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本文(DLA SMD-5962-92144 REV N-2009 MICROCIRCUIT HYBRID LINEAR 12 VOLT DUAL CHANNEL DC DC CONVERTER.pdf)为本站会员(inwarn120)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92144 REV N-2009 MICROCIRCUIT HYBRID LINEAR 12 VOLT DUAL CHANNEL DC DC CONVERTER.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R112-93. 93-03-22 K. Cottongim B Changes in accordance with NOR 5962-R159-93. 93-05-11 K. Cottongim C Added case outline Z. Redrew entire document. 95-06-15 K. Cottongim D Added RadHard and Class K devices. Add

2、ed RadHard requirements. Redrew entire document. -sld 97-10-29 K. A. Cottongim E Table I; Changed the min and max limits for Radhard levels L, R device type 02 for the following tests +VOUT, -VOUT. Changed the max limits for VRLINE, VRLOAD, IIN, and Eff. For IRIPtest separate subgroups 1, 2, 3 to su

3、bgroup 1 for device type 01 max limit of 60 mAp-p and for subgroups 2 and 3 the max limit of 100 mAp-p. For the IRIPtest separate subgroups 1, 2, 3 to subgroup 1 for device type 02 max limit of 80 mAp-p and for subgroups 2 and 3 the max limit of 120 mAp-p. -sld 98-02-04 K. A. Cottongim F Made correc

4、tion to paragraph 4.3.5.a. Updated paragraph 1.2.3 to define the five reliability class levels. Made changes to table I format. -sld 01-03-21 Raymond Monnin G Added case outline Y, bathtub style package. -sld 01-08-21 Raymond Monnin H Made changes to XREG, VOTLOAD, and TTLOADin table I. Made additio

5、ns to footnotes 3/ and 5/ for table I. -gjc 02-09-24 Raymond Monnin J Table I; TTLOAD. Take out redundant values for +VOUTand -VOUT. For TTLOAD, 200s Max. on device type 01 was erroneously listed for +VOUTand -VOUT. Correct value is 500 s. Also, on Table I; change output current (IOUT) for device ty

6、pe 01 from 0.875 A to 1.125 A to agree with footnote 2/. 90% of 15W is 13.5 W and for 12 VOUTis 1.125 A. -gjc 03-11-06 Raymond Monnin K Figure 1; case outline X. Change the max limit for dimension “D“ from 1.455 inches to 1.460 inches and for dimension “E“ change the max limit from 1.125 inches to 1

7、.130 inches. Editorial changes throughout. -sld 04-08-19 Raymond Monnin L Add paragraph 1.5 and note 2. Table I, add note for enhanced low dose rate effects. Paragraph 4.3.5.a, correct paragraph to add component tested dose rate. -sld 07-01-08 Raj Pithadia M Add RHA level P to device type 02 in para

8、graphs 1.3, 1.5, 4.3.5 (table), table I, and SMD bulletin. Add paragraph 3.2.3. -gz 07-06-05 Robert M. Heber N Added footnote 1 to table II, under group C end-point electricals. Updated drawing paragraphs. -sld 09-08-06 Charles F. Saffle REV SHEET REV N SHEET 15 REV STATUS REV N N N N N N N N N N N

9、N N N OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil/ STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael Jones THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Gregory

10、 A. Lude MICROCIRCUIT, HYBRID, LINEAR, 12 VOLT, DUAL CHANNEL, DC/DC CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-08-18 AMSC N/A REVISION LEVEL N SIZE A CAGE CODE 67268 5962-92144 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E379-09Provided by IHSNot for ResaleNo reproduct

11、ion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92144 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL N SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in par

12、agraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following exa

13、mple: 5962 - 92144 01 H X X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the

14、 MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 MHF+2812D/883,MHF+2812DF/883 DC-DC con

15、verter, 15 W, 12 V output 02 SMHF2812D,SMHF2812DF DC-DC converter, 15 W, 12 V output 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification

16、 as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class leve

17、l. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specifie

18、d incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specif

19、ied in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This p

20、roduct may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92144 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL N SHEET 3 DSCC FORM 2234 APR 97 1.2.4

21、 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 8 Dual-in-line, Platform Y See figure 1 8 Dual-in-line, Bathtub Z See figure 1 8 Flange mount, Platform 1.2.5 Lead finish. The lead fin

22、ish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage range -0.5 V dc to +50 V dc Power dissipation (PD): Device types 01 and 02 (non-RHA) 6 W Device type 02 (RHA levels P, L and R) . 8.5 W Output power . 15.26 W Lead soldering temperature (10 seconds) . +300C St

23、orage temperature range -65C to +150C 1.4 Recommended operating conditions. Input voltage range +16 V dc to +40 V dc Case operating temperature range -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 9 rad(Si)/s): Device type 02 (RHA levels P, L and R) 100 krad (Si) 2/

24、2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

25、 DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103

26、- List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ These parts may be dose rate s

27、ensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition C, tested at 9 rad(Si)/s. Provided by IHSNot for ResaleNo reproduction or

28、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92144 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL N SHEET 4 DSCC FORM 2234 APR 97 (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from

29、 the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however,

30、 supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include t

31、he performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-P

32、RF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be

33、 as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall

34、be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in tabl

35、e I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shal

36、l be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein s

37、hall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be

38、 maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compli

39、ance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered t

40、o this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described

41、herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92144 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL N SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteri

42、stics. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V, CL= 0 unless otherwise specified Group A subgroups Device types Limits Unit Min Max Output voltage +VOUTIOUT= 625 mA 1 01,02 11.88 12.12 V 2,3 01,02 11.76 12.24 P,L,R 1,2,3 02 11.40 12.60 -VOUT1 01,02 -11.82 -12.18 2,3 01,02 -11.7

43、0 -12.30 P,L,R 1,2,3 02 -11.34 -12.66 Output current 3/ IOUTVIN= 16 V dc to 40 V dc 1,2,3 01 0.0 1.125 A 02 0.0 0.875 P,L,R 02 0.0 0.875 VOUTripple voltage (VOUT) VRIPIOUT= 625 mA, B.W. = 10 kHz to 2MHz 1,2 01 80 mV p-p 02 175 3 01 120 02 275 P,L,R 1,2,3 02 350 VOUTline regulation +VOUT-VOUTVRLINEIO

44、UT= 625 mA, VIN= 16 V dc to 40 V dc 1,2,3 01,02 50 mV P,L,R 1,2,3 02 100 1,2,3 01,02 100 P,L,R 1,2,3 02 200 VOUTload regulation +VOUT-VOUTVRLOADIOUT= 0 to 625 mA, both outputs changed simultaneously 1,2,3 01,02 50 mV P,L,R 1,2,3 02 100 1,2,3 01 100 02 150 P,L,R 1,2,3 02 300 See footnotes at end of t

45、able. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92144 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL N SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characterist

46、ics - Continued. Test Symbol Conditions 1/ 2/ -55C TC +125C VIN= 28 V dc 0.5 V, CL= 0 unless otherwise specified Group A subgroups Device types Limits Unit Min Max Cross regulation 4/ (-VOUT) XREG50% IOUT= 625 mA, +IOUT= 50% to 10%, -IOUT= 50% 1 01 6 % 50% IOUT= 625 mA, -IOUT= 50% to 10%, +IOUT= 50%

47、 6 50% IOUT= 625 mA, +IOUT= 70% -IOUT= 30% 1 02 6 P,L,R 10 50% IOUT= 625 mA, +IOUT=30% -IOUT= 70% 6 P,L,R 10 Input current IINIOUT= 0, inhibit pin (pin 1) = 0 V 1,2,3 01,02 12 mA P,L,R 02 15 IOUT= 0, inhibit pin (pin 1) = open 01,02 50 P,L,R 02 100 Input ripple current IRIPIOUT= 625 mA, LIN = 2 H, B

48、. W. = 10 kHz to 10 MHz 1 01 60 mA p-p 02 80 2,3 01 100 02 120 P,L,R 1,2,3 02 150 Efficiency Eff IOUT= 625 mA 1 01,02 76 % 2,3 01,02 74 P,L,R 1,2,3 02 70 Isolation ISO Input to output, input to case, or output to case, 500 V dc, TC= +25C 1 01,02 100 M P,L,R 02 100 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92144 DEFENSE SUPP

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