DLA SMD-5962-93190 REV A-2008 MICROCIRCUIT LINEAR CONTROLLED PULSE WIDTH MODULATOR MONOLITHIC SILICON《单片硅脉宽调制器 可控线性微电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Replace reference to MIL-STD-973 with reference to MIL-PRF-38535. -rrp 08-07-22 R. HEBER REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY

2、CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, CONTROLLED, PULSE WIDTH MODULATOR, MONOLITHIC SILICON AND AGENCIES OF THE

3、 DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-10-28 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-93190 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E192-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

4、62-93190 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of c

5、ase outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93190 01 M P X Federal stock class des

6、ignator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropr

7、iate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Gen

8、eric number Circuit function 01 LT1241 Controlled, pulse width modulator 02 LT1242 Controlled, pulse width modulator 03 LT1243 Controlled, pulse width modulator 04 LT1244 Controlled, pulse width modulator 05 LT1245 Controlled, pulse width modulator 1.2.3 Device class designator. The device class des

9、ignator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certificati

10、on and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 f

11、or device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93190 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET

12、 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) +25 V Output current (IOUT) 1 A 2/ Output energy (capacitor load per cycle) . 5 J Analog inputs (FB and ISENSEpins) -0.3 V to +6 V Error amplifier output sink current 10 mA Power dissipation (PD) (TA +25C) 1 W Storage tem

13、perature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-ambient (JA) 100C/W Thermal resistance, junction-to-case (JC). See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage (VCC). +15 V Input voltage (VIN) 12 V to 25 V Ambient opera

14、ting temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are th

15、ose cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case

16、Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenu

17、e, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specif

18、ic exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The 1 A rating for output current is based on transient switching requirements. Provid

19、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93190 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual it

20、em requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item r

21、equirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for d

22、evice classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagrams. The logic diagrams shall be

23、 as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating t

24、emperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PI

25、N may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q

26、and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for devi

27、ce class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device clas

28、s M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the

29、manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535

30、or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing i

31、s required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made av

32、ailable onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 110 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without

33、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93190 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified G

34、roup A subgroups Device type Min Max Units Reference section Output voltage VOUTIOUT1 mA, TA= +25C 1 All 4.925 5.075 V Line regulation VRLNVIN= 12 V, 25 V 1, 2, 3 All 20 mV Load regulation VRLDIOUT= 1 mA, 20 mA 1, 2, 3 All -25 mV Total output variation VTOVLine, Load, temperature 1, 2, 3 All 4.87 5.

35、13 V Output short circuit current IOS4, 5, 6 All -30 -180 mA Oscillator section RT= 10 k, CT= 3.3 nF, TA= +25C 47.5 52.5 Initial accuracy fOSCRT= 13 k, CT= 500 pF, TA= +25C 4 All 228 268 kHz Voltage stability fVOSCVCC= 12 V, 25 V, TA= +25C 4 All 1 % Clock ramp reset current IRCLKVOSC= 2 V, TA= +25C

36、4 All 7.9 8.5 mA Error amplifier section FEEDBACK (FB) pin input voltage VFINVCOMP= 2.5 V 1, 2, 3 All 2.42 2.58 V Input bias current IIBVFB= 2.5 V 1, 2, 3 All -2 A Open loop voltage gain AVOLVOUT= 2 V, 4 V 4, 5, 6 All 65 dB See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction

37、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93190 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions 1/ 2

38、/ -55C TA +125C unless otherwise specified Group A subgroups Device type Min Max Units Error amplifier section - Continued Power supply rejection ratio PSRR VCC= 12 V, 25 V 1, 2, 3 All 60 dB Output sink current ISINKVFB= 2.7 V, VCOMP= 1.1 V 1, 2, 3 All 2 mA Output source current ISRCVFB= 2.3 V, VCOM

39、P= 5 V 1, 2, 3 All -0.5 mA Output voltage, high level VOHVFB= 2.3 V, Rl= 15 k to GND 1, 2, 3 All 5.0 V Output voltage, low level VOLVFB= 2.7 V, Rl= 15 k to VREFpin 1, 2, 3 All 1.1 V Current sense section Gain AV4, 5, 6 All 2.85 3.15 V/V Maximum current sense input threshold VTHISENSE 1.1 V 1, 2, 3 A

40、ll 0.90 1.10 mA Input bias current IIB1, 2, 3 All -10 A Delay to output tOUTTA= +125C 10 All 100 ns Output section IOUT= 20 mA 0.4 Output low level voltage VOLIOUT= 200 mA 1, 2, 3 All 2.2 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without li

41、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93190 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise s

42、pecified Group A subgroupsDevice type Min Max Units Output section - Continued IOUT= 20 mA 12.0 Output high level voltage VOHIOUT= 200 mA 1, 2, 3 All 11.75 V Output voltage clamp VOCIOUT= 1 mA 1, 2, 3 All 19 V Performance section 01 9.0 10.2 02, 04 15 17 Startup threshold voltage VTHR1, 2, 3 03, 05

43、7.8 9.0 V 01, 03, 05 7.0 8.2 Minimum operating voltage VMIN1, 2, 3 02, 04 9.0 11 V 01 1.6 02, 04 5.5 Hysteresis HYST TA= +25C 1 03, 05 0.4 V 01, 04, 05 46 Maximum duty cycle TA= +25C 4 02, 03 94 % Startup current ISU1, 2, 3 All 250 A Operating current ICC1, 2, 3 All 10 mA 1/ Unless otherwise specifi

44、ed, VCC= 15 V, timing resistance (RT) = 10 k, and timing capacitance (CT) = 3.3 nF. See figure 3. 2/ Low duty cycle pulse techniques are used during test to maintain junction temperature close to ambient. 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspectio

45、n procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordan

46、ce with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004

47、 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93190 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 R

48、EVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline P Terminal number Terminal symbol 1 COMPENSATION (COMP) 2 FEEDBACK (FB) 3 CURRENT SENSE 4 TIMING RESISTANCE (RT)/TIMING CAPACITANCE (CT) 5 GROUND 6 OUTPUT VOLTAGE (VOUT) 7 VCC8 VREFFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,