal number Terminal symbol 1 D1d D0c 2 Qd D1c 3 dQ D0d 4 cQ D1d 5 Qc Qd 6 VCCdQ 7 VCCAcQ 8 bQ Qc 9 Qb VCC10 Qa VCCA11 aQ bQ 12 D0a Qb 13 D1a Qa 14 D0b aQ 15 D1b D0a 16 0S D1a 17 S1 D0b 18 VEED1b 19 MR 0S 20 1E S1 21 2E VEE22 D0c M
47、R 23 D1c 1E 24 D0d 2E FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91654 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR
48、 97 Inputs Outputs MR 1E 2E S1 0S D1x D0x xQ Qx H X X X X X X H L L L L H H H X L H L L L H H L X H L L L L L L X H L H L L L L L X L H L L L L L H X X H L L L L H L H X L H L L L H L X H L H L L L H L L L H L L H X X X X X * * L X H X X X X * * H = High voltage level L = Low voltage level X = Irrelevant * = Latched (stores data present before E went HIGH) FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR
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