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本文(DLA SMD-5962-92075 REV B-2006 MICROCIRCUIT DIGITAL ECL 68030 40 ECL TTL CLOCK DRIVER MONOLITHIC SILICON《硅单块 68030 40发射极耦合逻辑或晶体管-晶体管逻辑电路钟驱动器 发射极耦合逻辑 数字微型电路》.pdf)为本站会员(cleanass300)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92075 REV B-2006 MICROCIRCUIT DIGITAL ECL 68030 40 ECL TTL CLOCK DRIVER MONOLITHIC SILICON《硅单块 68030 40发射极耦合逻辑或晶体管-晶体管逻辑电路钟驱动器 发射极耦合逻辑 数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add “X“ package. Revise to new boilerplate. les 99-09-08 Ray Monnin B Update to current requirements. Editorial changes throughout. - gap 06-10-02 Ray Monnin REV SHET REV B B B SHEET 15 16 17 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS S

2、HEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICR

3、OCIRCUIT, DIGITAL, ECL, 68030/40 ECL/TTL CLOCK DRIVER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-06-04 MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-92075 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E522-06 Provided by IHSNot for ResaleNo reproduction

4、 or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92075 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of hi

5、gh reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN

6、. The PIN is as shown in the following example: 5962 - 92075 01 M X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V R

7、HA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2

8、 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 10H1042 68030/40 ECL/TTL clock driver 02 100H1042 68030/40 ECL/TTL clock driver, temperature compensated 1.2.3 Device class designator. The device class designator is a single

9、 letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualificatio

10、n to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 28 Quad flat package Y See figure 1 28 Quad flat package 1.2.5 Lead finish. The lead finish is as specified in

11、MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92075 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

12、N LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range: ECL supply (VEE) -0.5 V dc to +7.0 V dc TTL supply (VTT) . -0.5 V dc to +7.0 V dc Input voltage range: ECL inputs (VINE) 0.0 V dc to VEETTL inputs (VINT) -0.5 V dc to +7.0 V dc Storage temperature range .

13、-65C to +165C Lead temperature (soldering, 10 seconds) . +300C Maximum junction temperature (TJ) . +165C Maximum power dissipation (PD): Device type 01 460 mW Device type 02 479 mW Thermal resistance, junction-to-case (JC) . 1.23C/W 1.4 Recommended operating conditions. Supply voltage range (VEE, VT

14、T) 4.75 V dc to 5.25 V dc High level input voltage range: ECL inputs (VIH) device type 01 2/ . 3.830 V dc to 4.280 V dc ECL inputs (VIH) device type 02 2/ . 3.830 V dc to 4.120 V dc TTL inputs (VIH) 2.0 V dc to VTTLow level input voltage range: ECL inputs (VIL) device type 01 2/ . 3.050 V dc to 3.55

15、5 V dc ECL inputs (VIL) device type 02 2/ . 3.190 V dc to 3.525 V dc TTL inputs (VIL) -0.5 V dc to 0.8 V dc Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form

16、 a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE

17、STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are avail

18、able online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at

19、 the maximum levels may degrade performance and affect reliability. 2/ ECL levels referenced to VEEand will vary 1:1 with the power supply. The values shown are for VEE= 5.0 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA

20、WING SIZE A 5962-92075 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in t

21、his document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the

22、device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as speci

23、fied herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be i

24、n accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Logic diagram. The block or logic diagram shall be as specified on figure 4. 3.2.5 Test cir

25、cuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limit

26、s are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be

27、 marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this opt

28、ion, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall

29、be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to su

30、pply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to lis

31、ting as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certifi

32、cate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of cha

33、nge of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility an

34、d applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 32 (see MIL-PRF-38535, appendix A).Pr

35、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92075 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Tes

36、t Symbol Conditions -55C TC +125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max High level input voltage 2/ VIH(TTL)VEE= VTT; 4.75 V VEE 5.25 V 1, 2, 3 All 2.0 V 1 3.870 4.190 2 3.940 4.280 VIH(ECL)VEE= 5.000 V 3 01 3.830 4.160 1, 2, 3 02 3.835 4.120 Low level input vo

37、ltage 2/ VIL(TTL)VEE= VTT; 4.75 V VEE 5.25 V 1, 2, 3 All 0.8 V 1, 3 3.050 3.520 VIL(ECL)VEE= 5.000 V 2 01 3.050 3.555 1, 2, 3 02 3.190 3.525 High level output voltage VOHIOH= -3.0 mA, VTT= VEE= 4.75 V, VBB= Open, VIH(TTL)= 2.0 V 1, 2, 3 All 2.5 V VTT= VEE= 4.75 V, VBB= Open, IOH= -15 mA, VIH(TTL)= 2

38、.0 V, VIL(TTL)= 0.8 V, VIH(ECL)= VIL, VIL(ECL)= VIL3/ 2.0 Low level output voltage VOLVTT= VEE= 4.75 V, VBB= Open, IOL= 24 mA, VIH(TTL)= 2.0 V, VIL(TTL)= 0.8 V 1, 2, 3 All 0.50 V Input clamp voltage VICIIN= -18 mA, VTT= VEE= 4.75 V, VBB= Open 1, 2, 3 All -1.2 V 1 3.610 3.750 2 3.690 3.810 Output ref

39、erence voltage 2/ VBBVIH(ECL)= VIL(ECL)= Open, VTT= VEE= 5.0 V 3 01 3.520 3.730 V 1, 2, 3 02 3.620 3.740 Low level input current IIL(TTL)VIN= 0.5 V, VTT= VEE= 5.25 V, VBB= Open 1, 2, 3 All -0.6 A IIL(ECL)VTT= VEE= 5.25 V, VBB= Open, VIN= VIL3/ 0.5 High level input current IIH(TTL)VTT= VEE= 5.25 V, V

40、IN= 2.7 V 1, 2, 3 All 20 A VBB= Open VIN= 7.0 V 100 1, 2 175 IIH(ECL)VTT= VEE= 5.25 V, VBB= Open, VIN= VIH3/ 3 All 225 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92075 DEFE

41、NSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C Group A subgroupsDevice type Limits Unit unless otherwise specified Min Max Output short circuit curre

42、nt IOSVOUT= 0 V, VTT= VEE= 5.0 V, VBB= Open, VIN= 3.0 V 1, 2, 3 All -100 -225 mA Power supply current IEEVTT= VEE= 5.25 V, VBB= Open 1, 2, 3 All 57 mA ITTH IN= 3.0 V 1, 2, 3 All 30 ITTLVTT= VEE= 5.25 V, VBB= Open, Total all VTTpins VIN= 0.0 V Functional test VTT= VEE= 4.75 V, 5.25 V, See 4.4.1b 7, 8

43、 9 5.0 6.9 10 5.3 7.7 Propagation delay time, DT to Q tPLH1, tPHL1VEE= 4.75 V, CL= 50 pF, Q0, Q1 11 01 4.7 13.4 ns 9 4.8 6.5 10 4.9 7.8 IO= -6.0 mA, see figure 5 11 02 6.2 11.0 9 4.3 7.3 10 4.6 8.2 Q2-Q7 11 01 5.6 13.7 9 4.2 7.0 10 4.4 8.1 11 02 5.9 11.7 9 5.0 6.8 10 5.4 7.7 Propagation delay time D

44、E or DE to Q tPLH2, tPHL2VEE= 4.75 V, CL= 50 pF, Q0, Q1 11 01 4.5 12.6 ns 9 4.6 6.2 10 4.4 7.9 IO= -6.0 mA, see figure 5 11 02 5.4 10.3 9 4.4 7.4 10 4.8 8.3 Q2-Q7 11 01 5.5 13.0 9 3.9 6.9 10 4.0 8.3 11 02 5.6 11.2 Part-to-part skew 4/ tSKPPVEE= 4.75 V, CL= 50 pF, Q0, Q1 9, 10, 11 All 1.0 ns IO= -6.0

45、 mA, see figure 5 Q2-Q7 2.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92075 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 223

46、4 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max Within device skew tSKWDVEE= 4.75 V, CL= 50 pF, Q0, Q1 9, 10, 11 All 1.0 ns IO= -6.0 mA, see figure 5 Q2-Q7 0.5 9 4.

47、2 7.3 10 4.5 7.8 Propagation delay time, R to Q tPHL3VEE= 4.75 V, CL= 50 pF, IO= -6.0 mA, see figure 5 11 01 5.3 12.8 ns 9 3.9 7.3 10 4.1 7.8 11 02 5.5 10.4 9 5.0 10 5.0 Output transition times tTHL, tTLHVEE= 4.75 V, CL= 50 pF, IO= -6.0 mA, see figure 5 11 01 12.0 ns 9 4.0 10 5.5 11 02 9.3 Maximum t

48、oggle frequency fMAX9, 10, 11 All 135 MHz Reset pulse width tRPW9, 10, 11 All 1.5 ns Reset recovery time tRRT9, 10, 11 All 1.25 ns 1/ Limits are determined after a device has reached thermal equilibrium. This is defined as the reading taken with the device in a socket with 500 LFPM of +25C, +125C, or -55C (as applicable) air blowing on the unit in a transverse direction with power applied for at least four minutes before the reading is taken. 2 ECL levels are referenced to VTTand will vary 1:1 with the power supply. The value

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