ImageVerifierCode 换一换
格式:PDF , 页数:18 ,大小:171.31KB ,
资源ID:700397      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-700397.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(DLA SMD-5962-93228 REV B-2005 MICROCIRCUIT DIGITAL CMOS TEST BUS CONTROLLER MONOLITHIC SILICON《硅单片 测试总线收发器 氧化物半导体数字微型电路》.pdf)为本站会员(tireattitude366)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-93228 REV B-2005 MICROCIRCUIT DIGITAL CMOS TEST BUS CONTROLLER MONOLITHIC SILICON《硅单片 测试总线收发器 氧化物半导体数字微型电路》.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R281-94 94-10-07 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements. Update figure 4 waveforms and notes. - CFS 05-05-09 Thomas M. Hess REV SHET REV B B B SHEET 15 16 17 REV STATUS REV B B B

2、B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED Thomas M. Hess DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVE

3、D BY Monica L. Poelking MICROCIRCUIT, DIGITAL, CMOS, TEST BUS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-10-18 CONTROLLER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-93228 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E307-05 Provided by IHSNot for Re

4、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class leve

5、ls consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected i

6、n the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93228 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device

7、 classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non

8、-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT8990 Test bus controller 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follow

9、s: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outlin

10、e(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 68 Ceramic quad flat pack Y CMGA15-P69 69 Pin grid array 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535

11、, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maxi

12、mum ratings. 1/ Supply voltage range (VCC) -0.5 V to 7.0 V dc Input voltage range -0.5 V dc to VCCOutput voltage range -0.5 V dc to VCCInput clamp current 20 mA Output clamp current 20 mA Continuous output current 25 mA Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds)

13、. +300C Thermal resistance, junction-to-case (JC): Case outline X 1.856C/W Case outline Y See MIL-STD-1835 Power dissipation (PD) 980 mW 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V VCC 5.5 V High level input voltage (VIH) 2 V minimum Low level input voltage (VIL) . 0.8 V m

14、aximum Input voltage (VIN) 0 V to VCCOutput voltage (VOUT). 0 V to VCCHigh level output current (IOH) -8 mA Low level output current (IOL) 8 mA Ambient operating temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specif

15、ication, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Spe

16、cification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings

17、. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent

18、 damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O

19、HIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DOD adopted are those listed in the issue of the DOD

20、ISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in the solicitation. INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Arch

21、itecture. (Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane, Piscataway, NJ 08854-4150.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These d

22、ocuments may also be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes appl

23、icable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Managemen

24、t (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction,

25、 and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and on

26、figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure 3. 3.2.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified

27、 on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature ra

28、nge. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be

29、 marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall b

30、e in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M sh

31、all be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certif

32、icate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers

33、 product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SI

34、ZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be pro

35、vided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verifi

36、cation and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircui

37、t group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 105 (see MIL-PRF-38535, appendix A). 3.11 IEEE 1149.1 compliance. Device type 01 shall be compliant with IEEE 1149.1. Provided by IHSNot for ResaleNo reproduction or networking

38、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. See footnotes at end of table. Limits Test Symbol Condition

39、s 1/ -55C TA +125C, 4.5 V VCC 5.5 V unless otherwise specified Group A subgroupsDevice types Min Max Unit IOH= -20 A, VCC= 4.5 V 4.4 High level output voltage VOH1IOH= -8 mA, VCC= 4.5 V 1, 2, 3 All 3.7 V IOH= -20 A, VCC= 5.5 V 5.4 High level output voltage VOH2IOH= -8 mA, VCC= 5.5 V 1, 2, 3 All 4.7

40、V IOL= 20 A, VCC= 4.5 V, 5.5 V 0.1 Low lever output voltage VOLIOL= 8 mA, VCC= 4.5 V, 5.5 V 1, 2, 3 All 0.5 V Input current, ADRS, RD, WR, TCKI II1VIN= VCCor GND VCC= 5.5 V 1, 2, 3 All 1 A VIN= VCC, VCC= 5.5 V 1 Input current, TDI, TOFF, TRST II2VIN= GND, VCC= 5.5 V 1, 2, 3 All 250 A High-impedance

41、state output current (INT, RDY, TCKO, TDO, TMS) IOZ1VOUT= VCCor GND VCC= 5.5 V 1, 2, 3 All 10 A VOUT= VCC, VCC= 5.5 V 10 High-impedance state output current (DATA, TMS/EVENT) IOZ2VOUT= GND, VCC= 5.5 V 1, 2, 3 All 250 A Supply current ICCVIN= VCCor GND, IO= 0 VCC= 5.5 V 1, 2, 3 All 450 A Input capaci

42、tance CINSee 4.4.1.c 4 All 5.5 pF Input/output capacitance CI/OSee 4.4.1.c 4 All 8.4 pF Output capacitance COUTSee 4.4.1.c 4 All 5.7 pF Functional test See 4.4.1.b 7, 8 All Clock frequency fclock9, 10, 11 All 30 MHz WR low 5.5 Event high or low 8 TCKI high or low 10.5 Pulse duration twTRST low 9, 10

43、, 11 All 6 ns ADRS before WR 6.5 DATA before WR 6 EVENT before TCKI EVENT before TCKI 5 TDI before TCKI 2 Setup time tsuTDI before TCKI 9, 10, 11 All 2 ns Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228

44、 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. See footnotes at end of table. Limits Test Symbol Conditions 1/ -55C TA +125C, 4.5 V VCC 5.5 V unless otherwise specified Group A subg

45、roupsDevice types Min Max Unit ADRS after WR 5.5 DATA after WREVENT after TCKI 5.5 EVENT after TCKI 5 TDI after TCKI 4 Hold time thTDI after TCKI 9, 10, 11 All 4 ns Maximum frequency fMAXVCC= 5.0 V, TA= 25C 9, 10, 11 All 30 MHz ADRS to DATA tPLH1, tPHL18 43 RD to RDY tPLH25.3 17 WR to RDY tPLH32.5 1

46、6 tPLH43.7 TCKI to INT tPHL45.5 15 TCKI to RDY tPHL54.4 TCKI to TCKO tPLH53.3 17 TCKI to TCKO tPLH62.3 19 TCKI to TCKO tPHL63.6 tPLH72.9 TCKI to TDO tPHL75.2 20 tPLH83.1 19 TCKI to TMS tPHL85.1 tPLH91.5 TCKI to TMS/EVENT tPHL93.5 20 tPZH13.8 21 RD to DATA tPZL16.8 28 TCKI to INT tPZH24.9 19 TCKI to

47、RDY tPZH33.6 tPZH44.1 23 TCKI to TCKO tPZL44.8 20 tPZH54.3 22 TCKI to TDO tPZL55 tPZH64.6 23 TCKI to TMS tPZL65.1 20 tPZH72 21 TCKI to TMS/EVENT tPZL73.2 tPZH84.6 16 TOFF to TCKO tPZL83.1 14 tPZH94.4 15 TOFF to TDO tPZL9See figure 4. VCC= 4.5 V 9, 10, 11 All 3.5 14 ns Provided by IHSNot for ResaleNo

48、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ The following signals are active low: RD, RDY, WR, INT, TOFF, and TRST. Unless otherwise specified, al test conditions shall be the worst case conditions. Limits Test Symbol Conditions 1/ -55C TA +125C, 4.5 V VCC 5.5 V unless otherwise specified Group A subgroupsDevice types Min Max U

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1