DLA SMD-5962-94535-1994 MICROCIRCUIT LINEAR HIGH SPEED TRACK AND HOLD AMPLIFIER HYBRID《高速追踪保持扬声器 线性混合微型电路》.pdf

1、LTR II RvllC N/A AppF1a/ED (YR-MO- DA 1 STAEaARDIZED MILITARY mwm DRAWING APPROVAL DATE 94-03-24 REVISION LEVEL THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE “IzE A 67268 5962-94535 AMSC NIA PREPARED BY Gary Zahn DEFENSE ELECTFCNICS StppLY cBcTw wm, C

2、HIO 45444 CHECKED BY Michael C. Jonas APPROVED BY Kendall A. Cottongim MICROCIRCUIT, LINEAR, HIGH SPEED, TRACK AND HOLD AMPLIFIER, HYBRID SHEET 1 OF 11 5962-124-94 DESC FORM 193 JUL 91 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo r

3、eproduction or networking permitted without license from IHS-,-,-SMD-5962-94535 9999996 0059958 30b STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part nunber docunentation system (see 6.6 herein).

4、 This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are refl

5、ected in the Part or Identifying Nunber (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. Two 1.2 m. The PIN shall be as shown in the following example: 94535 Federal RHA Ilif Device Device Case Lead il stock class designator type c 1 ass out 1 ine fini

6、sh designator (see 1.2.1) (see 1.2.2) desi gnator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing nunber 1.2.1 Radiation hardness assurance (RHA) designator. Device classes H and K RHA marked devices shall met the A dash (-) indicates a MIL-li-38534 specified RHA levels and shall be marked with the

7、appropriate RHA designator. non-RHA device. 1.2.2 Device tvpe(s.1. The device type(s) shall identify the circuit function as follows: Device type Generic nunber Circuit function o1 AD9100SD High speed, track and hold anplifier 1.2.3 Device class designator. This device class designator shall be a si

8、ngle letter identifying the product assurance level as follows: SIZE 5962-94535 A fEvISICNLEwL S-EET 2 Device class H or K Device requirements documentation Certification and qualification to MIL-H-38534 1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows

9、: Outline letter Descriptive designator Terminals Package style X See figure 1 20 Dual - in- 1 ine 1.2.5 Lead finish. The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter “X“ shall not be marked on the microcircuit or its packaging. finishes A, 6, and C are conside

10、red acceptable and interchangeable uithout preference. The IIX“ designation is for use in specifications when lead 1.3 Absolute maxim ratings. i/ Supply voltages (IV,) 16 V dc Continuous output current Analog input voltage 15 V dc Power dissipation (Po) . 1.25 U Lead temperature (soldering, 10 secon

11、ds) +3OO0C 70 ml Junction temperature (TJ +lEC Storage temperature range -65OC to +150“C - I/ Stresses above the absolute maximum rating may cause permanent damage to the device. maxim levels may degrade performance and affect reliability. Extended operation at the Esc rn 1934 JUL 91 Provided by IHS

12、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-74535 W 9999996 0059959 242 m STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1.4 Recomnended operating conditions. Supply voltages: (+V,) . (-Vs) . Case operating temperat

13、ure range (TC) SIZE 5962-94535 A REVISICNLEVEL SEET 3 +5 V dc -5.2 V dc -55C to +125“C 2. APPLICABLE DOCUMENTS 2.1 Government specification. standards, and handbook. Unless otherwise specified, the following specification, standards, and handbook of the issue listed in that issue of the Department o

14、f Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MI Li TARY MIL-H-38534 - Hybrid Microcircuits, General Specification for. STANDARDS U1 Li TARY MIL-STD-883 - Test Methods and Procedures for Microe

15、lectronics. MIL-STD-973 - Configuration Management. MIL-STD-1835 - Microcircuit Case Outlines. HANDBOOK MI Li TARY MIL-HDBK-780 - Standardized Military Drauings. (Copies of the specification, standards, and handbook required by manufacturers in connection with specific acquisition functions should b

16、e obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 herein. Item requirements. T

17、he individual item requirements shall be in accordance with MIL-H-38534 and as specified 3.2 Design. construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-H-38534 and herein. 3.2.1 Case outline(s). 3.2.2 Terminal connections. The case o

18、utline(s) shall be in accordance with 1.2.4 herein and figure 1. The terminal connections shall be as specified on figure 2. Ju 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3.3 Electrical performance characteristics. Unless otherwise specified

19、herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating tenperature range. The electrical tests for each subgroup are described in table I. 3.4 Electrical test requirements. 3.5 Marking. Marking shall be in accordance with MIL-

20、H-38534. 3.6 Manufacturer eligibility. The electrical test requirements shall be the subgroups specified in table II. The part shall be marked with the PIN listed in 1.2 In addition to the general requirements of MIL-H-38534, the manufacturer of the part herein. In addition, the manufacturers PIN ma

21、y also be marked as listed in WL-38534. described herein shall maintain the electrical test data (variables formt) from the initial quality conformance inspection group A lot sample, produced on the certified line, for each device type listed herein. also include a smry of all paraineters manually t

22、ested, and for those which, if any, are guaranteed. shall be maintained under docunent revision level control by the manufacturer and be made available to the preparing activity (DESC-EC) upon request. The data should This data 3.7 Certificate of condiance. A certificate of conpliance shall be requi

23、red from a manufacturer in order to The certificate of canpliance submitted to DESC-EC shall affirm that the manufacturers supply to this drawing. product meets the requirements of MIL-H-38534 and the requirements herein. each lot of microcircuits delivered to this drawing. 3.8 Certificate of confor

24、mance. A certificate of conformance as required in MIL-H-38534 shall be provided with 4. QUALITY ASSURANCE PROVISIONS 4.1 Samoling and insDection. 4.2 Screeninq. Screening shall be in accordance with MIL-H-385%. The following additional criteria shall apply: Sampling and inspection procedures shall

25、be in accordance with MIL-H-38534. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under docunent revision level control and shall be made available to either DESC-EC or the acquiring activity upon request. appli

26、cable, in accordance with the intent specified in test method 1015 of MIL-STD-883. TA as specified in accordance with table I of method 1015 of MIL-STD-883. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as (2) b. Interim and final electrical test parameters

27、 shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. STANDARD1 ZED SI OE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 ISIOvLEI/EL 5962-94535 SEEr 4 Provided by IHSNot for R

28、esaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-74535 99b 005bL TO I 1,2,3 o1 3 mV/ V 182 CL/K = -1.0 v I Grow A I Device i Limits I Unit Conditions $/ -55C 5 T, 5 +125C unless otherwise specified lest 1,2,3 I O1 Power dissipation Supply currents +IS I -I -1s I 11-

29、1321 Output voltage range vou, I -2 Input bias current (ana Log) 1 I o1 -8 -16 +16 I I I Input resistance 350 (ana log) I I I Voltage gain IA, IAV, = 2 V Offset voltage 10, lIN = o IOU, I -40 I +40 I mA Output drive capability Power supply rejection ratio Pedestral sensitivity to SUPPLY Input bias c

30、urrent iPSRR IAV, = 0.5 V p-p 1,2,3 I O1 I I 5 Iw -1 .o VIL I 1,2,3 I O1 I Input low voltage input high voltage VI, I See footnotes at erd of table. STANDARD1 ZED 5962-94535 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Provided by IHSNot for ResaleNo reproduction or networki

31、ng permitted without license from IHS-,-,-TABLE I. Electrical performance characteristics - Continued. Group A subgrow Device type Limits Unit Symbol Conditions I/ -55C 5 T, 5 +125“C unless otherwise specif id Min 1 Max 4 o1 -6 +6 -30 +30 -40 +40 -5 +5 -10 +IO 150 5 6 4 o1 mV v,=ov o1 MHz 4 o1 550 I

32、 ;R 4 V step 5,6 500 I 4 o1 1 -72 dS FS 5 I 6 4,5,6 o1 4,5,6 o1 I 23 L 5962-94535 STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC KRvl193A II 01 FINISIQU LML S-EET 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

33、-,-,-SMD-5962-74535 9999996 0059963 773 = 20 TOP VIEW CI, - - 1 10 f .1 E STANDARD1 ZED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 5962-94535 ISIOULEVEL S-EET 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b

34、2-94535 W b 0057964 bOT = Device twe Case outline Terminal nunber 1 2 3 4 6 8 10 11 12 13 14 15 16 17 18 19 5 7 9 20 01 X Terminal svmbol -Vs (-5.2 V) GND (Conmon plane) GND (conmon plane) VIN (analog input) Bypass (0.1 IF to GNDI GND (conmon plane) GND (comnon plane) GND (comnon plane) GND (cornnon

35、 plane) Bypass (0.1 CF to GND) GND (conmon piane) CLK (complement ECL clock CLK (88True88 ECL clock) -Vs (-5.2 V) -Vs (-5.2 V) VWT (T/H output) GND (CommOn piane) +vs (+5.0 V) +Vs (+5.0 V) - +Vs (+5.0 V) FIGURE 2. Terminal connections. SIZE A STANJNiRDI ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPL

36、Y CENTER DAYTON, OHIO 45444 5962-94535 FINISIOVLML SEET 1 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-74535 m 7999996 0059965 546 MIL-H-38534 test requirements interim electrical parameters Final electrical test parameters Group A test

37、 requirements Subgroups (in accordance with MIL- H-38534 , group A test table) 1*,2,3,4,5,6 1,2,3.4,5,6 Group C end-point electrical parameters STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MIL-STD-883, group E end-point electrical parameters for RHA devi ces SI

38、ZE 5962-94535 A FINISICNLEVEL SET 1 Subgroups * (in accordance with method 5005, group A test table) * PDA applies to subgroup 1. * When applicable to this standardized military drawing, the subgroups shall be defined. 4.3 Quality conformance inspection. Quality conformance inspection shall be in ac

39、cordance with MIL-H-38534 and as specified herein. 4.3.1 GrOUP A inspection. Group A inspection shall be in accordance with MIL-H-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, IO, and 11 shall be omitted. 4.3.2 Group 6 inspection. Group 6 inspection s

40、hall be in accordance with MIL-H-38534. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-94535 9999996 0057966 482 W STANDARD1 ZED SIZE MILITARY DRAWIN A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 RNISICNLEVEL 4.3.3 GrOUD C inspecti

41、on. Group C inspection shall be in accordance uith MIL-H-38534 and as follous: a. b. End-point electrical parameters shall be as specified in table 11 herein. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. Also, the test circuit shall specify the inputs, output

42、s, biases, and pouer dissipation, as The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DESC-EC or the acquiring activity upon request. applicable, in accordance uith the intent specified in test method 1005 of MIL-STD

43、-883. (2) TA as specified in accordance uith table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection. 4.3.5 Group E inspection. Group D inspection shall be in accordance with MIL-H-38534. Group E inspection is

44、 required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). conformance inspection sample tests shall be performed at the RHA level specified in the acquisition document. RHA levels for device classes H and K shall be U, D, R, and H. RHA quality a. RHA tests for de

45、vice classes H and K for levels M, DI R, and H shall be performed through each Level to determine at what levels the devices meet the RHA requirements. These RHA tests shall be performed for initial qualification and after design or process changes uhich may affect the RHA performance of the device.

46、 End-point electrical parameters shall be as specified in table II herein. Prior to total dose irradiation, each selected sample shall be assehled in its qualified package. pass the specified group A electrical parameters in table I for subgroups specified in table II herein. For device classes H an

47、d KI the devices shall be subjected to radiation hardness assured tests as specified in MIL-H-38534 for RHA level being tested, and meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25“C 15 percent, after exposure. Prior to and during total dose irradiatio

48、n testing, the devices shall be biased to establish a worst case condition as specified in the radiation exposure circuit. For device classes H and K, subgroups 1 and 2 in table V, method 5005 of MIL-STD-883 shall be tested as appropriate for device construct ion. Uhen specified in the purchase orde

49、r or contract, a copy of the RHA delta limits shall be supplied. b. c. It shall d. e. f. g. 5. PACKAGING 5.1 Packasing reauirements. The requirements for packaging shall be in accordance with MIL-H-38534. 5962-94535 SEET 10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5762-94535 9999996