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本文(DLA SMD-5962-94508 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 9-BIT BUS INTERFACE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf)为本站会员(medalangle361)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

DLA SMD-5962-94508 REV B-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 9-BIT BUS INTERFACE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. - jak 00-12-20 Thomas M. Hess B Correct test condition for high voltage level (VOH) and low voltage level (VOL) in the table I. Update the boilerplate paragraphs to current MIL-PRF-38535 requireme

2、nts. - MAA 09-04-09 Thomas M. Hess REV SHEET REV B B B B B SHEET 15 16 17 18 19 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COL

3、UMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-05-31 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 9-BIT BUS INTERFACE FLIP-FLOP WITH THREE-STATE OUTP

4、UTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-94508 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E238-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9450

5、8 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case out

6、lines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94508 01 Q L A Federal RHA Device Device Case

7、Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate R

8、HA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic n

9、umber Circuit function 01 54ABT823 9-bit bus interface flip-flop with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor s

10、elf-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outli

11、ne letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendi

12、x A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratin

13、gs. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +5.5 V dc 4/ DC input clamp current (IIK) (VIN 0.0 V). -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA DC output current (IOL)

14、 (per output). +96 mA Storage temperature range (TSTG). -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C Maximum power dissipation (PD) . 447 mW 5/ 1.4 Recommended operating conditions. 2/ 3/ Su

15、pply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCC Maximum low level input voltage (VIL) +0.8 V Minimum high level input voltage (VIH). +2.0 V Case operating temperature range (TC). -55C to +125C Maximum input rise

16、and fall rate (t/V) 5 ns/V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +48 mA _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2

17、/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative voltage ratings may be exceeded provided that the input and outpu

18、t clamp current ratings are observed. 5/ Power dissipation value is derived using the formula, PD= (VCCx ICC) + (VOLx IOLx n), where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table I herein, and n represents the total number of outputs. Provided by IHSNot for ResaleNo re

19、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The

20、following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturi

21、ng, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microc

22、ircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this draw

23、ing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q an

24、d V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be

25、 in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535,

26、 appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagra

27、m. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce test circuit and waveforms. The ground bounce test circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure

28、 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and

29、 postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requ

30、irements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN numbe

31、r is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M

32、shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Cert

33、ificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in or

34、der to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of

35、 MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with ea

36、ch lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and re

37、view for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assig

38、nment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 127 See MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94508 DEFENSE

39、 SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCCGroup A su

40、bgroups Min Max Unit VOH1For all inputs affecting output under test VIH= 2.0 V or VIL=0.8 V IOH= -3 mA All 4.5 V 1, 2, 3 2.5 VOH2For all inputs affecting output under test VIH= 2.0 V or VIL=0.8 V IOH= -3 mA All 5.0 V 1, 2, 3 3.0 High level output voltage 3006 VOH3For all inputs affecting output unde

41、r test VIH= 2.0 V or VIL=0.8 V IOH= -24 mA All 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all inputs affecting output under test VIH= 2.0 V or VIL=0.8 V IOL= +48 mA All 4.5 V 1, 2, 3 0.55 V Three-state output leakage current high 3021 IOZH4/ 5/ For control inputs affecting output under

42、 test, VIH= 2.0 V or VIL=0.8 V VOUT= 2.7 V All 5.5 V 1, 2, 3 10.0 A Three-state output leakage current low 3020 IOZL4/ 5/ For control inputs affecting output under test, VIH= 2.0 V or VIL=0.8 V VOUT= 0.5 V All 5.5 V 1, 2, 3 -10.0 A Negative input clamp voltage 3022 VIC-For input under test, IIN= -18

43、 mA All 4.5 V 1, 2, 3 -1.2 V Off-state leakage current IOFFFor input or output under test VINor VOUT= 4.5 V All other pins at 0.0 V All 0.0 V 1 100.0 A High-state leakage current ICEXFor output under test, VOUT= 5.5 V Outputs at high logic state All 5.5 V 1, 2, 3 50.0 A Input current high 3010 IIHFo

44、r input under test, VIN= VCCAll 5.5 V 1, 2, 3 +1.0 A Input current low 3009 IILFor input under test, VIN= GND All 5.5 V 1, 2, 3 -1.0 A Output current 3011 IOUT 6/ VOUT= 2.5 V All 5.5 V 1, 2, 3 -50.0 -180.0 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking p

45、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Sym

46、bol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCCGroup A subgroups Min Max Unit Quiescent supply current delta TTL input levels 3005 ICC7/ For input under test, VIN= 3.4 V For all other inputs, VIN= VCCor GND All 5.5 V 1, 2, 3 1.5 mA Quiescent supply cur

47、rent, output high 3005 ICCHVIN= VCCor GND IOUT= 0.0 A All 5.5 V 1, 2, 3 250.0 A Quiescent supply current, output low 3005 ICCLVIN= VCCor GND IOUT= 0.0 A All 5.5 V 1, 2, 3 38.0 mA Quiescent supply current, output three-state 3005 ICCZVIN= VCCor GND IOUT= 0.0 A All 5.5 V 1, 2, 3 250.0 A Input capacita

48、nce 3012 CINSee 4.4.1c TC= +25C All 5.0 V 4 13.5 pF Output capacitance 3012 COUTSee 4.4.1c TC= +25C All 5.0 V 4 19.0 pF VOLP8/ All 5.0 V 4 650 mV Low level ground bounce noise VOLV8/ All 5.0 V 4 -1700 mV VOHP8/ All 5.0 V 4 1850 mV High level VCCbounce noise VOHV8/ VIH= 3.0 V, VIL= 0.0 V TA= +25C See figure 4 See 4.4.1d All 5.0 V 4 -450 mV All 4.5 V 7, 8 L H Functional test 3014 9/ VIL= 0.8 V, VIH= 2.0 V Verify output VOUT See 4.4.1b All 5.5 V 7, 8 L H See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or network

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