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本文(DLA SMD-5962-92196 REV B-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL TRANSCEIVER REGISTER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf)为本站会员(amazingpat195)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92196 REV B-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL TRANSCEIVER REGISTER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 07-07-03 Thomas M. Hess B Updated DC output current (ICC, IGND) (1.3), add source of supply information cage 0C7V7. Update test condit

2、ions for high and low level output voltage (VOL and VOH) to table I. Update the boilerplate paragraphs to current requirements as specified in MIL-PRF-38535. jwc 13-06-17 Thomas M. Hess REV SHEET REV B B B B B B SHEET 15 16 17 18 19 20 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3

3、 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT

4、, DIGITAL, ADVANCED CMOS, OCTAL TRANSCEIVER/REGISTER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-09-28 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-92196 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E275-

5、13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92196 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product a

6、ssurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) le

7、vels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92196 01 M K A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 R

8、HA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A das

9、h (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACTQ646 Octal transceiver/register with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class des

10、ignator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certificati

11、on and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadle

12、ss-chip-carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-

13、92196 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5

14、 V dc DC input clamp diode current (IIK): VIN= -0.5 V 20 mA VIN= VCC+0.5 . +20 mA DC output clamp diode current (IOK): VIN= -0.5 V 20 mA VIN= VCC+0.5 . +20 mA DC output current (IOUT) per output pin 50 mA DC VCCor GND current (ICC, IGND) per pin 50 mA Storage temperature range (TSTG) . -65C to +150C

15、 Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C Maximum power dissipation (PD) . 500 mW 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VI

16、N) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMaximum low level input voltage (VIL) 0.8 V Minimum high level input voltage (VIH) . 2.0 V Case operating temperature range (TC) . -55C to +125C Minimum input edge rate (V/t): (VINfrom 0.8 V to 2.0 V or VINfrom 2.0 V to 0.8 V) . 125 mV

17、/ns Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +24 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted,

18、 all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA

19、WING SIZE A 5962-92196 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specif

20、ied herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard

21、 Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or

22、from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cit

23、ed in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Associa

24、tion, 3103 North 10th Street, Suite 240S, Arlington, VA 22201-2107.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regu

25、lations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The mod

26、ification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Provided by IHSNot for ResaleNo reproduction

27、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92196 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions sha

28、ll be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure

29、1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 4. 3.2.6 Switching waveforms

30、 and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as sp

31、ecified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked wit

32、h the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RH

33、A designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“

34、or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the

35、 requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior

36、 to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A

37、certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Lan

38、d and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activit

39、y retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in micr

40、ocircuit group number 37 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92196 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TA

41、BLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006 VOHFor all inputs affecting output under test Vin= VIH=2.0V

42、 or VIL= 0.8V For all other inputs VIN= VCCor GND IOH= -50 A 4.5 V 1, 2, 3 4.40 V 5.5 V 1, 2, 3 5.40 IOH= -24 mA 4.5 V 1 3.86 2, 3 3.70 5.5 V 1 4.86 2, 3 4.70 IOH= -50 mA 4/ 5.5 V 1, 2, 3 3.85 Low level output voltage 3007 VOLFor all inputs affecting output under test Vin= VIH=2.0V or VIL= 0.8V For

43、all other inputs VIN= VCCor GND IOL= 50 A 4.5 V 1, 2, 3 0.10 V 5.5 V 1, 2, 3 0.10 IOL= 24 mA 4.5 V 1 0.36 2, 3 0.50 5.5 V 1 0.36 2, 3 0.50 IOL= 50 mA 4/ 5.5 V 1, 2, 3 1.65 Positive input clamp voltage 3022 VIC+For input under test, IIN= 1 mA 4.5 V 1, 2, 3 5.7 V Negative input clamp voltage 3022 VIC-

44、For input under test, IIN= -1 mA 4.5 V 1, 2, 3 -1.2 V Input current high 3010 IIHFor input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 5.5 V 1 0.1 A 2, 3 1.0 Input current low 3009 IILFor input under test, VIN= 0.0 V For all other inputs, VIN= VCCor GND 5.5 V 1 -0.1 A 2, 3 -1.0 See foot

45、notes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92196 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance char

46、acteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max Three-state output leakage current, high 3021 IOZH5/ OE = 2.0 V or 0.8 V For all other inputs, VIN= VCCor GND VO

47、UT= 5.5 V 5.5 V 1 0.5 A 2, 3 10.0 Three-state output leakage current, low 3020 IOZL5/ OE = 2.0 V or 0.8 V For all other inputs, VIN= VCCor GND VOUT= 0.0 V 5.5 V 1 -0.5 A 2, 3 -10.0 Quiescent supply current, output high 3005 ICCHOE = GND For all other inputs, VIN= VCCor GND 5.5 V 1 8.0 A 2, 3 160.0 Q

48、uiescent supply current, output low 3005 ICCL5.5 V 1 8.0 A 2, 3 160.0 Quiescent supply current, output three-state 3005 ICCZ5/ OE = VCCFor all other inputs, VIN= VCCor GND 5.5 V 1 8.0 A 2, 3 160.0 Quiescent supply current delta, TTL input levels 3005 ICC6/ For input under test, VIN= VCC- 2.1 V For all other inputs, VIN= VCCor GND 5.5 V 1 1.0 mA 2, 3 1.6 Input capacitance 3012 CINTC= +25C See 4.4.1c GND 4 15.0 pF Input/output capacitance 3012 CI/O5/ 5.5 V 4 20.0 pF Power dissipation capacitance CPD7/ 5.0 V 4 100.0 pF See footnotes at end of table.

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