DLA SMD-5962-92080 REV A-2001 MICROCIRCUIT LINEAR BUS TRANSCEIVER DIFFERENTIAL RS485 MONOLITHIC SILICON《硅单块 RS485差异总线接收器 直线式微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 01-12-14 R. MONNIN REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY DAN WONNELL DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICRO

2、CIRCUIT DRAWING CHECKED BY SANDRA ROONEY COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, BUS TRANSCEIVER, DIFFERENTIAL, RS485, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPRO

3、VAL DATE 93-10-07 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-92080 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E133-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH

4、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and spac

5、e application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example:

6、5962 - 92080 01 M P X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specifi

7、ed RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the

8、 circuit function as follows: Device type Generic number Circuit function 01 LTC485 Bus transceiver, differential, RS485 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M

9、Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follow

10、s: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or netwo

11、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 12 V dc Control input voltage .-0.5 V dc to VCC+0

12、.5 V dc Driver input voltage .-0.5 V dc to VCC+0.5 V dc Driver output voltage 14 V dc Receiver input voltage 14 V dc Receiver output voltage -0.5 V dc to VCC+0.5 V dc Power dissipation (PD), TA= 100C .250 mW 2/ Junction temperature (TJ) 155C Lead temperature (soldering 10 seconds) 300C Thermal resis

13、tance, junction-to-ambient (JA) .100C/W Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage (VCC) 5 V dc Ambient operating temperature range (TA) -55C to 125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. T

14、he following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,

15、 cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDB

16、OOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building

17、 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemptio

18、n has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derate linearity 10 mW/C above TA= 100C.Provided by IHSNot for ResaleNo reproduction or networkin

19、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be

20、 in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordan

21、ce with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A

22、and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise spe

23、cified herein, the electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table

24、II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to

25、space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance wi

26、th MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. Fo

27、r device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an ap

28、proved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein

29、 or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits d

30、elivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for de

31、vice class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for d

32、evice class M. Device class M devices covered by this drawing shall be in microcircuit group number 77 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFENSE SUPPLY CEN

33、TER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C VCC= 5 V dc 5 % Group A subgroups Device type Limits Unit unless otherwise specified Min Max Differential driver output volta

34、ge (unloaded) VOD1IO= 0 1,2,3 01 5 V Differential driver output voltage (with load) VOD2RL= 50 (RS422) 1,2,3 01 2 V RL= 27 (RS485) 1.5 5 Change in differential output voltage VODRL= 27 or 50 1,2,3 01 0.2 V Driver common mode output voltage VOCRL= 27 or 50 1,2,3 01 3 V Change in driver common mode ou

35、tput voltage VOCRL= 27 or 50 1,2,3 01 0.2 V Input high voltage VIHDE, DI, RE 1,2,3 01 2 V Input low voltage VILDE, DI, RE 1,2,3 01 0.8 V Input current IIN1DE, DI, RE 1,2,3 01 -2 +2 A Input current (A, B) IIN2DE = 0 V, VIN= 12 V, VCC= 0 or 5.25 V 1,2,3 01 1 mA DE = 0 V, VIN= -7 V, VCC= 0 or 5.25 V -0

36、.8 Differential input threshold voltage for receiver VTH-7 V VCM +12 V 1,2,3 01 -0.2 +0.2 V Receiver output high voltage VOHIO= -4 mA, VID= +200 mV 1,2,3 01 3.5 V Receiver output low voltage VOLIO= +4 mA, VID= -200 mV 1,2,3 01 0.4 V Three-state (high impedance) output current at receiver IOZR0.4 V V

37、O 2.4 V, VCC= MAX 1,2,3 01 -1 +1 A Receiver input resistance RIN-7 V VCM +12 V 1,2,3 01 12 k Supply current ICCOutputs enabled, no load, RE , DE, DI pins = 0 V or 5 V 1,2,3 01 900 A Outputs disabled, no load, RE , DE, DI pins = 0 V or 5 V 500 See footnotes at end of table. Provided by IHSNot for Res

38、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Condi

39、tions 1/ -55C TA +125C VCC= 5 V dc 5 % Group A subgroups Device type Limits Unit unless otherwise specified Min Max Driver short-circuit current, VOUT= HIGH IOSD1-7 V VO +12 V 1,2,3 01 35 250 mA Driver short-circuit current, VOUT= LOW IOSD2-7 V VO +10 V 1,2,3 01 35 250 mA Receiver short-circuit curr

40、ent IOSR0 V VO VCC1,2,3 01 7 85 mA Driver input to output 2/ tPLHD, tPHLDRDIFF= 54 , CL1= CL2= 100 pF 9,10,11 01 10 60 ns Driver output to output 2/ tSKEWRDIFF= 54 , CL1= CL2= 100 pF 9,10,11 01 10 ns Driver rise or fall time 2/ tR,tFRDIFF= 54 , CL1= CL2= 100 pF 9,10,11 01 3 40 ns Driver enable to ou

41、tput high tZHDCL= 100 pF 9,10,11 01 70 ns Driver enable to output low tZLDCL= 100 pF 9,10,11 01 70 ns Driver disable time from low tLZDCL= 15 pF 9,10,11 01 70 ns Driver disable time from high tHZDCL= 15 pF 9,10,11 01 70 ns Receiver input to output 2/ tPLHR, tPHLRRDIFF= 54 , CL1= CL2= 100 pF 9,10,11

42、01 30 200 ns Receiver enable to output low tZLRCRL= 15 pF 9,10,11 01 50 ns Receiver enable to output high tZHRCRL= 15 pF 9,10,11 01 50 ns Receiver disable time from low tLZRCRL= 15 pF 9,10,11 01 50 ns Receiver disable time from high tHZRCRL= 15 pF 9,10,11 01 50 ns 1/ Unless otherwise specified, all

43、currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground, 2/ See figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFEN

44、SE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol Terminal description 1 RO Receiver output 2 RE Receiver output enable 3 DE Driver outputs enable 4 DI Driver input 5 GND Ground connection

45、6 A Driver output / receiver input 7 B Driver output / receiver input 8 VCCPositive supply voltage FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFENSE SUPPLY CENTER C

46、OLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. Timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92080 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

47、 43216-5000 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. Th

48、e modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality