DLA SMD-5962-93184 REV B-2008 MICROCIRCUIT LINEAR DUAL QUAD CURRENT FEEDBACK AMPLIFIER MONOLITHIC SILICON《线性单硅片微电路 带二元 四元电流反馈放大器》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R043-94. 93-11-18 M. A. FRYE B Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. Redrawn. -rrp 08-07-07 R. HEBER REV SHET REV SHET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6

2、7 8 9 10 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, DUAL/QUAD, C

3、URRENT FEEDBACK AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-09-17 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-93184 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E191-07 Provided by IHSNot for ResaleNo reproduction or networking permitted wit

4、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93184 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class

5、es Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the

6、 following example: 5962 - 93184 01 M C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the M

7、IL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device

8、type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LT1229 Dual, current feedback amplifier 02 LT1230 Quad, current feedback amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as

9、 follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case

10、 outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or

11、 MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93184 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3

12、 Absolute maximum ratings. 1/ Supply voltage . 18 V Input current . 15 mA Output short circuit duration Continuous 2/ Power dissipation at TA= +125C (PD): Device type 01 500 mW 3/ Device type 02 625 mW 4/ Storage temperature range. -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junct

13、ion temperature (TJ) . +175C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Ambient operating temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards

14、, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DE

15、PARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these

16、 documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited here

17、in, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum leve

18、ls may degrade performance and affect reliability. 2/ A heat sink may be required depending on the power supply voltage. 3/ Power dissipation for device type 01 applies up to +125C assuming no load, VOUT= 0 V. 4/ Power dissipation for device type 02 should be derated above +107C at 12.5 mW/C assumin

19、g no load, VOUT= 0 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93184 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item req

20、uirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described h

21、erein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MI

22、L-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical perfor

23、mance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requiremen

24、ts. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking

25、 of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

26、 Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF

27、-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be requir

28、ed from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes

29、Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix

30、 A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this draw

31、ing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3

32、.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI

33、NG SIZE A 5962-93184 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxInput o

34、ffset voltage VOS1 All 10 mV 2, 3 15 Non-inverting input current IIN+1 All 3.0 A 2, 3 10 Inverting input current IIN-1 All 50 A 2, 3 100 Input voltage range VINVS= 15 V 1 All 13 V 2, 3 12 VS= 5.0 V 1 3.0 2, 3 2.0 Input resistance RINVIN= 13 V, VS= 15 V 1 All 2.0 M VIN= 12 V, VS= 15 V 2, 3 2.0 VIN= 3

35、 V, VS= 5 V 1 2.0 VIN= 2 V, VS= 5 V 2, 3 2.0 Common mode rejection ratio CMRR VS= 15 V, VCM= 13 V 1 All 55 dB VS= 15 V, VCM= 12 V 2, 3 55 VS= 5.0 V, VCM= 3.0 V 1 55 VS= 5.0 V, VCM= 2.0 V 2, 3 55 Inverting input current common mode rejection CMR+ VS= 15 V, VCM= 13 V 1 All 10 A/V VS= 15 V, VCM= 12 V 2

36、, 3 10 VS= 5.0 V, VCM= 3.0 V 1 10 VS= 5.0 V, VCM= 2.0 V 2, 3 10 Power supply rejection ratio PSRR VS= 2.0 V to 15 V 1 All 60 dB VS= 3.0 V to 15 V 2, 3 60 Non-inverting input current power supply rejection PSR+ VS= 2.0 V to 15 V 1 All 50 nA/V VS= 3.0 V to 15 V 2, 3 50 Inverting input current power su

37、pply rejection PSR- VS= 2.0 V to 15 V 1 All 5.0 A/V VS= 3.0 V to 15 V 2, 3 5.0 Large signal voltage gain AVVS= 15 V, VOUT= 10 V RL= 1.0 k 4, 5, 6 All 55 dB VS= 5.0 V, VOUT= 2.0 V, RL= 150 55 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without l

38、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93184 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Gr

39、oup A subgroups Device type Limits 2/ Unit Min MaxTransresistance, VOUT/IIN- 3/ ROLVS= 15 V, VOUT= 10 V RL= 1.0 k 4, 5, 6 All 100 k VS= 5.0 V, VOUT= 2.0 V, RL= 150 100 Maximum output voltage swing 3/ VOUTVS= 15 V, RL= 400 4 All 12 V 5, 6 10 VS= 5.0 V, RL= 150 4 3.0 5, 6 2.5 Maximum output current 3/

40、 IOUTRL= 0 , TA= +25C 4 All 30 125 mA Supply current 4/ ISVOUT= 0 V, ISET= 0 mA 1 All 9.5 mA 2, 3 11 Slew rate 5/ SR TA= +25C 7 All 300 V/s Rise time 6/ trTA= +25C 9 All 20 ns 1/ Unless otherwise specified, VS= 5 V, 15 V, VCM= 0 V and each amplifier is pulse tested. 2/ The limiting terms “min” (mini

41、mum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ The power tests done on 15 V supplies are done on only one amplifier at a time to prevent excessive junction temperatures when testing

42、 at maximum operating temperature. 4/ The supply current of the device has a negative temperature coefficient. 5/ Slew rate is measured at 5.0 V on a 10 V output signal while operating on 15 V supplies with feedback resistance (RF) = 1.0 k, gain resistance (RG) = 110 and RL= 400 . The slew rate is m

43、uch higher when the input is overdriven. 6/ Rise time is measured from 10% to 90% on a 500 mV output signal while operating on 15 V supplies with RF= 1.0 k, RG= 110 and RL= 100 . This condition is not the fastest possible, however it does guarantee the internal capacitances are correct and it makes

44、automatic testing practical. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93184 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 02 Cas

45、e outline P C Terminal number Terminal symbol 1 OUTPUT A OUTPUT A 2 -INPUT A -INPUT A 3 +INPUT A +INPUT A 4 V- V+ 5 +INPUT B +INPUT B 6 -INPUT B -INPUT B 7 OUTPUT B OUTPUT B 8 V+ OUTPUT C 9 - -INPUT10 - +INPUT C 11 - V- 12 - +INPUT D 13 - -INPUT14 - OUTPUT D FIGURE 1. Terminal connections. Provided

46、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93184 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device cla

47、sses Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspec

48、tion procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening sha