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本文(DLA SMD-5962-91696 REV A-1996 MICROCIRCUIT DIGITAL CMOS 16 X 8-BIT DUAL PIPELINE REGISTER MONOLITHIC SILICON《硅单块 16 X 8比特双流水线寄存器 互补金属氧化物半导体 数字微型电路》.pdf)为本站会员(dealItalian200)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-91696 REV A-1996 MICROCIRCUIT DIGITAL CMOS 16 X 8-BIT DUAL PIPELINE REGISTER MONOLITHIC SILICON《硅单块 16 X 8比特双流水线寄存器 互补金属氧化物半导体 数字微型电路》.pdf

1、- - - - SND-5962-Lbb REV A b 0087952 808 DEFENSE LOGISTICS AGENCY DEFENSE ELECTRONICS SUPPLY CENTER 1507 WILMINGTON PIKE DAYTON, OH 45444-5765 IN REPLY REFERTO: DESC-ELDC (Mr. Gauder/ (AV 986) 513-296-8526/1tg) SUBJECT: Notice of Revision (NOR) 5962-R103-96 for Standard Microcircuit Drawing (SMD) 59

2、62-91696. Military/Industry Distribution The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should be attached

3、 to the subject SM for future reference. Thoee companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DESC a certificate of cornpliance. This is evidenced by an existing active current certificate of

4、 compliance on file at DESC along with a DESC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DESC is otherwise notified. If you have comments or questions, please contact Larry T. Gauder at (AV3986-8526 / (513) 29

5、6-8526. 1 Encl MONICA L. POELKING Chief, Custom Microelectronics Branch Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE OF REVISION (NOR) Defense Electronics Supply Center 1507 Wilmington Pike Dayton, OH 45444-5765 a. TYPED NAME (First, Middle

6、 Initial, Last) Form Approved OMB NO. 0704-0188 1. DATE (YYMMDD) 96-04- 19 67268 5962-R103-96 7. CAGE COOE 8. DOCUMENT WO. 67268 5962-91696 This revision described below has been authorized for the document listed. I I 10. REVISION LETTER 9. TITLE OF DOCUMENT Public reporting.burden for this collect

7、ion is estimated to average 2 hours per response jncluding the time for reviewing instructions searching existing data sources gathering and maintaining the data needed, and caip eting and reviewing the collection of information. this burden estimate or an for reducing this burden !o Deiprtment of D

8、efense Washingtion Headquarters Services Directorate for Information Operatiofs and epts 1215 Jeffekon Davis Highway Suite 1204 Arln ton VA 22202-4302, and to the Office of ana add IIAII. Revisions description column; add lChanges in accordance with NOR 5962-R103-9611. Revisions date column; add 119

9、6-04-1911. Revision level block; add I8AI1. Rev status of sheets; For sheets 1 and 6 add lAtt. TABLE I. Output short current, Ias; delete test in its entirety. Revision level block; add 14Al. Sheet 6: Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

10、MD-5962-9L696 59 9999996 0007370 T W LTR DESCRIPTION DATE (YR-MO-DA) APPROVED I REV STATUS OF SHEETS PMIC N/A REV SHEET 123 PREPARED v/L STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AWING APPROVAL DATE SIZE A AMSC NIA CA

11、GE CODE 5962-91696 67268 REVISION LEVEL 1 )ESC FORM 193 JUL 91 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 kICROCIRCUIT, DIGITAL, CMOS, 16 X 8 BIT DUAL PIPELINE REGISTER, MONOLITHIC SILICON 5962-E357 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

12、HS-,-,-SMD-59b2-93b9b 59 W 999999b 0007373 II 1. SCOPE 1.1 W. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes 8, Q, and M) and space application (device classes S an

13、d VI, and a choice of case outlines ,and lead finishes are available and are reflected in the Part or Identifying Number (PIN). accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. Device class M microcircuits represent non-JAN

14、class B microcircuits in When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 91 696 RHA Tif1 Devi ce Devi ce Case Lead type class outline finish (See 1.2.2) designator (See 1.2.4) (See 1.2.5

15、) I I i Federal stock class designator / (See 1.2.3) designator (See 1.2.1) I Drawing number 1.2.1 Radiation hardness assurance (RHA) desianator. Device classes M, 8, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. V R

16、HA marked devices shall meet the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-1 indicates a non-RHA device. Device classes Q and 1.2.2 evice typeW. The device type(s) shall identify the circuit function as follows: Devi ce type Generic number Ci

17、r cu i t function Propagation delay o1 ! O2 29C525 16 x 8-bit, variable delay 1-16 stage 25 ns 29C525 16 x 8-bit, variable delay 1-16 stage 20 ns 1.2.3 Device class desianator. assurance level as follows: Device class Device requirements documentation The device class designator shall be a single le

18、tter identifying the product M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Q or V Certification and qualification to MIL-M-38510 Certification and qualification to MIL-1-38535 1.2.4 Case outlineb). For device classes

19、M, 8, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. MIL-1-38535, appendix C of MIL-M-38510, and as listed below. Outline letter Case outline For device classes Q and V, case outline(s) shall meet the requirements of U F-Il (28-lead, .74O1I x .38

20、O1# x .090“), flat Pack X Y 3 D-15 (28-lead, 1.485“ x .310“ x .230“), dual-in-line package See figure 1 (28-lead, 1.485“ x .410“ x .230“), dual-in-line package C-4 (28-terminal, .460“ x .460“ x .100“), square leadless chip carrier package SIZE 5962-91636 STANDARDIZED A MILITARY DRAWING DEFENSE ELECT

21、RONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET 2 ESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER SMD-59b2-9Lb9b 59 m 999999b 0007372 3 m -_I 5962-916

22、96 SIZE A 1.2.5 Lead finish. for classes Q and V. designation is for use in specifications when lead finishes A, B, and C are considered acceptable and The lead finish shall be as specified in MIL-M-38510 for classes M, 6, and S or MIL-1-38535 Finish letter “X“ shall not be marked on the microcircui

23、t or its packaging. The “Xi interchangeable without preference. 1.3 Absolute maximum ratings. I/ Storage temperature range - - - - - - - - - - - - - - - - - - - Vcc supply voltage with respect to ground range - - - - - - - - Input signal with respect to ground range - - - - - - - - - - - Signal appl

24、ied to high impedance output range - - - - - - - - - Output current into low outputs - - - - - - - - - - - - - - - - Lead temperature (sovdering, 10 seconds) - - - - - - - - - - - - Thermal resistance, junction-to-case: power dissapation (p ) - - - - - - - - - - - - - - - - - - - - - Junction temper

25、ature - - - - - - - - - - - - - - - - - - - - - - CaceY- - CasesU,X,3 - - - I .4 Recommended operat i nq conditions. Supply voltage (vcc) - - - - - - - - - - - - - - - - - - - - - Operating case temperature (TC) - - - - - - - - - - - - - - - - Maximum high level input voltage (VI ) - - - - - - - - -

26、 - - - - Maximum low level input voltage WILY- - - - - - - - - - - - - - 1.5 Diaital logic testinq for device classes Q and V. Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) - - - - - - - - - 2. APPLICABLE DOCUMENTS -65OC to +15OoC -0.5 V to t7.0 V -0.5 V to

27、Vcc -i 0.5 -0.5 V to Vcc -i 0.5 25 mA 110 mW 300“ c 175OC 35OC/W See MIL-M-38510, appendix C 4.5 v 5 v -55OC to 1$25OC 2.0 v 0.8 V 5 5.5 v XX percent 2/ 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, an

28、d handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification for. MIL-1-38535 - Int

29、egrated Circuits, Manufacturing, General Specification for. STANDARDS MILITARY MIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL-STD-883 - Test Methods and Procedures for Microelectronics. - I/ Stresses above the absolute maximum rating may cause permanent damage t

30、o the device. - 2/ Values will be added when they become available. Extended operation at the maximum levels may degrade performance and affect reliability. DAYTON, OHIO 45444 I REVISION LEVEL I SHEET JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH

31、S-,-,-SND-5962-9Lb96 59 = 9999996 0007373 5 = BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMDs). HANDBOOK MILITARY M IL-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with

32、 specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. 3. REQUI

33、REMENTS 3.1 The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, IIProvisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. The individual item requirements for device classes B and S shall be in ac

34、cordance with MIL-M-38510 and as specified herein. For device classes B and S, a full electrical characterization table for each device type shall be included in this SMD. The individual item requirements for device classes Q and V shall be in accordance with MIL-1-38535, the device manufacturers Qu

35、ality Management (QM) plan, and as specified herein. specified in MIL-M-38510 for device classes M, B, and S and MIL-1-38535 for device classes Q and V and herein. Item requirements. 3.2 Design, construction, and physical dimensions. 3.2.1 Case outline(s1. The case outline(s shall be in accordance w

36、ith 1.2.4 herein and figure 1. 3.2.2 Terminal connections. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Block or logic diagram. 3.2.5 Switching waveforms. 3.2.6 Radiation exposure circuit. 3.3 Elect ri cai perf ormance characteri st i cs and post irradiation Daranteter

37、 limits. The design, construction, and physical dimensions shall be as The terminal connections shall be as specified on figure 2. The block or logic diagram shall be as specified on figure 4. The switching waveforms shall be as specified on figure 5. The radiation exposure circuit shall be specifie

38、d when available. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. IIA. 3.4 Electrical test requirements. 3.5 Marking. The electrical test req

39、uirements shall be the subgroups specified in table The electrical tests for each subgroup are defined in table 1. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-BUL-103. classes Q and V shall be in

40、 accordance with MIL-1-38535. In addition, the manufacturerls PIN may also be marked as listed in Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking for device The compliance mark for device class M shall be a “C“ as required in 3.5.1 Certification/compliance mark. M

41、IL-STD-883 (see 3.1 herein). in MIL-M-38510. The certification mark for device classes B and S shall be a ltJl or “JAN“ as required The certification mark for device classes Q and V shall be a “QML“ as required in MIL-1-38535. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, O

42、HIO 45444 SIZE 5962-91696 A REVISION LEVEL SHEET 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SID-5962-9Lb9b 59 9999996 0007374 7 - 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufact

43、urer Sn order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). prior to listing as an approved

44、 source of supply for this drawing shall affirm that the manufacturers product meets, for device class M, the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. A certificate of conformance as required for device

45、class M in MIL-STD-883 (see 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. For device class M, notification to DESC-ECC of change of product (see 6.2 herein) involving devic

46、es acquired to this drawing is required for any change as defined in MIL-STD-480. activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assig

47、nment for device classes M, B, and S. this drawing shall be in microcircuit group number 40 (see MIL-M-38510, appendix E). For device The certificate of compliance submitted to DESC-ECC 3.7 Certificate of conformance. 3.8 Notification of change for device class M. 3.9 Verification and review for dev

48、ice class M. For device class M, DESC, DESCs agent, and the acquiring Device classes M, 6, and S devices covered by 3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with MIL-M-38510. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For d

49、evice class M, sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). sampling and inspection procedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. MIL-1-38535 and the device manufacturers QM plan. be conducted on all devices prior to quality co

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