DLA SMD-5962-93091 REV E-2012 MICROCIRCUIT HYBRID MEMORY 512K X 8-BIT ELECTRICALLY ERASABLE PROGRAMMABLE READ ONLY MEMORY.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device types 02, 03, and 04. Made changes to tables I and II. 93-04-15 K. Cottongim B Added device type 05. Added case outline Y. Redrew entire document. 96-04-22 K. A. Cottongim C Changes in accordance with NOR 5962-R154-96. 96-06-24 Kenda

2、ll A. Cottongim D Update drawing to the current requirements of MIL-PRF-38534. 05-08-17 Raymond Monnin E Updated drawing paragraphs. -sld 12-04-10 Charles F. Saffle REV SHEET REV E E E E SHEET 15 16 17 18 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMI

3、C N/A PREPARED BY Steve L. Duncan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael Jones THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, MEMORY, 512K X 8-BIT

4、, ELECTRICALLY ERASABLE PROGRAMMABLE READ ONLY MEMORY AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-01-22 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-93091 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E165-12 Provided by IHSNot for ResaleNo reproduction or networking permi

5、tted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93091 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534.

6、A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 93091 01 H X X Fede

7、ral RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA lev

8、els and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 WE-512K8-150CQ, AS8E512K8CW-150/HQ EEPROM, 512K x 8-bit 15

9、0 ns 02 WE-512K8-300CQ, AS8E512K8CW-300/HQ EEPROM, 512K x 8-bit 300 ns 03 WE-512K8-250CQ, AS8E512K8CW-250/HQ EEPROM, 512K x 8-bit 250 ns 04 WE-512K8-200CQ, AS8E512K8CW-200/HQ EEPROM, 512K x 8-bit 200 ns 05 WE-512K8-200CQ EEPROM, 512K x 8-bit 200 ns 1.2.3 Device class designator. This device class de

10、signator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class

11、Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of th

12、e standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Desig

13、nates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken wil

14、l not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

15、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93091 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package

16、style X See figure 1 32 Dual-in-line, dual cavity Y See figure 1 32 Dual-in-line, single cavity 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range . -0.6 V dc to +6.25 V dc Input voltage range -0.6 V dc to +6.25 V dc Power

17、 dissipation (PD) . 1.6 W Storage temperature range -65 C to +150 C Lead temperature (soldering, 10 seconds) +300 C Thermal resistance, junction-to-case (qJC) . 28 C/W Data retention 10 years minimum Endurance . 10,000 cycles minimum 1.4 Recommended operating conditions. Supply voltage range . +4.5

18、V dc to +5.5 V dc Input low voltage range (VIL) . -0.3 V dc to +0.8 V dc Input high voltage range (VIH) +2.2 V dc to VCC+ 0.3 V dc Output voltage, high minimum (VOH) . +2.4 V dc Output voltage, low maximum (VOL) +0.45 V dc Case operating temperature range (TC) -55 C to +125 C 2. APPLICABLE DOCUMENTS

19、 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE

20、SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard M

21、icrocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In

22、the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum rat

23、ings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93091 DLA LAND AND MARIT

24、IME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance

25、 of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall

26、 be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

27、in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Tim

28、ing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, 6, 7, and 8. 3.2.5 Block diagram. The block diagram shall be as specified on figure 9. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specifi

29、ed in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of devi

30、ce(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device describe

31、d herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This dat

32、a shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawin

33、g. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provi

34、ded with each lot of microcircuits delivered to this drawing. 3.9 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available upon request. 3.10 Endurance. A reprogrammability test shall be completed as part of the vendors reliability monitors. T

35、his reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in section 1.3 herein

36、over the full military temperature range. The vendors procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 3.11 Data retention. A data retention stress test shall be completed as part of the vendors reliability monitors. This

37、 test shall be done for initial characterization and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendors proce

38、dure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93091 DLA LAND AND MARITIME COLUMBUS,

39、 OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55 C TC +125 C VSS= 0 V dc +4.5 V dc VCC +5.5 V dc unless otherwise specified Group A subgroups Device type Limits Unit Min Max DC PARAMETERS Supply current ICC

40、CS = OE = VIL, WE = VIH, I/O 0 through I/O 7 = open, inputs = VCC= 5.5 V dc, A0 through A18 change at 5 MHz 1,2,3 All 180 mA Standby current ISB CS = VCC, I/O 0 through I/O 7 = open, inputs = VCC= 5.5 V dc, A0 through A18 change at 5 MHz 1,2,3 All 10 mA Input leakage current ILIVIN= VSSto VCC1,2,3 A

41、ll 80 mA Output leakage current ILOVOUT= VSSto VCC, CS = VIH1,2,3 All 80 mA Input low voltage VIL1,2,3 All 0.8 V Input high voltage VIH1,2,3 All 2.0 V Output low voltage VOLIOL= 2.1 mA, VCC= +4.5 V 1,2,3 All 0.45 V Output high voltage VOHIOH= -400 mA, VCC= +4.5 V 1,2,3 All 2.4 V FUNCTIONAL TESTING F

42、unctional tests See 4.3.1c 7,8A,8B All VCCsense write inhibitVSENSSee 4.3.1c 7,8A,8B 05 3.0 4.3 V VCCPower on delay write inhibitVPODSee 4.3.1c 7,8A,8B 05 10 ms DYNAMIC CHARACTERISTICS Input capacitance CINVIN= 0 V dc 2/ 4 All 90 pF Output capacitance COUTVOUT= 0 V dc 2/ 4 All 120 pF See footnotes a

43、t end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93091 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteris

44、tics - Continued. Test Symbol Conditions 1/ -55 C TC +125 C VSS= 0 V dc +4.5 V dc VCC +5.5 V dc unless otherwise specified Group A subgroups Device type Limits Unit Min Max READ CYCLE AC TIMING CHARACTERISTICS Read cycle time tRCSee figure 4. 9,10,11 01 02 03 04,05 150 300 250 200 ns Address access

45、time tACCSee figure 4. 9,10,11 01 02 03 04,05 150 300 250 200 ns Chip select access time tACSSee figure 4. 9,10,11 01 02 03 04,05 150 300 250 200 ns Output hold from address change OE or CS tOHSee figure 4. 9,10,11 All 0 ns Output enable to output valid tOESee figure 4. 9,10,11 01,04,05 02 03 85 125

46、 100 ns BYTE WRITE AC TIMING CHARACTERISTICS Address setup time tASSee figure 5. 9,10,11 All 10 ns Write pulse width tWPSee figure 5. 9,10,11 01-04 150 ns See figure 5, tCS 50 ns 05 110 Chip select setup time tCSSee figure 5. 9,10,11 All 0 ns Address hold time tAHSee figure 5. 3/ 9,10,11 All 125 ns

47、Data valid to end of write tDVSee figure 5. 9,10,11 All 100 ns Output enable setup time tOESSee figure 5. 9,10,11 All 10 ns Data hold time tDHSee figure 5. 9,10,11 All 10 ns Output enable hold time tOEHSee figure 5. 9,10,11 All 10 ns See footnotes at end of table. Provided by IHSNot for ResaleNo rep

48、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93091 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55 C TC +125 C VSS= 0 V dc +4.5 V dc VCC +5.5 V dc unless otherwise specified Group A subgroups Device type Limits Unit Min Max BYTE WRITE AC TIMING CHARACTERISTICS - Continued. Chip select hold t