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本文(DLA SMD-5962-91732-1993 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 3-TO-8 LINE DECODER DEMULTIPLEXOR TTL COMPATIBLE MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路兼容 3到8线译码器或光学多路分解器 高速互补金属氧化物半导体 数字微型.pdf)为本站会员(fatcommittee260)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-91732-1993 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS 3-TO-8 LINE DECODER DEMULTIPLEXOR TTL COMPATIBLE MONOLITHIC SILICON《硅单块 晶体管-晶体管逻辑电路兼容 3到8线译码器或光学多路分解器 高速互补金属氧化物半导体 数字微型.pdf

1、W 9999996 0091475 255 W LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET 15 16 17 REV STATUS OF SHEETS PMIC NIA STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA REV I I I SHEET 123 PREPARED BY Wanda L. Meadows CHE

2、CKED BY Thomas J. Ricciuti APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 93-03-31 REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, HIGH-SPEED DEMULTIPLEXOR, TTL COMPATIBLE, MONOLITHIC SILICON CMOS, 3-TO-8 LINE DECODER/ I SIZE ICAGE CODE A 67268 5962-9

3、1732 SHEET ? OF 18 DESC FORM 193 JUL 91 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 5962-E686-92 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-= 999999b O093476 193 D STANDARDIZED MILITARY DRAWING DEFENSE ELECT

4、RONICS SUPPLY CENTER DAYTON, OHIO 45444 I 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S an

5、d VI, and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with comp

6、liant non-JAN devices“. available, a choice of Radiation Hardness Assurance (RHAI levels are reflected in the PIN. When 5962-91732 SIZE A REVISION LEVEL SHEET I 1.2 m. The PIN shall be as shown in the following example: - X - o1 M E I I I I I 91 732 - 5962 I I I I l I I Lead finish Case Devi ce Devi

7、 ce -1 Federal RHA stock class designator type class outline designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes M, 6, and S RHA marked devices shall meet the MIL-il-38510 specified RHA Levels and shall be marked w

8、ith the appropriate RHA designator. the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shall meet A dash (-1 indicates a 1.2.2 Device type(s). The device type(s) shall identify the circuit function a

9、s follows: Device type Generic number Circuit function o1 54HCT137 3-to-8 line decoder/demultiplexor with address latches, TTL compatible inputs 1.2.3 Device class designator. The device class designator chat1 be a single letter identifying the product assurance level as follows: Device class Device

10、 requirements documentation M Vendor self-certification to the requirements for non-JAN class 6 microcircuits in accordance with 1.2.1 of MIL-STD-883 EI or S Q or v Cert i f i cat ion and qua li f i cat ion to MIL-M-38510 Certification and qualification to MIL-1-38535 1.2.4 Case outline(s). The case

11、 outline(s1 shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Termi na 1s Packaae style E 2 GDIPI-TI6 or CDIP2-Tl6 16 CQCCI-N20 20 Dua 1-i n- li ne Square leadless chip carrier 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for clas

12、ses M, 8, and S or MIL-1-38535 for classes Q and V. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “X“ designation is I for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. _. DESC FORM 193A JUL 91

13、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-9 9999996 009L477 028 STANDARDIZED MILITARY DRAWING I DEFENSE ELECTRONICS SUPPLY CENTER 1.3 Absolute maximum ratings. I/ 21 3/ SIZE 5962-91732 A Supply voltage range (V c) DC output voltage range (Vo T

14、) DC input clamp current (iI$ (vI vCc) DC output clamp current (IOK) No Vcc) DC output current, per output (IOUT) (V UT = O to Vcc) (per output) DC Vcc or ground current (Icc or IGND) ?per pin) . Maximum power dissipation (PD) Storage temperature range (TS c) . Lead temperature (soldering, JO second

15、s) . Thermal resistance, junction-to-case (OJc) Case operating temperature range (TC) 1.4 Recommended operating conditions. I/ 2/ 3/ DC input voltage range FVIN) . . Junction temperature (TJ) Supply voltage range Wee) Input voltage range Output voltage range . Case operating temperature range (TC) M

16、aximum Low level input voltage (VIL) Minimum high level input voltage (VIH) Input rise and fall times range Ctr, tf) (0.1 to 0.9VIN, 0.9 to O.lVIN) . Maximum high level output current (I ) . Maximum tow level output current (127 I . -0.5 V dc to +7.0 V dc -0.5 V dc to Vcc + 0.5 V dc -0.5 V dc to Vcc

17、 + 0.5 V dc I20 mA i20 mA *25 mA 150 mA 500 mw s/ -65C to +150C +3oO0c See MIL-STD-1835 t175“C -55C to +125“C 4.5 V dc to 5.5 V dc 0.0 V dc to Vcc 0.0 V dc to V sc -55OC to +I25 C 0.8 v dc 2.0 V dc O to 500 ns -4 mh +4 ah 1.5 Digital loqic testing for device classes Q and V. Fault coverage measureme

18、nt of manufacturing logic tests (MIL-STD-883, test method 5012) 5/ percent - I- - l/ Stresses above the absolute maximum rating may cause permanent damage to the device. maximum levels may degrade performance and affect reliability. for allowable short duration burn-in screening conditions in accord

19、ance with method 5004 of MIL-STO-883. - 2/ Unless otherwise specified, all voltages are referenced to GND. - 31 The limits for the parameters specified herein shall apply over the full specified Vcc range and case temperature range of -55OC to +12SoC. - 4/ For TC = +lOOC to +125“C, derate linearty a

20、t I1 mW/“C. - 51 Velues will be added when they become available. Extended operation at the The maximum junction temperature may be exceeded DAYTON, OHIO 45444 I REVISION LEVEL I SHEET DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

21、-,-,-= 99997b 0093478 Tb4 STANDARDIZED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin,

22、and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified 5962-91732 SHEET 4 herein. SPECIFICATIONS I DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo repro

23、duction or networking permitted without license from IHS-,-,-m 9999996 009l11179 9TO STANDARDIZED MI LI TARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 3. REQUIREMENTS 3.7 The individual item requirements for device class M shall be in accordance with 1.2.1 Of MIL-CTD-883, “Provisi

24、ons for the use of MIL-STD-883 in conjunction with compliant non-JAN devices and as specified herein. The individual item requirements for device classes 6 and S shall be in accordance with MIL-M-38510 and as specified herein. included in this SMD. MIL-1-38535, the device manufacturers Quality Manag

25、ement (QM) plan, and as specified herein. specified in MIL-M-38510 for device classes M, E, and S and MIL-1-38535 for device classes Q and V and herein. Item requirements. For device classes E and S, a full electrical characterization table for each device type shall be The individual item requireme

26、nts for device classes Q and V shall be in accordance with 3.2 Desian, construction, and physical dimensions. The design, construction, and physical dimensions shall be as 3.2.1 Case outline(s). The case outline(s1 shall be in accordance with 1.2.4. 3.2.2 Terminal connections. 3.2.3 Truth table. 3.2

27、.4 Lwic diawam. 3.2.5 figure 4. The terminal connections shall be as specified on figure 1. The truth table shall be as specified on figure 2. The logic diagram shall be as specified on figure 3. Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on

28、3.2.6 Schematic circuits. The schematic circuits shall be submitted to the preparing activity prior to the inclusion of a manufacturers device in this drawing and shall be submitted to the qualifying activity as a prerequisite for qualification for device classes B and S. maintained and available up

29、on request. 3.2.7 Radiation exposure circuit. 3.3 Electrical performance characteristics and postirradiation parameter limits. All qualified manufacturers schematics shall be The radiation exposure circuit shall be specified when available. Unless otherwise specified herein, the electrical performan

30、ce characteristics and postirradiation parameter limits are as specified in table 1 and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup

31、are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-BUL-103. Q and V shall be in accordance with MIL-1-38535. In addition, the manufacturers PIN may also be marked as

32、 listed in Marking for device classes B and S shall be in accordance with MIL-M-38510. Harking for device classes SIZE 5962-91732 A REVISION LEVEL SHEET 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as required in MIL-STD-883 (see 3.1 herein). in MIL-M-38

33、510. lhe certification mark for device classes B and S shall be a IIJ“ or “JAN“ as required The certification mark for device classes Q and V shall be a “QML“ as required in MIL-1-38535. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufactu

34、rer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of compliance su

35、bmitted to DESC-EC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M, the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. Fo

36、r device 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 N

37、otification of change for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-4O. 3.9 Verification and review for device class M. For device class M, DESC, DESCs

38、agent, and the acquiring activity Offshore documentation retain the option to review the manufacturers facility and applicable required documentation. shall be made available onshore at the option of the reviewer. DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permi

39、tted without license from IHS-,-,-999999b 0093480 bL2 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 TABLE I. Electrical performance characteristics. I I I I Group A I Device I Limits 2/ I Conditions I I symbol I SIZE 5962-91732 A REVISION LEVEL SHEET 6 Test I/ Hi

40、gh level output voltage CMOS levels 3006 Lou level output voltage CMOS loads 3007 Input current high 3010 Input current low 3009 -55C 5 TC I +12SoC i vCC isubgroupsi type i I 4.5 5 Vcc s 5.5 v I I I I I 1 unless otherwise specified 2/ I I I I Min VoH, I For all inputs affecting 1 4.5 V i 1,2,3 i All

41、 i 4.4 I output under test l I I I I IN = Or VIL i i i I I VIH = 2.1 v I I l I I VIL = 0.8 V I I I I 1 For all other inputs I I I I I VIN = Vcc or GND I I I I IOH = -20 FA I I I I I I I I I I I output under test I I I I Voa I For all inputs affecting 1 4.5 V I 1 I All I 3.98 I VIN = VIH Or i i i 1 V

42、IH = 2.0 v I I I I VIL = 0.8 V I I I I 23 I I For all other inputs I I VIN = Vcc or GND i i i ! ! ! I I, - -4 mA i I I I 3.7 I ! I I I I I I I l I I 4.5 V I 1,2,3 I All I I I For all inputs affecting I output under test I I I 1 VoL1 i I I v = V Or v i i I VIH = 2.0 v I I l I i I 1 For all other inpu

43、ts I I I I i I I VIL = 0.8 V VoL2 I For all inputs affecting i 4.5 V i 1 i All i I output under test I I I I i i i I I I I VIL = 0.8 V I I I I I For all other inputs I I 22 I I i I 1 VIN = Vcc or GND I I*L = 4 mA i I i I i i l I I IIH I For input under test I IN = CC I For all other inputs I I I I I

44、 5.5 v I 1 I All I I I I I I I I I i VIN = Vcc or GND I I ubgroupcr I type 1 Test I/ Symbol Conditions -55C I TC I +125OC 4.5 E vcc 5 5.5 v unless otherwise specified 2/ For all inputs VIN = VCc or GND vcc 5.5 v 5.5 v 1 1 I Min I Max 1 + I I 8.0 I I , - A - JA - mA Iccn 1 I All Juiescent supply curr

45、ent output high 3005 Niescent supply current output low 3005 %CL For all inputs VIN = Vcc or GND I 1 I All I I l 2/3 I I I 1 I All 4 I All + 7,8 I ALL I auiescent supply current delta, TTL input levels 3005 *cc For input under test VIN = 2.4 V or 0.5 V For all other inputs VIN = Vcc or GND 1 2.4 I 1

46、 3.0 5.5 v GND 4.5 v Input capacitance IN VIN = o v See 4.4.1 I I 0 I PF Truth table test output voltage 301 4 VIL = 0.4 V Verify output Vo See 4.4.lb VIH. 2.4 v LiH 5.5 v I LIH I I I 10,11 I 7,8 I All I *11 + 9 I All I I 10,ll 1 L I I 10,11 I I I 10/11 I I I AL - ns Puke duration time, GL low CL =

47、50 pF minimum See figure 4 4.5 v 5.5 v 4.5 v 5.5 v Setup time, Al. B, and C before GLT ns 23 I 21 i See footnotes at end of table. DAYTON, OHIO 45444 I REVISION LEVEL 1 SHEET DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-99999

48、9b 0093482 495 STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91732 A SHEET REVISION LEVEL 8 TABLE 1. Electrical performance characteristics - Continued. Test I/ Conditions -55C 5 TC 5 +125C 4.5 5 vcc 5 5.5 v unless otherwise specified 2/ I I I Group A

49、I Device subgroups I type Unit - ns - ns - ns Symbol th Limits z/ Min i Max I 51 I 51 I I 38 L I I 57 I I 57 I I 29 I 34 “cc 4.5 v 5.5 v 4.5 v 5.5 v 4.5 v 5.5 v Hold time, tL = 50 pF minimum see figure 4 I I I I I 9,10,11 I All 9 I All the absolute value of the magnitude, not the sign, is relative to the minimum and maximum limits, as applicable, listed herein. Tests shall be performed in sequence, attributes data only. oth

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