DLA SMD-5962-93119 REV A-2009 MICROCIRCUIT LINEAR STEP-DOWN SWITCHING REGULATOR MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Replace reference to MIL-STD-973 with reference to MIL-PRF-38535 and update boilerplate paragraphs. - ro 09-03-16 R. HEBER REV SHET REV SHET REV STATUS REV A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY MARCIA

2、B. KELLEHER CHECKED BY SANDRA ROONEY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY MICHAEL A. FRYE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-02-22

3、 MICROCIRCUIT, LINEAR, STEP-DOWN SWITCHING REGULATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-93119 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E215-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI

4、T DRAWING SIZE A 5962-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device clas

5、s V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93119 01 Q Y A Feder

6、al stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marke

7、d with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follow

8、s: Device type Generic number Circuit function 01 LT1076 Step down switching regulator 02 LT1076HV Step down switching regulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements document

9、ation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and a

10、s follows: Outline letter Descriptive designator Terminals Package style Y See figure 1 4 TO-3, flange mount style 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduct

11、ion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Input voltage (VIN): Device type 01 . 45 V dc Device type

12、02 . 64 V dc Switch voltage with respect to input voltage: Device type 01 . 64 V dc Device type 02 . 75 V dc Switch voltage with respect to GROUND pin: 2/ Device type 01 . 35 V dc Device type 02 . 45 V dc FEEDBACK pin voltage -2 V dc, +10 V dc Junction temperature (TJ) . +150C Storage temperature ra

13、nge . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . +4C/W Thermal resistance, junction-to-ambient (JA) +35C/W 1.4 Recommended operating conditions. Input voltage range: Device type 01 . 8 V to 40 V dc Device type 02 . 8 V to 60 V dc Ambient

14、operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents

15、 are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Componen

16、t Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbin

17、s Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

18、 specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Switch to input voltage limitation must also be observed. Provided by IHSNot fo

19、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements

20、 for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

21、 device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q

22、 and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as sp

23、ecified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating tempera

24、ture range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may

25、also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V

26、shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device cla

27、ss M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a

28、 certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufa

29、cturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

30、 device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is requ

31、ired for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made availabl

32、e onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 76 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

33、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits Unit VIN= 2

34、5 V unless otherwise specified Min Max Switch “ON” voltage 1/ VSONISW= 0.5 A 1, 2, 3 All 1.2 V ISW= 2 A 1.7 ISWOFFEASVIN= 25 V, VSW= 0 V 1 All 150 A Switch “OFF” leakage 2/ current VIN= VMAX, VSW= 0 V 250 Supply current 3/ ISVFB= 2.5 V, VIN 40 V 1, 2, 3 All 11 mA VFB= 2.5 V, 40 V VIN 60 V 12 Minimum

35、 supply voltage VCCNormal mode 1, 2, 3 All 8.0 V Startup mode 4/ 1 4.8 2, 3 5.0 Switch current limit ISW5/ 1, 2, 3 All 2 3.2 A Maximum duty cycle DC 4, 5, 6 All 85 % Switching frequency fSW4 All 90 110 kHz 5 85 125 6 85 120 Switching frequency line regulation fSWLR8 V VIN VMAX2/ 4, 5, 6 All 0.1 %/V

36、Error amplifier voltage gain AEA1 V VC 4 V 4 All 800 V/V Error amplifier transconductance TEA4 All 3700 8000 mho IEASSource (VFB= 2 V) 1 All 100 225 A Error amplifier source and sink current Sink (VFB= 2.5 V) 0.7 1.6 mA Feedback pin bias current IFBVFB= VREF1, 2, 3 All 2 A See footnotes at end of ta

37、ble. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristi

38、cs Continued. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max Reference voltage VREFVC= 2 V 1, 2, 3 All 2.155 2.265 V Reference voltage line regulation VREFLR8 V VIN VMAX2/ 1, 2, 3 All 0.02 %/V VCvoltage at 0 % duty cycle VVC1 All 1.0

39、2.0 V 2, 3 0.4 2.6 1/ To calculate maximum switch “ON” voltage at currents between low and high conditions, a linear interpolation may be used. 2/ VMAX= 40 V for device type 01. VMAX= 60 V for device type 02. 3/ A FEEDBACK pin voltage (VFB) of 2.5 V forces the VCpin to its low clamp level and the sw

40、itch duty cycle to zero. This approximates the zero load condition where duty cycle approaches zero. 4/ Total voltage from VINpin to GROUND pin must be 8 V after setup for proper regulation. 5/ Switch frequency is internally scaled down when the FEEDBACK pin voltage is less than 1.3 V to avoid extre

41、mely short switch on times. During testing, VFBis adjusted to give a minimum switch on time of 1 s. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-39

42、90 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Dimensions Inches Millimeters Symbol Min Max Min Max A .320 .350 8.128 8.890 b .038 .043 .965 1.092 D .760 .775 19.30 19.69 F .060 .135 1.52 3.42 L .420 .480 10.67 12.19 P .151 .162 3.835 4.114 q 1.177 1.197 29.90 30.40 R .495 .525 12.57 13.33 R1 .16

43、7 .177 4.241 4.495 s .655 .675 16.63 17.14 NOTES: 1. Controlling dimensions are inch, millimeter dimensions are given for reference only. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596

44、2-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outline Y Terminal number Terminal symbol 1 VC2 VIN3 VSW4 FEEDBACK CASE GROUND FIGURE 2. Terminal connections. FIGURE 3. Block diagram. Provided by IHSNot for R

45、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93119 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, s

46、ampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures

47、 shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accord

48、ance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicabl