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本文(DLA SMD-5962-92200 REV B-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS 10-BIT TRANSPARENT LATCH WITH THREESTATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf)为本站会员(amazingpat195)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92200 REV B-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS 10-BIT TRANSPARENT LATCH WITH THREESTATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 06-10-06 Thomas M. Hess B Updated DC output current (ICC, IGND) in section 1.3, add source of supply information cage 0C7V7. Update th

2、e boilerplate paragraphs to current requirements as specified in MIL-PRF-38535. jwc 13-05-16 Thomas M. Hess REV SHEET REV B B B B B B B SHEET 15 16 17 18 19 20 21 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby DLA LAND

3、 AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J. Ricciuti THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Joseph A. Dupay MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 10-BIT TRANSPARENT LATCH WITH THREE-STATE OUTPU

4、TS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-06-28 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-92200 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E278-13 Provided by IHSNot for ResaleNo reproduction or networking permitted wit

5、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92200 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and

6、M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following

7、 examples: 5962 - 92200 01 M L A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-

8、38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s)

9、 identify the circuit function as follows: Device type Generic number Circuit function 01 54ACTQ841 10-bit transparent latch with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follow

10、s: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outlin

11、e(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line K GDFP2-F24 or CDFP3-F24 24 Flat pack 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PR

12、F-38535 for device classes Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92200 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEE

13、T 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK) (VIN= -0.5 V and VCC+ 0.5 V) 20 mA DC

14、 output clamp current (IOK) (VOUT= -0.5 V and VCC+ 0.5 V) 20 mA DC output current (IOUT) (per output pin) . 50 mA DC VCCor GND current (ICC, IGND) (per pin) 50 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) 500 mW Lead temperature (soldering, 10 seconds) . +300C The

15、rmal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VIN) . +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCCMaximum low level input vo

16、ltage (VIL ) 0.8 V Minimum high level input voltage (VIH ) . 2.0 V Case operating temperature range (TC) -55C to +125C Minimum input edge rate (V/t): (VINfrom 0.8 V to 2.0 V or from 2.0 V to 0.8 V) 125 mV/ns Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) . +24

17、mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device, Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance

18、 with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking perm

19、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92200 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, an

20、d handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPART

21、MENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these doc

22、uments are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless othe

23、rwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC JESD78 - IC Latch-Up Test. JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents ar

24、e available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201-2701.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing ta

25、kes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified h

26、erein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class

27、level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines.

28、The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. Provided

29、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92200 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2.5 Ground bounce waveforms and test circuit. The ground bounce w

30、aveforms and test circuit shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

31、 electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tes

32、ts for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the opti

33、on of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certificatio

34、n/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compl

35、iance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6

36、.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the req

37、uirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 N

38、otification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device cla

39、ss M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment

40、 for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92200 DLA LAND AND

41、 MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Conditions 2/ -55C TC +125C +4.5 V TC +5.5 V unless otherwise specified Device type and device class 3/ VCCGroup A subgroups

42、Limits 4/ Unit Min Max High level output voltage 3006 VOH1For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL= 0.8 V For all other inputs, VIN= VCCor GND IOH= -50 A All All 4.5 V 1, 2, 3 4.40 V VOH2For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL= 0.8 V

43、 For all other inputs, VIN= VCCor GND IOH= -50 A All All 5.5 V 1, 2, 3 5.40 VOH3For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL= 0.8 V For all other inputs, VIN= VCCor GND IOH= -24 mA All All 4.5 V 1 3.86 2, 3 3.70 VOH4For all inputs affecting output under test, VIN= VIHor

44、VILVIH= 2.0 V, VIL= 0.8 V For all other inputs, VIN= VCCor GND IOH= -24 mA All All 5.5 V 1 4.86 2, 3 4.70 VOH55/ For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL= 0.8 V For all other inputs, VIN= VCCor GND IOH= -50 mA All All 5.5 V 1, 2, 3 3.85 See footnotes at end of table.

45、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92200 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued.

46、 Test and MIL-STD-883 test method 1/ Symbol Conditions 2/ -55C TC +125C +4.5 V TC +5.5 V unless otherwise specified Device type and device class 3/ VCCGroup A subgroups Limits 4/ Unit Min Max Low level output voltage 3007 VOL1For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL=

47、 0.8 V For all other inputs, VIN= VCCor GND IOL= 50 A All All 4.5 V 1, 2, 3 0.10 V VOL2For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL= 0.8 V For all other inputs, VIN= VCCor GND IOL= 50 A All All 5.5 V 1, 2, 3 0.10 VOL3For all inputs affecting output under test, VIN= VIHor

48、 VILVIH= 2.0 V, VIL= 0.8 V For all other inputs, VIN= VCCor GND IOL= 24 mA All All 4.5 V 1 0.36 2, 3 0.50 VOL4For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL= 0.8 V IOL= 24 mA All All 5.5 V 1 0.36 2, 3 0.50 VOL55/ For all inputs affecting output under test, VIN= VIHor VILVIH= 2.0 V, VIL= 0.8 V For all other inputs, VIN= VCCor GND IOL= 50 mA All All 5.5 V 1, 2, 3 1.65 Three-state output leakage current, high 3021 IOZH6/ OE = VIHor VILVIH= 2.0 V VIL= 0.8 V For all other inputs, VIN= VCCor GND VOUT= 5.5 V

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