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本文(DLA SMD-5962-92336 REV F-2012 MICROCIRCUIT LINEAR ADJUSTABLE LOW POWER LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf)为本站会员(花仙子)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-92336 REV F-2012 MICROCIRCUIT LINEAR ADJUSTABLE LOW POWER LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline X, TABLE IIB, and device classes Q and V. Make changes to 1.2.4, 1.3, and throughout. 96-07-15 M. A. FRYE B TABLE IIA, electrical test requirements: Final electrical parameters; for device class V, delete “2/”. Footnote 2/ below

2、table IIA: second line; delete “interim” and substitute “endpoint”. In accordance with N.O.R. 5962-R039-97. 96-11-04 R. MONNIN C Make changes to 1.3 and dimensions R and R1 as specified under figure 1. Redrawn. - ro 97-12-02 R. MONNIN D Delete figure 1 and update drawing to reflect current requireme

3、nts. - ro 03-05-08 R. MONNIN E Add device type 02. Make changes to paragraph 1.3, Table I, and figure 1. Add new footnote to paragraph 1.3. Under paragraph 1.3, device type 01, case outline X, make correction to the JClimit by deleting 24C/W and replacing with 7C/W. Under paragraph 1.3, device type

4、01, case outline X, make corrections to the JAlimits; for still air, delete 160C/W and replace with 134C/W; for LFPM, delete 105C/W and replace with 81C/W. - ro 11-11-17 C. SAFFLE F Add note under figure 1 terminal connections for case outline X. - ro 12-09-12 C. SAFFLE REV SHEET REV SHEET REV STATU

5、S REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY MARCIA B. KELLEHER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES

6、 OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, ADJUSTABLE LOW POWER, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-03-05 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-92336 SHEET 1 OF 14 DSCC FORM 223

7、3 APR 97 5962-E457-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92336 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing docu

8、ments two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness

9、 Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92336 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Dra

10、wing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RH

11、A designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 1/ Generic number Circuit function 01 LP2953A Adjustable micropower low-dropout voltage regulator 02 LP2953A Adjustable micropower low-dropout voltage r

12、egulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in

13、accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line X 1/ G

14、DFP1-G16 16 Flat pack with gull wing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. _ 1/ For case outline letter X, device type 01 package material is aluminum nitride and the device type 02 packag

15、e material is aluminum oxide. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92336 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings.

16、 2/ Input supply voltage range (VIN) . -20 V to +30 V Feedback input voltage range . -0.3 V to +5 V 3/ Comparator input voltage range -0.3 V to +30 V 4/ Comparator output voltage range . -0.3 V to +30 V 4/ Shutdown input voltage . -3.0 V to +30 V 4/ Power dissipation (PD) Internally limited Storage

17、temperature range . -65C to +150C Junction temperature (TJ) . +150C Lead temperature (soldering, 5 seconds) . +260C Thermal resistance, junction-to-case (JC): Device type 01: Case E . 5C/W Case X . 7C/W Device type 02: Case X . 15C/W 1/ Thermal resistance, junction-to-ambient (JA): Device type 01: C

18、ase E . 87C/W still air 33C/W 500 LFPM air flow Case X . 134C/W still air 81C/W 500 LFPM air flow Device type 02: Case X . 140C/W still air 1/ 90C/W 500 LFPM air flow 1/ 1.4 Recommended operating conditions. Input voltage (VIN) +6 V dc Ambient operating temperature range (TA) . -55C to +125C _ 1/ Fo

19、r case outline letter X, device type 01 package material is aluminum nitride and the device type 02 package material is aluminum oxide. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect

20、reliability. 3/ When used in dual-supply systems where the regulator load is returned load is returned to a negative supply, the output voltage must be diode-clamped to ground. 4/ May exceed the input supply voltage. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

21、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92336 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a p

22、art of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STAN

23、DARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available

24、 online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing

25、 takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specifie

26、d herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN cla

27、ss level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline

28、s. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter li

29、mits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subg

30、roups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN is not feasible due to space l

31、imitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-

32、PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduc

33、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92336 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless oth

34、erwise specified Group A subgroups Device type Limits Unit Min Max Output voltage VO1 01, 02 4.975 5.025 V 2,3 4.940 5.060 1 mA IL 250 mA 1,2,3 4.93 5.07 Output voltage line regulation VOUT/ VO6 V VIN 30 V 1 01, 02 0.1 % 2,3 0.2 Output voltage load regulation VOUT/ VO1 mA IL 250 mA 1 01, 02 0.16 % 2

35、,3 0.2 0.1 mA IL 1 mA 1 0.16 2,3 0.2 Dropout voltage 2/ VDOIL= 1 mA 1 01, 02 100 mV 2,3 150 IL= 50 mA 1 300 2,3 420 IL= 100 mA 1 400 2,3 520 IL= 250 mA 1 600 2,3 800 Ground current 3/ IGIL= 1 mA 1 01, 02 170 A 2,3 200 IL= 50 mA 1 2.0 mA 2,3 2.5 IL= 100 mA 1 6 2,3 8 IL= 250 mA 1 28 2,3 33 See footnot

36、es at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92336 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charact

37、eristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Dropout ground current IGDOVIN= 4.5 V, 3/ 1 01, 02 210 A IL= 100 A 2,3 240 Shutdown ground current IGSOVSHUTDOWN 1.1 V, 3/ VOUT= 5 V, TA= +25C 1 01, 02 140 A Curre

38、nt limit ISCVOUT= 0 V 1 01, 02 500 mA 2,3 530 Thermal regulation VOUT/ PDTA= +25C 4/ 1 01, 02 0.2 %/W Reference voltage VREF5/ 1 01, 02 1.215 1.245 V 2,3 1.205 1.255 Reference voltage line regulation VREF/ VREF2.5 V VIN 6 V 1 01, 02 0.1 % 2,3 0.2 6 V VIN 30 V 1 0.1 2,3 0.2 Reference voltage load reg

39、ulation VREF/ VREF0 A IREF 200 A 1 01, 02 0.4 % 2,3 0.6 Feed back pin bias current IFB 1 01, 02 40 nA 2,3 60 Output “off” pulldown current IOSINK6/ 1 01, 02 30 mA 2,3 20 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

40、TANDARD MICROCIRCUIT DRAWING SIZE A 5962-92336 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Li

41、mits Unit Min Max Dropout detection comparator section Output “high” leakage current IOHVOH= 30 V 1 01, 02 1 A 2,3 2 Output “low” voltage VOLVIN= 4 V, 1 01, 02 250 mV IOCOMP= 400 A 2,3 400 Upper threshold voltage VTHR7/ 1 01, 02 -320 -150 mV max 2 -380 -130 3 -380 -120 Lower threshold voltage VTHR 7

42、/ 1 01, 02 -450 -280 mV min 2 -640 -180 3 -640 -155 SHUTDOWN input section. Input offset voltage VIO(Referenced to VREF) 1 01, 02 -7.5 7.5 mV 2 -10 10 3 -12 12 Input bias current IIBVIN(COMP)= 0 V to 5 V 1 01, 02 -30 30 nA 2 -50 50 3 -75 75 See footnotes at end of table. Provided by IHSNot for Resal

43、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92336 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -5

44、5C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Auxilary comparator Input offset voltage VIOReferenced to VREF1 01, 02 -7.5 7.5 mV 2 -10 10 3 -12 12 Input bias current IIBVIN(COMP)= 0 V to 5 V 1 01, 02 -30 30 nA 2 -50 50 3 -75 75 Output “high” leakage current

45、 IOHVOH= 30 V, 1 01, 02 1 A VIN(COMP)= 1.3 V 2 2 3 2.2 Output “low” voltage VOLVOH (COMP)= 1.1 V, 1 01, 02 250 mV IOP (COMP)= 400 A 2 400 3 420 1/ VIN= 6 V, IL= 1 mA, CL= 2.2 F, VOUT= 5 V, feedback pin is tied to 5 V tap pin, output pin is tied output sense pin. 2/ Dropout voltage is defined as the

46、input to output differential at which the output voltage drops 100 mV below the value measured with a 1 V differential. At very low values of programmed output voltage, the input minimum of 2 V (2.3 V over temperature) must be observed. 3/ Ground pin current is the regulator quiescent current. The t

47、otal current drawn from the source is the sum of the ground pin current, output load current, and current through the external resistive divider (if used). 4/ Thermal regulation is the change in output voltage at a time (T) after a change in power dissipation, excluding load or line effects. Specifi

48、cations are for a 200 mA pulse at VIN= 20 V ( 4 W pulse) for T = 10 ms. 5/ VREF VOUT (VIN), 2.3 V VIN 30 V, 100 A IL 250 mA. 6/ VSHUTDOWN 1.1 V, VOUT= 5 V. 7/ Comparator threshold are referred to a 5 V output. To express the threshold voltages in terms of a differential at the feedback terminal, divide by the error amplifier gain = VOUT/ VREF. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

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