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本文(DLA SMD-5962-92222 REV C-2008 MICROCIRCUIT DIGITAL FAST CMOS OCTAL D-REGISTERS WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING MONOLITHIC SILICON.pdf)为本站会员(wealthynice100)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92222 REV C-2008 MICROCIRCUIT DIGITAL FAST CMOS OCTAL D-REGISTERS WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes are in accordance with the notice of revision 5962-R096-94. - tvn 94-03-09 Monica L. Poelking B Changes are in accordance with the notice of revision 5962-R184-96. - tvn 96-08-09 Monica L. Poelking C Redrawn with changes. Update the boile

2、rplate to the current requirements of MIL-PRF-38535. - jak 08-04-22 Thomas M. Hess REV SHET REV C C C C SHEET 15 16 17 18 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Tim H. Noh STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J. Ric

3、ciuti DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-03-25 MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL D-REGISTERS WITH

4、THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-92222 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E256-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

5、-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92222 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space a

6、pplication (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 596

7、2 - 92222 01 M R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified

8、RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the ci

9、rcuit function as follows: Device type Generic number Circuit function 01, 02 54FCT574T Octal D-registers with three-state outputs, TTL compatible inputs and limited output voltage swing 03, 04 54FCT574AT Octal D-registers with three-state outputs, TTL compatible inputs and limited output voltage sw

10、ing 05, 06 54FCT574CT Octal D-registers with three-state outputs, TTL compatible inputs and limited output voltage swing 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M

11、Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follow

12、s: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-T20 20 Flat pack 2 CQCC1-N20 20 Leadless-chip-carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, append

13、ix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92222 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum rati

14、ngs. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc 4/ DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc 4/ DC input clamp current (IIK) (VIN= -0.5 V ) -20 mA DC output clamp current (IOK) (VOUT-0.5 V and +7.0 V) 20 mA DC

15、output source current (IOH) (per output) -30 mA DC output sink current (IOL) (per output) . +70 mA DC VCCcurrent (ICC) . 260 mA Ground current (IGND) +550 mA Storage temperature range (TSTG) -65C to +150C Case temperature under bias (TBIAS) -65C to +135C Maximum power dissipation (PD) 500 mW Lead te

16、mperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) .

17、 +0.0 V dc to VCCMaximum low level input voltage (VIL) . 0.8 V Minimum high level input voltage (VIH) . 2.0 V Case operating temperature range (TC) . -55C to +125C Maximum input rise or fall rate (t/V): (from VIN= 0.3 V to 2.7 V, 2.7 V to 0.3 V) 5 ns/V Maximum high level output current (IOH) -12 mA

18、Maximum low level output current (IOL) 48 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits f

19、or the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For VCC 6.5 V, the upper limit on the range is limited to 7.0 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

20、MICROCIRCUIT DRAWING SIZE A 5962-92222 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this dra

21、wing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-8

22、83 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http

23、:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

24、this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and

25、 as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for

26、 non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1

27、Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on fig

28、ure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics an

29、d postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test req

30、uirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92222 DEFENSE SUPPLY CENTER COLUMBUS COLU

31、MBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the m

32、anufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, append

33、ix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V

34、, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply

35、in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M,

36、the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing

37、. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC

38、, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices

39、covered by this drawing shall be in microcircuit group number 38 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92222 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

40、REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Device type VCCGroup A subgroups Min Max Unit VOH14/ For all inputs affec

41、ting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -300 A All 4.5 V 1, 2, 3 3.0 VCC-0.5 V High level output voltage 3006 VOH2For all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -12 mA All 4.5 V 1, 2, 3 2.4 VCC-0.5 V

42、 VOL14/ For all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOL= 300 A All 4.5 V 1, 2, 3 0.20 V Low level output voltage 3007 VOL2For all inputs affecting output under test VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOL= 48 mA All 4.5 V 1,

43、2, 3 0.55 V 1, 2 1.0 01, 03, 05 3 10.0 1, 2 0.1 Three-state output leakage current high 3021 IOZH5/ 6/ For input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 02, 04, 06 5.5 V 3 2.0 A 1, 2 -1.0 01, 03, 05 3 -10.0 1, 2 -0.1 Three-state output leakage current low 3020 IOZL5/ 6/ For input un

44、der test, VIN= GND For all other inputs, VIN= VCCor GND 02, 04, 06 3 -2.0 A For input under test, IIN= -18 mA 01, 03, 05 -1.2 Negative input clamp voltage 3022 VIC-For input under test, IIN= -15 mA 02, 04, 06 4.5 V 1, 2, 3 -1.3 V See footnotes at end of table. Provided by IHSNot for ResaleNo reprodu

45、ction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92222 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-8

46、83 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Device type VCCGroup A subgroups Min Max Unit 1, 2 1.0 01, 03, 05 3 5.0 1, 2 0.1 Input current high 3010 IIHFor input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 01, 03, 05 5.5 V 3 1.0

47、 A 1, 2 -1.0 01, 03, 05 3 -5.0 1, 2 -0.1 Input current low 3009 IILFor input under test, VIN= GND For all other inputs, VIN= VCCor GND 02, 04, 06 3 -1.0 A Input capacitance 3012 CIN7/ See 4.4.1c TC= +25C All GND 4 10 pF Output capacitance 3012 COUT5/ See 4.4.1c TC= +25C All GND 4 12 pF Short circuit

48、 output current 3005 IOS8/ For all inputs, VIN= VCCor GND VOUT= GND All 5.5 V 1, 2, 3 -60 -225 mA Dynamic power supply current ICCD4/ 9/ Outputs open All 5.5 V 4, 5, 6 0.25 mA/ MHzBitQuiescent supply current delta, TTL input level 3005 ICC10/ For input under test VIN= VCC- 2.1 V For all other inputs VIN= VCCor GND All 5.5 V 1, 2, 3 2.0 mA Quiescent supply current, output high 3005 ICCHOE = GND For all other inputs, VIN = VCCor GNDAll 5.5 V 1, 2, 3 1.5 mA Quiescent supply current, output low 3005 ICCLOE = GND For all other inputs, VIN = VCCor GNDAll 5.5 V 1, 2, 3 1.5 mA Qui

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