DLA SMD-5962-93239 REV C-2013 MICROCIRCUIT DIGITAL CMOS SCAN PATH LINKERS WITH 4-BIT ID BUS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R133-94. 94-03-24 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-06-22 Thomas M. Hess C Update boilerplate Paragraphs to MIL-PRF-38535 requirements. - jwc 13-09-10 Thomas M. Hes

2、s REV SHEET REV C C C C SHEET 15 16 17 18 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED Larry T. Gauder DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M.

3、 Hess THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, CMOS, SCAN PATH LINKERS WITH 4-BIT ID BUS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-01-20 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 596

4、2-93239 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E411-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93239 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1.

5、 SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When availa

6、ble, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93239 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead fin

7、ish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and

8、 are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT8997 Scan path linkers with 4-bit identification buses 1.2.3 Device class des

9、ignator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535,

10、appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CDIP3-T28 or GDIP4-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip c

11、arrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93239 DLA

12、 LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc Output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Input clamp cur

13、rent (IIK) 20 mA Output clamp current (IOK) 20 mA Continuous output current (IOUT) 25 mA Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +175C Maximum power dissipation (PD) . 193 mW 2/ Thermal resistance, junction-to-case (JC) . S

14、ee MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc to 5.5 V dc Input voltage range (VIN) 0 V to VCCOutput voltage range (VOUT) . 0 V to VCCHigh level input voltage (VIH) 2 V minimum Low level input voltage (VIL) . 0.8 V maximum High level output current (IOH):

15、TDO, DTD01-4, MCO -7 mA DTMS1-4, DCO (3-state), DTCK -11 mA Low level output current (IOL): TDO, DTD01-4, MCO 7 mA DCO (open drain or 3-state) . 11 mA DTMS1-4 16 mA DTCK . 32 mA Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, an

16、d handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Cir

17、cuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780

18、 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage t

19、o the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC+ VOLx IOLx number of outputs, and must withstand the added PDdue to the short circuit output test (e.g., IOS). Provided by IHSNot for ResaleNo re

20、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93239 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following document(s) form a part of this document to th

21、e extent specified herein. Unless otherwise specified, the issues of the documents which are DOD adopted are those listed in the issue of the DODISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in the so

22、licitation. INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture. (Copies of these documents are available online at http:/www.ieee.org or from the IEEE Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway,

23、NJ 088551331.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents may also be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict

24、between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item require

25、ments for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirement

26、s for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device clas

27、ses Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shall be as spec

28、ified on figure 2. 3.2.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 3. 3.2.5 Boundary scan instruction codes. For device type 01 the boundary scan instruction codes shall be as specified on figure 4. 3.3 Electrical performance chara

29、cteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The ele

30、ctrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the ent

31、ire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking fo

32、r device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, app

33、endix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93239 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. For device classes

34、Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of

35、supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein

36、 or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits d

37、elivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for

38、 device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.1

39、0 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 105 (see MIL-PRF-38535, appendix A). 3.11 IEEE 1149.1 compliance. Device type 01 shall be compliant with IEEE 1149.1. Provided by IHSNot for ResaleNo reproduction

40、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93239 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. See footnotes at end of table. Test Symbol Conditions 1

41、/ -55C TA +125C, unless otherwise specified Group A subgroups Device types Limits Unit Min Max High level output voltage VOHVCC= 4.5 V VIH= 2.0 V VIL= 0.8 V IOH= -7 mA TDO, DTDO1-4, MCO 1, 2, 3 All 3.6 V VCC= 4.5 V VIH= 2.0 V VIL= 0.8 V IOH= -11 mA DTMS1-4, DCO (3-state), DTCK 3.6 Low level output v

42、oltage VOLVCC= 4.5 V VIH= 2.0 V VIL= 0.8 V IOL= 7 mA TDO, DTDO1-4, MCO 1, 2, 3 All 0.5 V VCC= 4.5 V VIH= 2.0 V VIL= 0.8 V IOL= 11 mA DCO (open drain or 3-state) 0.5 VCC= 4.5 V VIH= 2.0 V VIL= 0.8 V IOL= 16 mA DTMS1-4 0.5 VCC= 4.5 V VIH= 2.0 V VIL= 0.8 V IOL= 32 mA DTCK 0.5 Output leakage current IOZ

43、2/ VCC= 5.5 V VOUT= VCCor GND DTD01-4, DTMS1-4, DCO, DTCK 1, 2, 3 All 10 A High level output current IOHVCC= 5.5 V VOUT= VCCDCO (open drain) 1, 2, 3 All 20 A Input current at maximum input voltage IIVCC= 5.5 V VIN= VCCor GND MCI, DCI, TCK, ID1-4 1, 2, 3 All 1 A VCC= 5.5 V VIN= VCCTDI, DTDI1-4, TMS,

44、TRST 1 VCC= 5.5 V VIN= GND TDI, DTDI1-4, TMS, TRST -20 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93239 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABL

45、E I. Electrical performance characteristics - Continued. See footnotes at end of table. Test Symbol Conditions 1/ -55C TA +125C, unless otherwise specified Group A subgroups Device types Limits Unit Min Max Power supply current ICCVCC= 5.5 V VIN= VCCor GND IOUT= 0 A 1, 2, 3 All 100 A Quiescent suppl

46、y current delta ICCVCC = 5.5 V One input at VIN= 3.4 V, other inputs at VCCor GND. 1, 2, 3 All 1 mA Input capacitance CINSee 4.4.1.c 4 All 14.6 pF Functional test See 4.4.1.b VCC= 4.5 v and 5.5 V 7, 8 All TCK frequency fmaxVCC= 4.5 V 9, 10, 11 All 20 MHz DCI (count mode) 20 Propagation delay TCK to

47、DTCK tPLHVCC= 4.5 V RL= 500 CL= 50 pF 9, 10, 11 All 2 14 ns tPHL2 16 Propagation delay TCK to TDO tPLH7.0 28 ns tPHL7.0 26 Propagation delay TCK to any DTDO tPLH7.0 27 ns tPHL7.0 26 Propagation delay TCK to DCO (open drain) tPLH9.0 33 ns tPHL9.0 34 Propagation delay TCK to DCO (3-state) tPLH9.0 32 n

48、s tPHL9.0 31 Propagation delay TMS to any DTMS tPLH4.0 21 ns tPHL5.0 23 Propagation delay MCI to MCO tPLH5.0 23 ns tPHL5.0 22 Propagation delay DCI to DCO (open drain) tPLH9 30 ns tPHL7 29 Propagation delay DCI to DCO (3-state) tPLH6 29 ns tPHL6 26 Propagation delay TCK to any DTMS tPLH9 31 ns tPHL9 31 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93239 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE