DLA SMD-5962-91755 REV A-2011 MICROCIRCUIT LINEAR HIGH SPEED VOLTAGE COMPARATOR WITH TRANSPARENT LATCH MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 11-01-19 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLU

2、MBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED, VOLTAGE COMPARATOR WITH TRANSPARENT LAT

3、CH, MONOLITHIC SILICON DRAWING APPROVAL DATE 92-12-23 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-91755 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E435-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

4、62-91755 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outli

5、nes and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91755 01 M G A Federal stock class designator RH

6、A designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA de

7、signator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number

8、 Circuit function 01 EL2018 High speed voltage comparator with transparent latch 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the require

9、ments for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator

10、 Terminals Package style G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without

11、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91755 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) . 18 V dc Input voltage (VIN) +VSto -VSDifferential input voltage . Limited only b

12、y power supplies Peak output current (IOP) . 50 mA Continuous output current 25 mA Input current ( GND, INPUT+, and INPUT- pins ) . 10 mA Input current ( SELECT CHIP and LATCH ENABLE pins ) 5 mA Power dissipation (PD): Case G 1.0 W Case P 1.5 W Junction temperature (TJ) . +175C Storage temperature r

13、ange . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) : Case G 190C/W Case P . 125C/W 1.4 Recommended operating conditions. Supply voltage (VS) . 15 V dc Ambient operating temperat

14、ure range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited i

15、n the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. D

16、EPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Buildin

17、g 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exempti

18、on has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

19、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-91755 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified

20、herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class

21、 level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines.

22、 The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characte

23、ristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defi

24、ned in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“

25、 on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certif

26、ication mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from

27、a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate o

28、f compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, a

29、ppendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for dev

30、ice class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime,

31、 DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device

32、class M devices covered by this drawing shall be in microcircuit group number 50 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91755 DLA LAND AND MARITIME COLUMBUS, OHIO 432

33、18-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VS= 15 V unless otherwise specified Group A subgroups Device type Limits 1/ Unit Min Max Input offset voltage VIOVCM= 0 V, VOUT= 1.4 V 1 01 -3.0 +3.0 mV 2,3 -5

34、.0 +5.0 Input bias current IIBVCM= 0 V, 1 01 -300 +300 nA INPUT+ and INPUT- pins 2,3 -500 +500 Input offset current IIOVCM= 0 V 1 01 -150 +150 nA 2,3 -250 +250 Power supply rejection ratio PSRR VS= 5 V to 15 V 1 01 85 dB 2,3 77 Common mode input range VCM1,2,3 01 12 V Voltage gain AVVOUT= .8 V to 2.

35、0 V 1 01 15 V/mV 2,3 10 Output voltage, logic low VOLIOL= 0 mA to 8 mA 1 01 -0.05 0.4 V 2,3 -0.1 0.4 Output voltage, logic high VOHVS= 15 V 1,2,3 01 3.5 4.65 V VS= 5 V 2.4 Output voltage range, disable VODIS1IOL= -1 mA, VS= 15 V 1,2,3 01 4.65 V IOL= -1 mA, VS= 5 V 2/ 1 3.0 VODIS2IOL= -1 mA, 1,2,3 -0

36、.3 VS= 5 V to 15 V LE or CS inputs, logic high input voltage VINH1 01 +2.0 V 2,3 +2.2 LE or CS inputs, logic low input voltage VINL1,2,3 01 0.8 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA

37、WING SIZE A 5962-91755 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C VS= 15 V unless otherwise specified Group A subgroups Device type Limits 1/ Unit Min M

38、ax LE or CS inputs, logic input current IINVIN= 0 V to 5 V 1 01 -200 +200 A 2,3 -300 +300 Positive supply current, enabled IS+EN1,2 01 10.0 mA 3 11.0 Positive supply current, disabled IS+DIS1 01 6.0 mA 2,3 7.0 Negative supply current, enabled IS-EN1 01 17.0 mA 2,3 18.0 Negative supply current, disab

39、led IS-DIS1,2,3 01 6.5 mA Common mode rejection ratio CMRR VCM= +12 V to 12 V 4 01 85 dB 5,6 80 Propagation delay, 5 mV overdrive TPDVIN= 100 A, TA= +25C 2/ 9 01 40 ns Setup time TSTA= +25C 2/ 9 01 12 ns Hold time THTA= +25C 2/ 9 01 0 ns Unlatch time TUNTA= +25C 2/ 9 01 40 ns Output three-state enab

40、le delay TENTA= +25C 2/ 9 01 70 ns Output three-state disable delay TDISTA= +25C 2/ 9 01 300 ns 1/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a

41、 device terminal. 2/ If not tested, shall be guaranteed to the limits specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91755 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISIO

42、N LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines G and P Terminal number Terminal symbol 1 GND 2 INPUT+ 3 INPUT-4 -VS5 SELECT CHIP ( CS ) 6 LATCH ENABLE (LE) 7 OUTPUT8 +VSNC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking

43、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91755 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be

44、in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535,

45、 appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and s

46、hall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and sh

47、all be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical

48、test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing act