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本文(DLA SMD-5962-92147 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH NON-INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf)为本站会员(inwarn120)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92147 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH NON-INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R214-94 jak. 94/06/15 Monica L. Poelking B Changes in accordance with NOR 5962-R141-98 jak. 98/09/09 Monica L. Poelking C Redrawn with changes. Update the boilerplate to the current requirements of MIL-PRF-3853

2、5. - jak. 08-10-17 Thomas M. Hess REV SHET REV C C C SHEET 15 16 17 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J Ricciuti DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHI

3、O 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-08-11 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH NON-INVERTING THREE-STATE OUTPUTS, T

4、TL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-92147 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E001-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92147 DEFE

5、NSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines

6、and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92147 01 M R A Federal stock class designator RHA de

7、signator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA desig

8、nator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Ci

9、rcuit function 01 54ABT244 Octal buffer/driver with non-inverting three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-

10、certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline l

11、etter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, and V or MIL-PRF-38535, appendix A

12、 for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92147 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings.

13、 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to 7.0 V dc 4/ DC output voltage range (VOUT) -0.5 V dc to 5.5 V dc 4/ DC input clamp current (IIK) (VIN 0.0 V) -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA DC output current (IOL) (pe

14、r output). +96 mA Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C Maximum power dissipation (PD) . 500 mW 1.4 Recommended operating conditions. 2/ 3/ Supply volt

15、age range (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VIN) . +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCCMaximum low level input voltage (VIL ) 0.8 V Minimum high level input voltage (VIH ) . 2.0 V Case operating temperature range (TC) -55C to +125C Minimum input edge rate (V

16、/t) . 5 ns/V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) . +48 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless other

17、wise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage rating mat be exceeded provided that the input and output clamp current

18、 rating is observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92147 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 G

19、overnment specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIF

20、ICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standa

21、rd Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence.

22、In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements.

23、The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The

24、individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535

25、 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth tab

26、le shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching wa

27、veforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply

28、over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without

29、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92147 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked

30、. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in ac

31、cordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be

32、a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate o

33、f compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers produc

34、t meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class

35、M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any c

36、hange that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at t

37、he option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 126 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

38、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92147 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unl

39、ess otherwise specified VCCGroup A subgroups Limits 3/ Unit Min MaxVOH1For all inputs affecting output under test, VIN= 2.0 V, or 0.8 V IOH= -3.0 mA 4.5 V 1, 2, 3 2.5 VOH2For all inputs affecting output under test, VIN= 2.0 V, or 0.8 V IOH= -3.0 mA 5.0 V 1, 2, 3 3.0 High level output voltage 3006 VO

40、H3For all inputs affecting output under test, VIN= 2.0 V, or 0.8 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all inputs affecting output under test, VIN= 2.0 V, VIL= 0.8 V IOL= 48 mA 4.5 V 1, 2, 3 0.55 V Three-state output leakage current, high 3021 IOZH4/ 5/ For control i

41、nputs affecting outputs under test, VIN= 2.0 V or 0.8 V VOUT= 2.7 V 5.5 V 1, 2, 3 10.0 A Three-state output leakage current, low 3020 IOZL4/ 5/ For control inputs affecting outputs under test, VIN= 2.0 V or 0.8 V VOUT= GND 5.5 V 1, 2, 3 -10.0 A Negative input clamp voltage 3022 VIC- For input under

42、test, IIN= -18 mA 4.5 V 1, 2, 3 -1.2 V Off-state leakage current IOFFFor output under test, VINor VOUT= 4.5 V All other pins at 0.0 V 0.0 V 1 100 A High-state leakage current ICEXFor output under test, VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50 A Input current high 3010 IIHFor input un

43、der test VIN= VCC5.5 V 1, 2, 3 2.0 A Input current low 3009 IILFor input under test, VIN= GND 5.5 V 1, 2, 3 -2.0 A Off-state leakage current 3011 IO6/ VOUT= 2.5 V 0.0 V 1 -50 +180 A Data inputs outputs enabled For input under test, VIN= 3.4 V For all other inputs, VIN= VCCor GND 5.5 V 1, 2, 3 2.5 mA

44、 Data inputs outputs disabled For input under test, VIN= 3.4 V For all other inputs, VIN= VCCor GND 5.5 V 1, 2, 3 50 A Quiescent supply current delta, TTL input level 3005 ICC7/ Control inputs For input under test, VIN= 3.4 V For all other inputs, VIN= VCCor GND 5.5 V 1, 2, 3 2.5 mA See footnotes at

45、 end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92147 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance char

46、acteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min MaxQuiescent supply current, outputs high 3005 ICCH5.5 V 1, 2, 3 250 A Quiescent supply current, outputs low 3005 ICCL5.5 V 1,

47、 2, 3 30.0 mA Quiescent supply current, outputs disabled 3005 ICCZFor all inputs, VIN= VCCor GND IOUT= 0 A 5.5 V 1, 2, 3 250 A Input capacitance 3012 CIN 5.0 V 4 11.0 pF Output capacitance 3012 COUTSee 4.4.1d TC= +25C 5.0 V 4 16.0 pF VOLP8/ 5.0 V 4 1200 mV Low level ground bounce noise VOLV8/ 5.0 V

48、4 -1800 mV VOHP8/ 5.0 V 4 1500 mV High level VCCbounce noise VOHV8/ VIH= 3.0 V VIL= 0.0 V TA= +25C See figure 4 see 4.4.1c 5.0 V 4 -1100 mV 4.5 V 7, 8 L H Functional test 9/VIL= 0.8 V VIH= 2.0 V Verify output VOSee 4.4.1d 5.5 V 7, 8 L H 5.0 V 9 1.0 4.1 tPLH10/ 4.5 V and 5.5 V 10, 11 1.0 5.3 ns 5.0 V 9 1.0 4.2 Propagation delay time, mAn to mYn 3003 tPHL10/ CL= 50 pF minimum RL= 500 See figure 5 4.5 V and 5.5 V 10, 11 1.0 5.0 ns 5.0 V 9 1.1 5.5 tPZH10/ 4.5 V and 5.5 V 10, 11 0.8 6.5 ns 5.0 V 9 2.1 5.6 Propagation delay time, output enabl

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