DLA SMD-5962-92335 REV A-2010 MICROCIRCUIT LINEAR BRUSHLESS DC MOTOR CONTROLLER MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate paragraphs to current MIL-PRF-38535 requirements. Make corrections to 4.4.1b and Table II. - ro 10-01-07 C. SAFFLE REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED

2、 BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINE

3、AR, BRUSHLESS DC MOTOR CONTROLLER, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-04-16 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-92335 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E078-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

4、 MICROCIRCUIT DRAWING SIZE A 5962-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application

5、(device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92335 01

6、 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels an

7、d are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit functio

8、n as follows: Device type Generic number Circuit function 01 2936 3 phase brushless dc motor controller/driver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor sel

9、f-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline

10、 letter Descriptive designator Terminals Package style X MBFM1-P15 15 Flange mount 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted with

11、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VBB) +45 V Input voltage range (VIN) 2/ . -0.3 V to +15 V Threshold voltag

12、e (VTHS) . +15 V Power dissipation (PD) 500 mW 3.0 W free air 60.0 W with infinite sink Output current (IOUT): At 300 ms 2.3 A Continuous 2.0 A Junction temperature (TJ) 3/ . +150C Storage temperature range . -65C to +150C Thermal resistance, junction to case (JC) See MIL-STD-1835 Thermal resistance

13、, junction to ambient (JA) . 45C/W 1.4 Recommended operating conditions. Operating voltage range . 10 V to 45 V Operating ambient temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks

14、 form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEF

15、ENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are

16、available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text o

17、f this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade

18、 performance and affect reliability. 2/ VINmust not exceed VBB. 3/ Fault conditions which produce excessive junction temperature will activate device thermal shutdown circuitry. These conditions can be tolerated, but should be avoided. Provided by IHSNot for ResaleNo reproduction or networking permi

19、tted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in acc

20、ordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with

21、 MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and her

22、ein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2. 3.3 Electrical performance characte

23、ristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electr

24、ical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire

25、 SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for d

26、evice class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, append

27、ix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manu

28、facturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the r

29、equirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be pr

30、ovided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verif

31、ication and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircu

32、it group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 55 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962

33、-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits 1/ Unit VBB= 45 V dc unless otherwise specified Min Max Supply curr

34、ent IBBVBRAKE= 2.0 V, outputs open 1,2,3 01 60 mA VBRAKE= 0.8 V 60 Output leakage current ICEXVOUT= VBB, output state = Z 1,2,3 01 10 A VOUT= 0 V, output state = Z -10 Output saturation voltage VCE(SAT)Source driver, 1,3 01 2.1 V IOUT= -1.0 A 2 1.9 Sink driver, IOUT= 1.0 A 1,3 1.4 2 1.2Source driver

35、, 1,3 2.3IOUT= -2.0 A 2 2.1 Sink driver, IOUT= 2.0 A 1,3 1.7 2 1.5Output sustaining voltage VCE(SUS)IOUT= 2.0 A, L = 3.0 mH, TA= +25C 1 01 45 V Clamp diode leakage current IRVR= 45 V 1,2,3 01 10 A Clamp diode forward voltage VFIF= 2.0 A 1,3 01 2.3 V 2 2.5 Logic input voltage VIN(1)VDIRECTIONor VBRAK

36、E1,2,3 01 2.0 V VIN(0)0.8See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 A

37、PR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits 1/ Unit VBB= 45 V dc unless otherwise specified Min Max Input current IIN(1)VDIRECTION= 2.0 V 1,2,3 01 400 A VBRAKE= 2.0 V 5.0 VH= 5.0 V -220 IIN(0) VDIRECTION= 0

38、.8 V 100 VBRAKE= 0.8 V -20 VH= 0.8 V -1000 ITHSVTHS 3.0 V -15 VTHS 3.0 V, VSENSE (VTHS/ 10.5) -30 VTHS 3.0 V, VSENSE (VTHS/ 9.5) 190 310 Current limit threshold VTHS/ VSENSEat trip point, VTHS 3.0 V 1,2,3 01 9.5 10.5 Default sense trip voltage VSENSEVTHS 3.0 V 1,2,3 01 270 330 mV Propagation delay t

39、ime tPDIOUT= 2.0 A, 50% VHto 90% IOUT9,10,11 01 8.0 s 1/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. Provided by IHSNot for ResaleNo reproduction or ne

40、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outline X Terminal number Terminal symbol 1 GROUND 2 EMITTERS 3 OUTPUT B4 OUTPUT

41、 C 5 THRESHOLD (THS) 6 NC (SEE NOTE 1) 7 BRAKE 8 DIRECTION 9 H3 (SEE NOTE 2) 10 H2 (SEE NOTE 2) 11 H1 (SEE NOTE 2) 12 VBB13 OUTPUT A14 NC (SEE NOTE 1) 15 SENSE IN NOTES: 1. NC = No connection 2. H1, H2, and H3 are Hall sensor inputs. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo re

42、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. Block diagram. Provided by IHSNot for ResaleNo reproduction or networking

43、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92335 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures s

44、hall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PR

45、F-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-88

46、3, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level contro

47、l and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final ele

48、ctrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acqu