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本文(DLA SMD-5962-92176 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf)为本站会员(feelhesitate105)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92176 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Editorial changes throughout. All references to classes B and S have been deleted or changed to reflect the QML flow of the source of supply. 95-11-13 Monica L. Poelking B Update the boilerplate to current requirements as specified in MIL-PRF-385

2、35. Editorial changes throughout. jak 06-11-06 Thomas M. Hess C Update vendor cage code and approved source of supply information in bulletin page. Update DC VCCor GND current (ICC, IGND) per pin to section 1.3. Update boilerplate paragraphs to current requirements of MIL-PRF-38535. MAA 13-06-20 Tho

3、mas M. Hess REV SHEET REV C C SHEET 15 16 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Wanda L. Meadows DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thoma

4、s J. Ricciuti THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/LINE DRIVER WITH NONINVERTING THREE-STATE OUTPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-02-23 AMSC N/A

5、 REVISION LEVEL C SIZE A CAGE CODE 67268 5962-92176 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E110-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92176 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVIS

6、ION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the P

7、art or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92176 01 M R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class

8、designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PR

9、F-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACQ244 Octal buffer/line driver with

10、 noninverting three-state outputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class

11、level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T

12、20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or network

13、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92176 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range

14、(VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK): VIN= -0.5 V . -20 mA VIN= VCC+ 0.5 V . +20 mA DC output clamp current (IOK): VOUT= -0.5 V . -20 mA VOUT= VCC+ 0.5 V +20 mA DC output current (IOUT) (per output pin) . 50 mA DC

15、VCCor GND current (ICC, IGND) (per pin) 50 mA Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C Maximum power dissipation (PD) 500 mW 1.4 Recommended operating

16、 conditions. 2/ 3/ Supply voltage range (VCC) . +3.0 V dc to +5.5 V dc Input voltage range (VIN) . 0.0 V to VCC Output voltage range (VOUT) 0.0 V to VCCMinimum high level input voltage (VIH): VCC= 3.0 V . 2.1 V VCC= 4.5 V . 3.15 V VCC= 5.5 V . 3.85 V Maximum low level input voltage (VIL): VCC= 3.0 V

17、 . 0.9 V VCC= 4.5 V . 1.35 V VCC= 5.5 V . 1.65 V Case operating temperature range (TC) -55C to +125C Minimum input edge rate (V/t): (VINfrom 0.3VCCto 0.7VCCor from 0.7VCCto 0.3VCC) 125 mV/ns Maximum high level output current (IOH): VCC= 3.0 V . -12 mA VCC= 4.5 V . -24 mA Maximum low level output cur

18、rent (IOL): VCC= 3.0 V . +12 mA VCC= 4.5 V . +24 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device, Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The l

19、imits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92176 DLA LAND AND MARITIME

20、COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the i

21、ssues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Stan

22、dard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil/ or from the Standardization Document Order Desk

23、, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SO

24、LID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street,

25、 Suite 240S, Arlington, VA 22201.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemptio

26、n has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not

27、 affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, an

28、d physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall b

29、e as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 4.

30、3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92176 DLA LAND AND MARITIME COLUMBUS, OH

31、IO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply

32、 over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In

33、 addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked

34、. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-3853

35、5. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see

36、 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source o

37、f supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as requi

38、red for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of prod

39、uct (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the ma

40、nufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PR

41、F-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92176 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance chara

42、cteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +3.0 VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006 VOHFor all inputs affecting outputs under test, VIN= VIHor VILFor all other inputs, VIN= VCCor

43、 GND IOH= -50 A 3.0 V 1, 2, 3 2.90 V 4.5 V 1, 2, 3 4.40 5.5 V 1, 2, 3 5.40 IOH= -12 mA 3.0 V 1 2.56 2, 3 2.40 IOH= -24 mA 4.5 V 1 3.86 2, 3 3.70 5.5 V 1 4.86 2, 3 4.70 IOH= -50 mA 4/ 5.5 V 1, 2, 3 3.85 Low level output voltage 3007 VOLFor all inputs affecting outputs under test, VIN= VIHor VILFor al

44、l other inputs, VIN= VCCor GND IOL= 50 A 3.0 V 1, 2, 3 0.10 V 4.5 V 1, 2, 3 0.10 5.5 V 1, 2, 3 0.10 IOL= 12 mA 3.0 V 1 0.36 2, 3 0.50 IOL= 24 mA 4.5 V 1 0.36 2, 3 0.50 5.5 V 1 0.36 2, 3 0.50 IOL= 50 mA 4/ 5.5 V 1, 2, 3 1.65 Positive input clamp voltage 3022 VIC+For input under test, IIN= 18 mA 4.5 V

45、 1, 2, 3 5.7 V Negative input clamp voltage 3022 VIC-For input under test, IIN= -18 mA 4.5 V -1.2 Input current high 3010 IIHFor input under test, VIN= 5.5 V For all other inputs, VIN= VCCor GND 5.5 V 1 0.1 A 2, 3 1.0 Input current low 3009 IILFor input under test, VIN= 0.0 V For all other inputs, V

46、IN= VCCor GND 5.5 V 1 -0.1 A 2, 3 -1.0 Three-state output leakage current, high 3021 IOZH5/ OEn = VIHor GND For all other inputs, VIN= VCCor GND VOUT= 5.5 V 5.5 V 1 0.5 A 2, 3 10.0 Three-state output leakage current, low 3020 IOZL5/ OEn = VIHor GND For all other inputs, VIN= VCCor GND VOUT= 0.0 V 5.

47、5 V 1 -0.5 A 2, 3 -10.0 Quiescent supply current, output high 3005 ICCHOEn = GND For all other inputs, VIN= VCCor GND 5.5 V 1 8.0 A 2, 3 160 Quiescent supply current, output low 3005 ICCL5.5 V 1 8.0 A 2, 3 160 Quiescent supply current, output three-state 3005 ICCZ5/ OEn = VCCFor all other inputs, VI

48、N= VCCor GND 5.5 V 1 8.0 A 2, 3 160 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92176 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +3.0 VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min

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