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本文(DLA SMD-5962-92271 REV C-2008 MICROCIRCUIT DIGITAL FAST CMOS 16-BIT NONINVERTING BUFFER LINE DRIVER WITH SERIES RESISTOR AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS LIMITED OUTPU.pdf)为本站会员(孙刚)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92271 REV C-2008 MICROCIRCUIT DIGITAL FAST CMOS 16-BIT NONINVERTING BUFFER LINE DRIVER WITH SERIES RESISTOR AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS LIMITED OUTPU.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with notice of revision, 5962-R088-95 tvn. 95-03-18 Monica L. Poelking B Changes in accordance with notice of revision, 5962-R047-97 tvn. 96-11-08 Monica L. Poelking C Redrawn with changes. Update the boilerplate to the curr

2、ent requirements of MIL-PRF-38535. - jak 08-05-13 Thomas M. Hess REV SHEET REV C C C C C SHEET 15 16 17 18 19 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFE

3、NSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, FAST CMOS, 16-BIT NONINVERTING BUFFER/LINE DRIVER WITH SERIES RESISTOR AND THREE-STATE OUTPUTS, TTL AND AGENCIES OF T

4、HE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-07-26 COMPATIBLE INPUTS, LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-92271 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E328-08 Provided by IHSNot for ResaleNo reproduction or networking permitte

5、d without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92271 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device

6、classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown i

7、n the following example: 5962 - 92271 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet

8、the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The de

9、vice type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT162244T 16-bit noninverting buffer/line driver with series resistor and three-state outputs, TTL compatible inputs and limited output voltage swing 02 54FCT162244AT 16-bit noninverting buffer/l

10、ine driver with series resistor and three-state outputs, TTL compatible inputs and limited output voltage swing 03 54FCT162244CT 16-bit noninverting buffer/line driver with series resistor and three-state outputs, TTL compatible inputs and limited output voltage swing 1.2.3 Device class designator.

11、The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix

12、A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-

13、38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92271 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

14、C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc 4/ Input clamp current (IIK) (VIN= -0.5V). -20 mA Output cla

15、mp current (IOK) (VOUT= -0.5V and+7.0 V) 20 mA DC output source current (IOH) per output -30 mA DC output sink current (IOL) per output. +70 mA DC VCCcurrent (ICC). 480 mA DC ground current (IGND) 1120 mA Storage temperature range (TSTG) . -65C to +150C Case temperature under bias (TBIAS) . -65C to

16、+135C Maximum power dissipation (PD) . 1.0 W Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range

17、(VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCMaximum low level input voltage(VIL). 0.8 V Maximum high level input voltage (VIH) 2.0 V Case operating temperature range (TC). -55C to +125C Maximum input rise or fall rate (t/V): (from VIN= 0.3 V to 2.7 V, 2.7 V to 0.3 V) 2.5 ns/V

18、Maximum high level output current (IOH) -16 mA Maximum low level output current (IOL) 16 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all

19、voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For VCC 6.5 V, the upper limit on the range is limited to 7.0 V. Provided by IHSNot for ResaleNo reproduction or networking p

20、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92271 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, s

21、tandards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. D

22、EPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MI

23、L-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phila

24、delphia 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQ

25、UIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or f

26、unction as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication requirements

27、 of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the Qualifying Activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendi

28、x A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The l

29、ogic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. Prov

30、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92271 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirr

31、adiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements

32、 shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not

33、 feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

34、 in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. For class Q prod

35、uct built in accordance with A.3.2.2 of MIL-PRF-38535 or other alternative approved by the Qualifying Activity, the “QD” certification mark shall be used in place of the “QML” or “Q” certification mark. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be r

36、equired from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The

37、certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appen

38、dix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device

39、class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affect this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity

40、 retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in micro

41、circuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92271 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234

42、APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Devicetype VCCGroup A subgroups Min Max Unit VOH14/ IOH= -300 A All 4.5 V 1, 2, 3 3.0 VCC-0.5High level output vo

43、ltage 3006 VOH2For all inputs affecting output under test, VIN= 2.0 V or 0.8 V For all other inputs VIN= VCCor GND IOH= -16 mA All 4.5 V 1, 2, 3 2.4 V VOL14/ IOH= 300 A All 4.5 V 1, 2, 3 0.2 Low level output voltage 3007 VOL2For all inputs affecting output under test, VIN= 2.0 V or 0.8 V For all oth

44、er inputs VIN= VCCor GND IOH= 16 mA All 4.5 V 1, 2, 3 0.55 V Negative input clamp voltage 3022 VIC-For input under test, IIN= -18 mA All 4.5 V 1, 2, 3 -1.2 V 1, 2 1.0 Three-state output current high 3021 IOZH5/ 6/ mOE = 2.0 V or 0.8 V For all other inputs, VIN= VCCor GND VOUT= VCCAll 5.5 V 3 5.0 A 1

45、, 2 1.0 Three-state output current low 3021 IOZL5/ 6/ mOE = 2.0 V or 0.8 V For all other inputs, VIN= VCCor GND VOUT= GND All 5.5 V 3 5.0 A 1, 2 1, 2 1.0 Input current high 3010 IIHFor input under test VIN= VCCFor all other inputs VIN= VCCor GND All 5.5 V 3 3 5.0 A 1, 2 1, 2 1.0 Input current low 30

46、09 IILFor input under test VIN= GND For all other inputs VIN= VCCor GND All 5.5 V 3 3 5.0 A Output current low IODL 7/ VIN= 2.0 V or 0.8 V VOUT= 1.5 V All 5.0 1, 2, 3 60 200 mA Output current high IODH 7/ VIN= 2.0 V or 0.8 V VOUT= 1.5 V All 5.0 1, 2, 3 -60 -200 mA Short circuit output current 3005 I

47、OS7/ For all inputs VIN= VCCor GND VOUT= GND All 5.5 V 1, 2, 3 -80 -250 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92271 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43

48、218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Device type VCCGroup A subgroups Min Max Unit Dynamic power supply current ICCD4/ 8/ Outputs open All 5.5 V 4, 5, 6 100 A/ MHzBitQuiescent supply current delta, TTL input levels 3005 ICC9/ For input under test VIN= VCC 2.1 V For all other inputs VIN= VCCor GND All 5.5 V 1, 2, 3 1.5 mA Quiescent supply current output high 3005 ICCH All

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